Global Solder Paste Inspection (SPI) System Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Solder Paste Inspection (SPI) System market size was valued at US$ 338 million in 2024 and is forecast to a readjusted size of USD 568 million by 2031 with a CAGR of 7.8% during review period.

Solder paste inspection (SPI) is a critical process in the electronics manufacturing industry, ensuring the quality and reliability of printed circuit boards (PCBs) before they proceed to the soldering stage. Solder paste inspection is a process used in the assembly of electronic circuit boards. It involves checking the solder paste deposits on PCBs for volume, area, height, and misalignment before the components are placed and reflow soldering is performed. This inspection is typically carried out using automated optical inspection (AOI) systems or 3D inspection technologies. Solder Paste Inspection is a pivotal step in the PCB Assembly Process, especially in industries where precision and reliability are non-negotiable. It not only enhances the quality of the final product but also serves as a cost-saving measure by reducing the need for rework. As electronics continue to evolve and miniaturize, the role of SPI in maintaining manufacturing standards becomes even more significant.

The solder paste inspection (SPI) system market is in a stage of rapid development, driven by the increasing demand for high precision and high reliability in the electronics manufacturing industry. With the rise of emerging markets such as smartphones, automotive electronics, and IoT devices, manufacturers are paying more and more attention to the quality of solder paste printing, which has led to the continuous expansion of the application scope of SPI systems. Currently, many companies are adopting advanced inspection technologies such as 3D imaging and automated analysis to improve production efficiency and reduce defect rates. Looking to the future, with the continuous advancement of technology and the improvement of industry standards, SPI systems are expected to be used in a wider range of fields, and the market prospects are broad.

Global key players of Solder Paste Inspection (SPI) System include Koh Young, Test Research, Inc (TRI), Sinic-Tek Vision Technology, CKD Corporation, Nordson Corporation, etc. The top five players hold a share about 61%. Asia-Pacific is the world's largest market for Solder Paste Inspection (SPI) System and holds a share about 54%, followed by Americas and Europe, with share about 25% and 17%, separately. In terms of product type, In-line SPI is the largest segment, accounting for a share about 92%. In terms of application, Consumer Electronics is the largest field with a share about 29 percent.

This report is a detailed and comprehensive analysis for global Solder Paste Inspection (SPI) System market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Solder Paste Inspection (SPI) System market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031

Global Solder Paste Inspection (SPI) System market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031

Global Solder Paste Inspection (SPI) System market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031

Global Solder Paste Inspection (SPI) System market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Solder Paste Inspection (SPI) System

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Solder Paste Inspection (SPI) System market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Koh Young, Test Research, Inc (TRI), Sinic-Tek Vision Technology, CKD Corporation, Nordson Corporation, SAKI Corporation, Shenzhen JT Automation Equipment, Viscom AG, Mycronic (Vi TECHNOLOGY), MIRTEC CO., LTD., etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Solder Paste Inspection (SPI) System market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
In-line SPI
Off-line SPI

Market segment by Application
Automotive Electronics
Consumer Electronics
Industrials
Semiconductor
Others

Major players covered
Koh Young
Test Research, Inc (TRI)
Sinic-Tek Vision Technology
CKD Corporation
Nordson Corporation
SAKI Corporation
Shenzhen JT Automation Equipment
Viscom AG
Mycronic (Vi TECHNOLOGY)
MIRTEC CO., LTD.
PARMI Corp
Shenzhen ZhenHuaXing
Pemtron
ASC International
ViTrox
JUTZE Intelligence Technology
Jet Technology
Caltex Scientific
MEK Marantz Electronics
Shenzhen Chonvo Intelligence

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Solder Paste Inspection (SPI) System product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Solder Paste Inspection (SPI) System, with price, sales quantity, revenue, and global market share of Solder Paste Inspection (SPI) System from 2020 to 2025.

Chapter 3, the Solder Paste Inspection (SPI) System competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Solder Paste Inspection (SPI) System breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Solder Paste Inspection (SPI) System market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Solder Paste Inspection (SPI) System.

Chapter 14 and 15, to describe Solder Paste Inspection (SPI) System sales channel, distributors, customers, research findings and conclusion.