Global SiC Wafer Thinning Equipment Supply, Demand and Key Producers, 2026-2032
Description
The global SiC Wafer Thinning Equipment market size is expected to reach $ 393 million by 2032, rising at a market growth of 16.7% CAGR during the forecast period (2026-2032).
Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
This report only studies Silicon Carbide Wafer Thinning Equipment.
The global SiC Wafer Thinning Equipment market is witnessing significant growth, driven by the increasing demand for semiconductors in various industries such as consumer electronics, automotive, and telecommunications. The Asia-Pacific region remains the largest consumer market, accounting for over 60% of the global market share. This trend is expected to continue due to the region's strong semiconductor industry, technological advancements, and growing demand for energy-efficient power devices.
The global key manufacturers of SiC Wafer Thinning Equipment include Disco, TSD, etc. In 2023, the global top five players had a share approximately 81% in terms of revenue.
Among different types of SiC wafer thinning equipment, fully automated systems dominate the market, capturing approximately 77% of the total share in 2024. This reflects the industry's growing demand for precision, scalability, and high-efficiency production processes. Fully automated equipment provides improved throughput and minimizes the risk of human error, making it the preferred choice for manufacturers aiming to scale their operations and ensure high-quality output.
Interms of applications, wafers sized 6 inches and below are the primary demand drivers. These smaller wafers make up approximately 70% of the market in 2024. The widespread use of smaller wafers in power electronics and semiconductor devices, particularly in electric vehicles and renewable energy applications, supports this demand. As SiC continues to gain traction in the power semiconductor sector, the demand for wafer thinning equipment for smaller wafer sizes is expected to increase.
Market Driving Factors
Expansion of the Electric Vehicle (EV) Market: SiC materials are particularly suitable for use in power modules for electric vehicles (EVs) due to their superior thermal conductivity and high voltage tolerance. With the rapid growth of the electric vehicle market, the demand for SiC wafers is increasing, which in turn drives the demand for wafer thinning equipment.
Advances in Energy Conversion and Storage Technologies: In high-efficiency energy conversion and storage fields, such as solar inverters and battery management systems, the use of SiC materials can significantly improve efficiency. The market's demand for high-performance components has driven the production and thinning of SiC wafers.
Demand for 5G and High-Frequency Electronics: The demand for SiC materials is rising in 5G networks and other high-frequency electronic devices due to SiC's excellent performance in high-frequency and high-power applications. This has led to an increase in the demand for SiC wafer production and processing equipment.
Market Restraints
Process Complexity: The wafer thinning process for SiC wafers involves high-precision techniques and is technically challenging. The instability of the process may lead to quality issues, affecting market confidence.
Intensifying Competition: As the SiC market rapidly develops, more companies are entering the field, and market competition is becoming increasingly intense. This may lead to price wars and margin compression.
Technological Iteration: With the fast pace of technological updates, the introduction of new technologies and equipment may quickly render existing equipment obsolete. Companies need to continue investing in research and development to maintain competitiveness.
This report studies the global SiC Wafer Thinning Equipment production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for SiC Wafer Thinning Equipment and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of SiC Wafer Thinning Equipment that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global SiC Wafer Thinning Equipment total production and demand, 2021-2032, (Units)
Global SiC Wafer Thinning Equipment total production value, 2021-2032, (USD Million)
Global SiC Wafer Thinning Equipment production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)
Global SiC Wafer Thinning Equipment consumption by region & country, CAGR, 2021-2032 & (Units)
U.S. VS China: SiC Wafer Thinning Equipment domestic production, consumption, key domestic manufacturers and share
Global SiC Wafer Thinning Equipment production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)
Global SiC Wafer Thinning Equipment production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)
Global SiC Wafer Thinning Equipment production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)
This report profiles key players in the global SiC Wafer Thinning Equipment market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TSD, TOKYO SEIMITSU, Engis Corporation, Okamoto Semiconductor Equipment Division, Revasum, Koyo Machinery, G&N, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World SiC Wafer Thinning Equipment market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global SiC Wafer Thinning Equipment Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global SiC Wafer Thinning Equipment Market, Segmentation by Type:
Full-Automatic
Semi-Automatic
Global SiC Wafer Thinning Equipment Market, Segmentation by Application:
6 Inch and Below
8 Inch and Above
Companies Profiled:
Disco
TSD
TOKYO SEIMITSU
Engis Corporation
Okamoto Semiconductor Equipment Division
Revasum
Koyo Machinery
G&N
Key Questions Answered:
1. How big is the global SiC Wafer Thinning Equipment market?
2. What is the demand of the global SiC Wafer Thinning Equipment market?
3. What is the year over year growth of the global SiC Wafer Thinning Equipment market?
4. What is the production and production value of the global SiC Wafer Thinning Equipment market?
5. Who are the key producers in the global SiC Wafer Thinning Equipment market?
6. What are the growth factors driving the market demand?
Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
This report only studies Silicon Carbide Wafer Thinning Equipment.
