Global SiN AMB Substrate Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032
Description
According to our (Global Info Research) latest study, the global SiN AMB Substrate market size was valued at US$ 584 million in 2025 and is forecast to a readjusted size of US$ 1768 million by 2032 with a CAGR of 17.3% during review period.
Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.
The global key manufacturers of SiN AMB Substrates include Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials, etc. In 2023, the global top eight players had a share approximately 85% in terms of revenue.
Currently the SiN AMB Substrates are mainly produced in Japan, Germany and China, which account for 27.3%, 24.56% and 43.5% of the market share respectively in 2023. It is expected that China's production share will reach 57% in 2030. As NGK Electronics Devices and Ferrotec have started or built factories to produce AMB in Malaysia, Southeast Asia is expected to play an important role as a production base in the next few years.
This report is a detailed and comprehensive analysis for global SiN AMB Substrate market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Substrate Thicknesses and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global SiN AMB Substrate market size and forecasts, in consumption value ($ Million), sales quantity (Square Meters), and average selling prices (US$/Square Meter), 2021-2032
Global SiN AMB Substrate market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Square Meters), and average selling prices (US$/Square Meter), 2021-2032
Global SiN AMB Substrate market size and forecasts, by Substrate Thicknesses and by Application, in consumption value ($ Million), sales quantity (Square Meters), and average selling prices (US$/Square Meter), 2021-2032
Global SiN AMB Substrate market shares of main players, shipments in revenue ($ Million), sales quantity (Square Meters), and ASP (US$/Square Meter), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for SiN AMB Substrate
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global SiN AMB Substrate market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Rogers Corporation, Heraeus Electronics, Kyocera, NGK Electronics Devices, Toshiba Materials, Denka, DOWA METALTECH, KCC, Proterial, Mitsubishi Materials, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
SiN AMB Substrate market is split by Substrate Thicknesses and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Substrate Thicknesses, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Substrate Thicknesses
0.32mm SiN AMB Substrates
0.25mm SiN AMB Substrates
Market segment by Application
Automobile
Traction & Railway
New Energy & Power Grid
Military & Aerospace
Others
Major players covered
Rogers Corporation
Heraeus Electronics
Kyocera
NGK Electronics Devices
Toshiba Materials
Denka
DOWA METALTECH
KCC
Proterial
Mitsubishi Materials
Jiangsu Fulehua Semiconductor Technology
BYD
Bomin Electronics
Zhejiang TC Ceramic Electronic
Shengda Tech
Beijing Moshi Technology
Nantong Winspower
Wuxi Tianyang Electronics
Fengpeng Electronics (Zhuhai)
Guangzhou Xianyi Electronic Technology
Fujian Huaqing Electronic Material Technology
Konfoong Materials International
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe SiN AMB Substrate product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of SiN AMB Substrate, with price, sales quantity, revenue, and global market share of SiN AMB Substrate from 2021 to 2026.
Chapter 3, the SiN AMB Substrate competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the SiN AMB Substrate breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Substrate Thicknesses and by Application, with sales market share and growth rate by Substrate Thicknesses, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and SiN AMB Substrate market forecast, by regions, by Substrate Thicknesses, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of SiN AMB Substrate.
Chapter 14 and 15, to describe SiN AMB Substrate sales channel, distributors, customers, research findings and conclusion.
Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.
The global key manufacturers of SiN AMB Substrates include Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials, etc. In 2023, the global top eight players had a share approximately 85% in terms of revenue.
Currently the SiN AMB Substrates are mainly produced in Japan, Germany and China, which account for 27.3%, 24.56% and 43.5% of the market share respectively in 2023. It is expected that China's production share will reach 57% in 2030. As NGK Electronics Devices and Ferrotec have started or built factories to produce AMB in Malaysia, Southeast Asia is expected to play an important role as a production base in the next few years.
This report is a detailed and comprehensive analysis for global SiN AMB Substrate market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Substrate Thicknesses and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global SiN AMB Substrate market size and forecasts, in consumption value ($ Million), sales quantity (Square Meters), and average selling prices (US$/Square Meter), 2021-2032
Global SiN AMB Substrate market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Square Meters), and average selling prices (US$/Square Meter), 2021-2032
Global SiN AMB Substrate market size and forecasts, by Substrate Thicknesses and by Application, in consumption value ($ Million), sales quantity (Square Meters), and average selling prices (US$/Square Meter), 2021-2032
Global SiN AMB Substrate market shares of main players, shipments in revenue ($ Million), sales quantity (Square Meters), and ASP (US$/Square Meter), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for SiN AMB Substrate
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global SiN AMB Substrate market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Rogers Corporation, Heraeus Electronics, Kyocera, NGK Electronics Devices, Toshiba Materials, Denka, DOWA METALTECH, KCC, Proterial, Mitsubishi Materials, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
SiN AMB Substrate market is split by Substrate Thicknesses and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Substrate Thicknesses, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Substrate Thicknesses
0.32mm SiN AMB Substrates
0.25mm SiN AMB Substrates
Market segment by Application
Automobile
Traction & Railway
New Energy & Power Grid
Military & Aerospace
Others
Major players covered
Rogers Corporation
Heraeus Electronics
Kyocera
NGK Electronics Devices
Toshiba Materials
Denka
DOWA METALTECH
KCC
Proterial
Mitsubishi Materials
Jiangsu Fulehua Semiconductor Technology
BYD
Bomin Electronics
Zhejiang TC Ceramic Electronic
Shengda Tech
Beijing Moshi Technology
Nantong Winspower
Wuxi Tianyang Electronics
Fengpeng Electronics (Zhuhai)
Guangzhou Xianyi Electronic Technology
Fujian Huaqing Electronic Material Technology
Konfoong Materials International
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe SiN AMB Substrate product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of SiN AMB Substrate, with price, sales quantity, revenue, and global market share of SiN AMB Substrate from 2021 to 2026.
Chapter 3, the SiN AMB Substrate competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the SiN AMB Substrate breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Substrate Thicknesses and by Application, with sales market share and growth rate by Substrate Thicknesses, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and SiN AMB Substrate market forecast, by regions, by Substrate Thicknesses, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of SiN AMB Substrate.
Chapter 14 and 15, to describe SiN AMB Substrate sales channel, distributors, customers, research findings and conclusion.
Table of Contents
156 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: SiN AMB Substrate by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Substrate Thicknesses
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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