
Global Solder Materials Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Solder Materials market size was valued at US$ 9489 million in 2024 and is forecast to a readjusted size of USD 12360 million by 2031 with a CAGR of 3.9% during review period.
Soldering is the process of joining metallic surfaces together using a hot metal filler. In electronics, it is used to secure individual components to circuit boards. Solder material is a key element in any form of electronics construction where soldering is undertaken. It provides a mechanical and electrical joint that is essential to keep components in place once a circuit has been assembled. While the mechanical strength is important, it is also necessary to ensure that the soldered joint provides a good electrical connection is made between the two connections that require joining. This can only be achieved satisfactorily if the medium, i.e. the solder joining the two conducts electricity well.
Global key players of Solder Materials include MacDermid Alpha, Senju Metal Industry, Yunnan Tin, AIM Metals & Alloys, Shenmao Technology, etc. The top five players hold a share about 21%. China is the world's largest market for Solder Materials and holds a share about 59%, followed by North America and Europe, with share about 10% and 10%, separately. In terms of product type, Solder Wires is the largest segment, accounting for a share about 45%. In terms of application, Consumer Electronics is the largest field with a share about 59 percent.
This report is a detailed and comprehensive analysis for global Solder Materials market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Solder Materials market size and forecasts, in consumption value ($ Million), sales quantity (K MT), and average selling prices (USD/MT), 2020-2031
Global Solder Materials market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K MT), and average selling prices (USD/MT), 2020-2031
Global Solder Materials market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K MT), and average selling prices (USD/MT), 2020-2031
Global Solder Materials market shares of main players, shipments in revenue ($ Million), sales quantity (K MT), and ASP (USD/MT), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Solder Materials
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Solder Materials market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Alpha Assembly Solutions, Senju Metal Industry, AIM Metals & Alloys, Qualitek International, KOKI, Indium Corporation, Balver Zinn, Heraeus, Nihon Superior, Nihon Handa, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Solder Materials market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Solder Wires
Solder Bars
Solder Paste
Preformed Solder
Flux
Others
Market segment by Application
Consumer Electronics
Automotive
Industrial
Medical
Others
Major players covered
Alpha Assembly Solutions
Senju Metal Industry
AIM Metals & Alloys
Qualitek International
KOKI
Indium Corporation
Balver Zinn
Heraeus
Nihon Superior
Nihon Handa
Nihon Almit
Harima
DKL Metals
Koki Products
Tamura Corp
PT TIMAH (Persero) Tbk
Hybrid Metals
Persang Alloy Industries
Yunnan Tin
Yik Shing Tat Industrial
Shenmao Technology
Anson Solder
Shengdao Tin
Hangzhou Youbang
Shaoxing Tianlong Tin Materials
Zhejiang Asia-welding
QLG
Tongfang Tech
Shenzhen Fitech
Inventec
ISHIKAWA-Metal
KAWADA
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Solder Materials product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Solder Materials, with price, sales quantity, revenue, and global market share of Solder Materials from 2020 to 2025.
Chapter 3, the Solder Materials competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Solder Materials breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Solder Materials market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Solder Materials.
Chapter 14 and 15, to describe Solder Materials sales channel, distributors, customers, research findings and conclusion.
Soldering is the process of joining metallic surfaces together using a hot metal filler. In electronics, it is used to secure individual components to circuit boards. Solder material is a key element in any form of electronics construction where soldering is undertaken. It provides a mechanical and electrical joint that is essential to keep components in place once a circuit has been assembled. While the mechanical strength is important, it is also necessary to ensure that the soldered joint provides a good electrical connection is made between the two connections that require joining. This can only be achieved satisfactorily if the medium, i.e. the solder joining the two conducts electricity well.
Global key players of Solder Materials include MacDermid Alpha, Senju Metal Industry, Yunnan Tin, AIM Metals & Alloys, Shenmao Technology, etc. The top five players hold a share about 21%. China is the world's largest market for Solder Materials and holds a share about 59%, followed by North America and Europe, with share about 10% and 10%, separately. In terms of product type, Solder Wires is the largest segment, accounting for a share about 45%. In terms of application, Consumer Electronics is the largest field with a share about 59 percent.
This report is a detailed and comprehensive analysis for global Solder Materials market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Solder Materials market size and forecasts, in consumption value ($ Million), sales quantity (K MT), and average selling prices (USD/MT), 2020-2031
Global Solder Materials market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K MT), and average selling prices (USD/MT), 2020-2031
Global Solder Materials market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K MT), and average selling prices (USD/MT), 2020-2031
Global Solder Materials market shares of main players, shipments in revenue ($ Million), sales quantity (K MT), and ASP (USD/MT), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Solder Materials
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Solder Materials market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Alpha Assembly Solutions, Senju Metal Industry, AIM Metals & Alloys, Qualitek International, KOKI, Indium Corporation, Balver Zinn, Heraeus, Nihon Superior, Nihon Handa, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Solder Materials market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Solder Wires
Solder Bars
Solder Paste
Preformed Solder
Flux
Others
Market segment by Application
Consumer Electronics
Automotive
Industrial
Medical
Others
Major players covered
Alpha Assembly Solutions
Senju Metal Industry
AIM Metals & Alloys
Qualitek International
KOKI
Indium Corporation
Balver Zinn
Heraeus
Nihon Superior
Nihon Handa
Nihon Almit
Harima
DKL Metals
Koki Products
Tamura Corp
PT TIMAH (Persero) Tbk
Hybrid Metals
Persang Alloy Industries
Yunnan Tin
Yik Shing Tat Industrial
Shenmao Technology
Anson Solder
Shengdao Tin
Hangzhou Youbang
Shaoxing Tianlong Tin Materials
Zhejiang Asia-welding
QLG
Tongfang Tech
Shenzhen Fitech
Inventec
ISHIKAWA-Metal
KAWADA
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Solder Materials product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Solder Materials, with price, sales quantity, revenue, and global market share of Solder Materials from 2020 to 2025.
Chapter 3, the Solder Materials competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Solder Materials breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Solder Materials market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Solder Materials.
Chapter 14 and 15, to describe Solder Materials sales channel, distributors, customers, research findings and conclusion.
Table of Contents
210 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Solder Materials by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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