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Global Silver Powder and Paste for Electronic Components Supply, Demand and Key Producers, 2026-2032

Publisher GlobalInfoResearch
Published Jan 16, 2026
Length 133 Pages
SKU # GFSH20744620

Description

The global Silver Powder and Paste for Electronic Components market size is expected to reach $ 738 million by 2032, rising at a market growth of 2.1% CAGR during the forecast period (2026-2032).

The key manufacturers of Silver Powder and Paste for Electronic Components in the world are Shoei Chemical, Heraeus, CNMC Ningxia Orient Group, Mitsui Kinzoku, Changgui Metal Powder, Kunming Noble Metal Electronic Materials, Fukuda and Tongling Nonferrous Metals Group Holding, among which the market share of the top five manufacturers is more than 50%, and the largest manufacturer is Shoei Chemical. The production of silver powder and paste for electronic components in the world is mainly distributed in North America, Europe, China and Japan, among which the top three production regions account for more than 70% of the market share, and China is currently the largest production region. For its products, the growth rate of product with the average particle size is less than 1.0 μm is relatively fast, and the market share of the average particle size is 1.0 μm to 5.0 μm is the highest, more than 50%, followed by the average particle size greater than 5.0 μm products. In terms of its application, IC is the largest field of application, with a market share of nearly 50%, followed by capacitors, resistors and thin membrane switch.

This report studies the global Silver Powder and Paste for Electronic Components production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Silver Powder and Paste for Electronic Components and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Silver Powder and Paste for Electronic Components that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global Silver Powder and Paste for Electronic Components total production and demand, 2021-2032, (Tons)

Global Silver Powder and Paste for Electronic Components total production value, 2021-2032, (USD Million)

Global Silver Powder and Paste for Electronic Components production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Tons), (based on production site)

Global Silver Powder and Paste for Electronic Components consumption by region & country, CAGR, 2021-2032 & (Tons)

U.S. VS China: Silver Powder and Paste for Electronic Components domestic production, consumption, key domestic manufacturers and share

Global Silver Powder and Paste for Electronic Components production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Tons)

Global Silver Powder and Paste for Electronic Components production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Tons)

Global Silver Powder and Paste for Electronic Components production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Tons)

This report profiles key players in the global Silver Powder and Paste for Electronic Components market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Shoei Chemical, Heraeus, CNMC Ningxia Orient Group, Mitsui Kinzoku, Changgui Metal Powder, Kunming Noble Metal Electronic Materials, Fukuda, Tongling Nonferrous Metals Group Holding, Ningbo Jingxin Electronic Material, Ames Goldsmith, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Silver Powder and Paste for Electronic Components market

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Tons) and average price (US$/Ton) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.

Global Silver Powder and Paste for Electronic Components Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Silver Powder and Paste for Electronic Components Market, Segmentation by Type:
Average Particle Size: Below 1.0 μm
Average Particle Size: 1.0 μm-5.0 μm
Average Particle Size: Above 5.0 μm

Global Silver Powder and Paste for Electronic Components Market, Segmentation by Application:
IC
Capacitor
Resistor
Membrane Switch
Ohers

Companies Profiled:
Shoei Chemical
Heraeus
CNMC Ningxia Orient Group
Mitsui Kinzoku
Changgui Metal Powder
Kunming Noble Metal Electronic Materials
Fukuda
Tongling Nonferrous Metals Group Holding
Ningbo Jingxin Electronic Material
Ames Goldsmith
Shin Nihon Kakin
Technic
AG PRO Technology
Jiangsu Boqian New Materials Stock
Ling Guang

Key Questions Answered:

1. How big is the global Silver Powder and Paste for Electronic Components market?

2. What is the demand of the global Silver Powder and Paste for Electronic Components market?

3. What is the year over year growth of the global Silver Powder and Paste for Electronic Components market?

4. What is the production and production value of the global Silver Powder and Paste for Electronic Components market?

5. Who are the key producers in the global Silver Powder and Paste for Electronic Components market?

6. What are the growth factors driving the market demand?

Table of Contents

133 Pages
1 Supply Summary
2 Demand Summary
3 World Manufacturers Competitive Analysis
4 United States VS China VS Rest of the World
5 Market Analysis by Type
6 Market Analysis by Application
7 Company Profiles
8 Industry Chain Analysis
9 Research Findings and Conclusion
10 Appendix
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