Global Substrate-like PCB (SLP) Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Substrate-like PCB (SLP) market size was valued at US$ 2937 million in 2024 and is forecast to a readjusted size of USD 3804 million by 2031 with a CAGR of 3.8% during review period.
Substrate-like PCB is abbreviated as SLP, which belongs to the category of PCB. Compared with HDI, the line width/line spacing of SLP can be shortened to 20/35 microns at the minimum. However, in terms of process, it cannot reach the specifications of IC substrate, and it is between HDI and IC substrate.
From the perspective of downstream applications, the current mainstream of SLP-like substrates is used in consumer electronics, such as smart phones. In terms of substrate-like manufacturing, since the mainstream line width/line spacing is 20-30 microns (Zhen Ding Technology's 25-micron SLP has been mass-produced), SLP is mainly manufactured using MSAP process technology. Compared with HDI, under the same conditions, the number of electronic components carried can reach twice that of HDI.
In terms of market competition, the leading companies of SLP-like substrates are mainly Zhen Ding Technology, Kinsus, Meiko, TTM Technologies, etc. The share of the world's top 5 companies exceeds 65%, and the core companies are mainly distributed in Taiwan, Japan, South Korea and the United States. With its high-density wiring, multi-layer stacking structure and excellent advanced packaging compatibility, SLP technology has successfully met the needs of increasingly miniaturized and high-performance electronic products. With the continuous advancement of technology, SLP technology is moving towards higher density and finer lines. However, compared with IC substrates, there is still a certain gap in the fineness of substrate-like substrates, which to a certain extent limits its price competitiveness in high-end applications such as mobile phones, thereby affecting the improvement of profit levels.
This report is a detailed and comprehensive analysis for global Substrate-like PCB (SLP) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Substrate-like PCB (SLP) market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031
Global Substrate-like PCB (SLP) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031
Global Substrate-like PCB (SLP) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031
Global Substrate-like PCB (SLP) market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sqm), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Substrate-like PCB (SLP)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Substrate-like PCB (SLP) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Zhen Ding Technology, KINSUS, COMPEQ, Daeduck GDS, TTM Technologies, AT＆S, Ibiden, Korea Circuit, Samsung Electro-Mechanics, Meiko, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Substrate-like PCB (SLP) market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
L/S 30μm
L/S 25μm
Others
Market segment by Application
Smart Phone
Other Consumer Electronics
Automotive Electronics
Others
Major players covered
Zhen Ding Technology
KINSUS
COMPEQ
Daeduck GDS
TTM Technologies
AT＆S
Ibiden
Korea Circuit
Samsung Electro-Mechanics
Meiko
Shenzhen Fastprint Circuit Tech
Unimicron
Shenzhen Kinwong Electronic
Leader-Tech Electronics
AKM Meadville
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Substrate-like PCB (SLP) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Substrate-like PCB (SLP), with price, sales quantity, revenue, and global market share of Substrate-like PCB (SLP) from 2020 to 2025.
Chapter 3, the Substrate-like PCB (SLP) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Substrate-like PCB (SLP) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Substrate-like PCB (SLP) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Substrate-like PCB (SLP).
Chapter 14 and 15, to describe Substrate-like PCB (SLP) sales channel, distributors, customers, research findings and conclusion.
Substrate-like PCB is abbreviated as SLP, which belongs to the category of PCB. Compared with HDI, the line width/line spacing of SLP can be shortened to 20/35 microns at the minimum. However, in terms of process, it cannot reach the specifications of IC substrate, and it is between HDI and IC substrate.
From the perspective of downstream applications, the current mainstream of SLP-like substrates is used in consumer electronics, such as smart phones. In terms of substrate-like manufacturing, since the mainstream line width/line spacing is 20-30 microns (Zhen Ding Technology's 25-micron SLP has been mass-produced), SLP is mainly manufactured using MSAP process technology. Compared with HDI, under the same conditions, the number of electronic components carried can reach twice that of HDI.
In terms of market competition, the leading companies of SLP-like substrates are mainly Zhen Ding Technology, Kinsus, Meiko, TTM Technologies, etc. The share of the world's top 5 companies exceeds 65%, and the core companies are mainly distributed in Taiwan, Japan, South Korea and the United States. With its high-density wiring, multi-layer stacking structure and excellent advanced packaging compatibility, SLP technology has successfully met the needs of increasingly miniaturized and high-performance electronic products. With the continuous advancement of technology, SLP technology is moving towards higher density and finer lines. However, compared with IC substrates, there is still a certain gap in the fineness of substrate-like substrates, which to a certain extent limits its price competitiveness in high-end applications such as mobile phones, thereby affecting the improvement of profit levels.
This report is a detailed and comprehensive analysis for global Substrate-like PCB (SLP) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Substrate-like PCB (SLP) market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031
Global Substrate-like PCB (SLP) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031
Global Substrate-like PCB (SLP) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031
Global Substrate-like PCB (SLP) market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sqm), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Substrate-like PCB (SLP)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Substrate-like PCB (SLP) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Zhen Ding Technology, KINSUS, COMPEQ, Daeduck GDS, TTM Technologies, AT＆S, Ibiden, Korea Circuit, Samsung Electro-Mechanics, Meiko, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Substrate-like PCB (SLP) market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
L/S 30μm
L/S 25μm
Others
Market segment by Application
Smart Phone
Other Consumer Electronics
Automotive Electronics
Others
Major players covered
Zhen Ding Technology
KINSUS
COMPEQ
Daeduck GDS
TTM Technologies
AT＆S
Ibiden
Korea Circuit
Samsung Electro-Mechanics
Meiko
Shenzhen Fastprint Circuit Tech
Unimicron
Shenzhen Kinwong Electronic
Leader-Tech Electronics
AKM Meadville
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Substrate-like PCB (SLP) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Substrate-like PCB (SLP), with price, sales quantity, revenue, and global market share of Substrate-like PCB (SLP) from 2020 to 2025.
Chapter 3, the Substrate-like PCB (SLP) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Substrate-like PCB (SLP) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Substrate-like PCB (SLP) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Substrate-like PCB (SLP).
Chapter 14 and 15, to describe Substrate-like PCB (SLP) sales channel, distributors, customers, research findings and conclusion.
Table of Contents
111 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Substrate-like PCB (SLP) by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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