The global SiC Wafer Thinning Equipment market is witnessing significant growth, driven by the increasing demand for semiconductors in various industries such as consumer electronics, automotive, and telecommunications. The Asia-Pacific region remains the largest consumer market, accounting for over 60% of the global market share. This trend is expected to continue due to the region's strong semiconductor industry, technological advancements, and growing demand for energy-efficient power devices.
The global key manufacturers of SiC Wafer Thinning Equipment include Disco, TSD, etc. In 2023, the global top five players had a share approximately 81% in terms of revenue.
Among different types of SiC wafer thinning equipment, fully automated systems dominate the market, capturing approximately 77% of the total share in 2024. This reflects the industry's growing demand for precision, scalability, and high-efficiency production processes. Fully automated equipment provides improved throughput and minimizes the risk of human error, making it the preferred choice for manufacturers aiming to scale their operations and ensure high-quality output.
Interms of applications, wafers sized 6 inches and below are the primary demand drivers. These smaller wafers make up approximately 70% of the market in 2024. The widespread use of smaller wafers in power electronics and semiconductor devices, particularly in electric vehicles and renewable energy applications, supports this demand. As SiC continues to gain traction in the power semiconductor sector, the demand for wafer thinning equipment for smaller wafer sizes is expected to increase.
Market Driving Factors
Expansion of the Electric Vehicle (EV) Market: SiC materials are particularly suitable for use in power modules for electric vehicles (EVs) due to their superior thermal conductivity and high voltage tolerance. With the rapid growth of the electric vehicle market, the demand for SiC wafers is increasing, which in turn drives the demand for wafer thinning equipment.
Advances in Energy Conversion and Storage Technologies: In high-efficiency energy conversion and storage fields, such as solar inverters and battery management systems, the use of SiC materials can significantly improve efficiency. The market's demand for high-performance components has driven the production and thinning of SiC wafers.
Demand for 5G and High-Frequency Electronics: The demand for SiC materials is rising in 5G networks and other high-frequency electronic devices due to SiC's excellent performance in high-frequency and high-power applications. This has led to an increase in the demand for SiC wafer production and processing equipment.
Market Restraints
Process Complexity: The wafer thinning process for SiC wafers involves high-precision techniques and is technically challenging. The instability of the process may lead to quality issues, affecting market confidence.
Intensifying Competition: As the SiC market rapidly develops, more companies are entering the field, and market competition is becoming increasingly intense. This may lead to price wars and margin compression.
Technological Iteration: With the fast pace of technological updates, the introduction of new technologies and equipment may quickly render existing equipment obsolete. Companies need to continue investing in research and development to maintain competitiveness.
This report studies the global SiC Wafer Thinning Equipment production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for SiC Wafer Thinning Equipment and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of SiC Wafer Thinning Equipment that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global SiC Wafer Thinning Equipment total production and demand, 2021-2032, (Units)
Global SiC Wafer Thinning Equipment total production value, 2021-2032, (USD Million)
Global SiC Wafer Thinning Equipment production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)
Global SiC Wafer Thinning Equipment consumption by region & country, CAGR, 2021-2032 & (Units)
U.S. VS China: SiC Wafer Thinning Equipment domestic production, consumption, key domestic manufacturers and share
Global SiC Wafer Thinning Equipment production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)
Global SiC Wafer Thinning Equipment production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)
Global SiC Wafer Thinning Equipment production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)
This report profiles key players in the global SiC Wafer Thinning Equipment market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TSD, TOKYO SEIMITSU, Engis Corporation, Okamoto Semiconductor Equipment Division, Revasum, Koyo Machinery, G&N, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World SiC Wafer Thinning Equipment market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global SiC Wafer Thinning Equipment Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global SiC Wafer Thinning Equipment Market, Segmentation by Type:
Full-Automatic
Semi-Automatic
Global SiC Wafer Thinning Equipment Market, Segmentation by Application:
6 Inch and Below
8 Inch and Above
Companies Profiled:
Disco
TSD
TOKYO SEIMITSU
Engis Corporation
Okamoto Semiconductor Equipment Division
Revasum
Koyo Machinery
G&N
Key Questions Answered:
1. How big is the global SiC Wafer Thinning Equipment market?
2. What is the demand of the global SiC Wafer Thinning Equipment market?
3. What is the year over year growth of the global SiC Wafer Thinning Equipment market?
4. What is the production and production value of the global SiC Wafer Thinning Equipment market?
5. Who are the key producers in the global SiC Wafer Thinning Equipment market?
6. What are the growth factors driving the market demand?
Table of Contents
97 Pages
- 1 Supply Summary
- 2 Demand Summary
- 3 World Manufacturers Competitive Analysis
- 4 United States VS China VS Rest of the World
- 5 Market Analysis by Type
- 6 Market Analysis by Application
- 7 Company Profiles
- 8 Industry Chain Analysis
- 9 Research Findings and Conclusion
- 10 Appendix
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