Global SiC Polishing Consumables Supply, Demand and Key Producers, 2026-2032
Description
The global SiC Polishing Consumables market size is expected to reach $ 558 million by 2032, rising at a market growth of 19.1% CAGR during the forecast period (2026-2032).
Silicon Carbide (SiC) is a wide band gap semiconductor that can operate at higher temperature, power level, and voltage. This enables improved energy efficiency in power devices, LED lighting, and telecommunications. Because of its unique properties, SiC is the material of choice for diverse applications such as Hybrid Electric vehicles, power electronic switches, and LED lighting technology.
This report studies the SiC Polishing Consumables, include the SiC CMP Slurry and SiC CMP Pad.
The global key players of SiC polishing consumables include DuPont, Entegris, Fujimi Corporation, Saint-Gobain, Fujibo and Shanghai Xinanna, etc. In 2024, the global top four players occupied for a share approximately 82% in terms of revenue.
The key players of SiC CMP slurry include Entegris, Fujimi Corporation, Saint-Gobain, and Shanghai Xinanna, etc. In 2024, the global top three players occupied for a share approximately 82.4% in terms of revenue.
The key players of SiC CMP pads include DuPont, Entegris, and Fujibo, etc. DuPont is domaing the global SiC CMP pads market, holds a share over 75%.
The market for silicon carbide (SiC) chemical mechanical polishing (CMP) consumables, including slurries and pads, is at a pivotal stage, reflecting the rapid growth of the SiC wafer industry itself. Currently, the market is highly concentrated, with a small number of key players dominating the supply chain. Entegris and Fujimi Corporation are the established leaders in SiC CMP slurries, leveraging their deep expertise in materials science to develop proprietary formulations that meet the stringent demands of SiC polishing. Similarly, DuPont and Fujibo hold a commanding position in the SiC CMP pads market. This limited number of suppliers, while ensuring high quality and performance, also presents a potential bottleneck for future capacity expansion. Most of the market activity today is focused on 6-inch SiC wafers, which have become the industry standard for power electronics and are critical for the automotive and energy sectors. However, there is a nascent but growing demand for 8-inch wafers, which promises economies of scale and is a key focus for leading SiC manufacturers like Wolfspeed and STMicroelectronics. The performance of these consumables directly impacts the final device yield and quality, making their development a critical path item for the entire SiC ecosystem.
Several powerful trends are acting as tailwinds for the SiC CMP consumables market. First and foremost is the accelerated adoption of SiC in electric vehicles (EVs). SiC power devices are crucial for EV inverters, on-board chargers, and DC-DC converters due to their superior efficiency, power density, and thermal conductivity compared to traditional silicon-based solutions. As EV production scales up globally, so does the demand for SiC wafers and, by extension, the consumables used to polish them. Second, the global push for renewable energy is a significant driver. SiC components are essential for solar inverters and wind turbine systems, where they help maximize energy conversion efficiency. The third factor is the transition from 6-inch to 8-inch wafers. This shift is driven by the semiconductor industry’s constant quest for lower costs per die. As major SiC manufacturers invest heavily in 8-inch fabrication lines, the demand for high-performance CMP slurries and pads specifically optimized for these larger wafers will surge. This transition will require significant R&D investment from consumables suppliers to address new technical challenges related to polishing uniformity and defectivity on larger substrates.
Despite the robust growth drivers, the SiC CMP consumables industry faces significant challenges. The primary obstacle is the extreme hardness and chemical inertness of SiC, which makes polishing an inherently difficult and slow process. This necessitates the use of abrasive slurries and durable pads that are both effective and cost-effective. Developing new formulations that can achieve higher material removal rates (MRR) while minimizing surface defects remains a major technical hurdle. A second major challenge is the high cost and limited supply of raw materials, particularly the specialized abrasives and chemicals used in slurries. The concentrated nature of the market could also be a point of concern, as it could lead to potential supply chain vulnerabilities if a key supplier faces production issues. Furthermore, the lack of a standardized polishing process across different SiC device manufacturers adds complexity. Each manufacturer has its own proprietary recipes, requiring consumables suppliers to develop a wide range of products or work closely with individual customers on tailored solutions. This fragmentation can slow down the overall maturation of the industry and hinder the development of universal, high-yield polishing processes.
