Global Silver Powder and Paste for Electronic Components Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Silver Powder and Paste for Electronic Components market size was valued at US$ 628 million in 2024 and is forecast to a readjusted size of USD 724 million by 2031 with a CAGR of 2.1% during review period.
The key manufacturers of Silver Powder and Paste for Electronic Components in the world are Shoei Chemical, Heraeus, CNMC Ningxia Orient Group, Mitsui Kinzoku, Changgui Metal Powder, Kunming Noble Metal Electronic Materials, Fukuda and Tongling Nonferrous Metals Group Holding, among which the market share of the top five manufacturers is more than 50%, and the largest manufacturer is Shoei Chemical. The production of silver powder and paste for electronic components in the world is mainly distributed in North America, Europe, China and Japan, among which the top three production regions account for more than 70% of the market share, and China is currently the largest production region. For its products, the growth rate of product with the average particle size is less than 1.0 μm is relatively fast, and the market share of the average particle size is 1.0 μm to 5.0 μm is the highest, more than 50%, followed by the average particle size greater than 5.0 μm products. In terms of its application, IC is the largest field of application, with a market share of nearly 50%, followed by capacitors, resistors and thin membrane switch.
This report is a detailed and comprehensive analysis for global Silver Powder and Paste for Electronic Components market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Silver Powder and Paste for Electronic Components market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Silver Powder and Paste for Electronic Components market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Silver Powder and Paste for Electronic Components market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Silver Powder and Paste for Electronic Components market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Silver Powder and Paste for Electronic Components
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Silver Powder and Paste for Electronic Components market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Shoei Chemical, Heraeus, CNMC Ningxia Orient Group, Mitsui Kinzoku, Changgui Metal Powder, Kunming Noble Metal Electronic Materials, Fukuda, Tongling Nonferrous Metals Group Holding, Ningbo Jingxin Electronic Material, Ames Goldsmith, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Silver Powder and Paste for Electronic Components market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Average Particle Size: Below 1.0 μm
Average Particle Size: 1.0 μm-5.0 μm
Average Particle Size: Above 5.0 μm
Market segment by Application
IC
Capacitor
Resistor
Membrane Switch
Ohers
Major players covered
Shoei Chemical
Heraeus
CNMC Ningxia Orient Group
Mitsui Kinzoku
Changgui Metal Powder
Kunming Noble Metal Electronic Materials
Fukuda
Tongling Nonferrous Metals Group Holding
Ningbo Jingxin Electronic Material
Ames Goldsmith
Shin Nihon Kakin
Technic
AG PRO Technology
Jiangsu Boqian New Materials Stock
Ling Guang
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Silver Powder and Paste for Electronic Components product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Silver Powder and Paste for Electronic Components, with price, sales quantity, revenue, and global market share of Silver Powder and Paste for Electronic Components from 2020 to 2025.
Chapter 3, the Silver Powder and Paste for Electronic Components competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Silver Powder and Paste for Electronic Components breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Silver Powder and Paste for Electronic Components market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Silver Powder and Paste for Electronic Components.
Chapter 14 and 15, to describe Silver Powder and Paste for Electronic Components sales channel, distributors, customers, research findings and conclusion.
The key manufacturers of Silver Powder and Paste for Electronic Components in the world are Shoei Chemical, Heraeus, CNMC Ningxia Orient Group, Mitsui Kinzoku, Changgui Metal Powder, Kunming Noble Metal Electronic Materials, Fukuda and Tongling Nonferrous Metals Group Holding, among which the market share of the top five manufacturers is more than 50%, and the largest manufacturer is Shoei Chemical. The production of silver powder and paste for electronic components in the world is mainly distributed in North America, Europe, China and Japan, among which the top three production regions account for more than 70% of the market share, and China is currently the largest production region. For its products, the growth rate of product with the average particle size is less than 1.0 μm is relatively fast, and the market share of the average particle size is 1.0 μm to 5.0 μm is the highest, more than 50%, followed by the average particle size greater than 5.0 μm products. In terms of its application, IC is the largest field of application, with a market share of nearly 50%, followed by capacitors, resistors and thin membrane switch.
This report is a detailed and comprehensive analysis for global Silver Powder and Paste for Electronic Components market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Silver Powder and Paste for Electronic Components market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Silver Powder and Paste for Electronic Components market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Silver Powder and Paste for Electronic Components market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Silver Powder and Paste for Electronic Components market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Silver Powder and Paste for Electronic Components
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Silver Powder and Paste for Electronic Components market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Shoei Chemical, Heraeus, CNMC Ningxia Orient Group, Mitsui Kinzoku, Changgui Metal Powder, Kunming Noble Metal Electronic Materials, Fukuda, Tongling Nonferrous Metals Group Holding, Ningbo Jingxin Electronic Material, Ames Goldsmith, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Silver Powder and Paste for Electronic Components market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Average Particle Size: Below 1.0 μm
Average Particle Size: 1.0 μm-5.0 μm
Average Particle Size: Above 5.0 μm
Market segment by Application
IC
Capacitor
Resistor
Membrane Switch
Ohers
Major players covered
Shoei Chemical
Heraeus
CNMC Ningxia Orient Group
Mitsui Kinzoku
Changgui Metal Powder
Kunming Noble Metal Electronic Materials
Fukuda
Tongling Nonferrous Metals Group Holding
Ningbo Jingxin Electronic Material
Ames Goldsmith
Shin Nihon Kakin
Technic
AG PRO Technology
Jiangsu Boqian New Materials Stock
Ling Guang
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Silver Powder and Paste for Electronic Components product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Silver Powder and Paste for Electronic Components, with price, sales quantity, revenue, and global market share of Silver Powder and Paste for Electronic Components from 2020 to 2025.
Chapter 3, the Silver Powder and Paste for Electronic Components competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Silver Powder and Paste for Electronic Components breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Silver Powder and Paste for Electronic Components market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Silver Powder and Paste for Electronic Components.
Chapter 14 and 15, to describe Silver Powder and Paste for Electronic Components sales channel, distributors, customers, research findings and conclusion.
Table of Contents
118 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Silver Powder and Paste for Electronic Components by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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