This report studies the global SiC Polishing Consumables demand, key companies, and key regions.
This report is a detailed and comprehensive analysis of the world market for SiC Polishing Consumables, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of SiC Polishing Consumables that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global SiC Polishing Consumables total market, 2021-2032, (USD Million)
Global SiC Polishing Consumables total market by region & country, CAGR, 2021-2032, (USD Million)
U.S. VS China: SiC Polishing Consumables total market, key domestic companies, and share, (USD Million)
Global SiC Polishing Consumables revenue by player, revenue and market share 2021-2026, (USD Million)
Global SiC Polishing Consumables total market by Type, CAGR, 2021-2032, (USD Million)
Global SiC Polishing Consumables total market by Wafer Size, CAGR, 2021-2032, (USD Million)
This report profiles major players in the global SiC Polishing Consumables market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DuPont, Fujibo Group, Entegris (CMC Materials), Saint-Gobain, Fujimi Corporation, Shanghai Xinanna Electronic Technology, Vibrantz (Ferro), Beijing Hangtian Saide, Beijing Grish Hitech, Tianjin Helen, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the world SiC Polishing Consumables market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Wafer Size. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global SiC Polishing Consumables Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global SiC Polishing Consumables Market, Segmentation by Type:
SiC CMP Pads
SiC CMP Slurry
Global SiC Polishing Consumables Market, Segmentation by Wafer Size:
8 Inch SiC Wafer
6 Inch SiC Wafer
4 Inch SiC Wafer
Companies Profiled:
DuPont
Fujibo Group
Entegris (CMC Materials)
Saint-Gobain
Fujimi Corporation
Shanghai Xinanna Electronic Technology
Vibrantz (Ferro)
Beijing Hangtian Saide
Beijing Grish Hitech
Tianjin Helen
CHUANYAN
Engis Corporation
Key Questions Answered
1. How big is the global SiC Polishing Consumables market?
2. What is the demand of the global SiC Polishing Consumables market?
3. What is the year over year growth of the global SiC Polishing Consumables market?
4. What is the total value of the global SiC Polishing Consumables market?
5. Who are the Major Players in the global SiC Polishing Consumables market?
6. What are the growth factors driving the market demand?
Silicon Carbide (SiC) is a wide band gap semiconductor that can operate at higher temperature, power level, and voltage. This enables improved energy efficiency in power devices, LED lighting, and telecommunications. Because of its unique properties, SiC is the material of choice for diverse applications such as Hybrid Electric vehicles, power electronic switches, and LED lighting technology.
This report studies the SiC Polishing Consumables, include the SiC CMP Slurry and SiC CMP Pad.
The global key players of SiC polishing consumables include DuPont, Entegris, Fujimi Corporation, Saint-Gobain, Fujibo and Shanghai Xinanna, etc. In 2024, the global top four players occupied for a share approximately 82% in terms of revenue.
The key players of SiC CMP slurry include Entegris, Fujimi Corporation, Saint-Gobain, and Shanghai Xinanna, etc. In 2024, the global top three players occupied for a share approximately 82.4% in terms of revenue.
The key players of SiC CMP pads include DuPont, Entegris, and Fujibo, etc. DuPont is domaing the global SiC CMP pads market, holds a share over 75%.
The market for silicon carbide (SiC) chemical mechanical polishing (CMP) consumables, including slurries and pads, is at a pivotal stage, reflecting the rapid growth of the SiC wafer industry itself. Currently, the market is highly concentrated, with a small number of key players dominating the supply chain. Entegris and Fujimi Corporation are the established leaders in SiC CMP slurries, leveraging their deep expertise in materials science to develop proprietary formulations that meet the stringent demands of SiC polishing. Similarly, DuPont and Fujibo hold a commanding position in the SiC CMP pads market. This limited number of suppliers, while ensuring high quality and performance, also presents a potential bottleneck for future capacity expansion. Most of the market activity today is focused on 6-inch SiC wafers, which have become the industry standard for power electronics and are critical for the automotive and energy sectors. However, there is a nascent but growing demand for 8-inch wafers, which promises economies of scale and is a key focus for leading SiC manufacturers like Wolfspeed and STMicroelectronics. The performance of these consumables directly impacts the final device yield and quality, making their development a critical path item for the entire SiC ecosystem.
Several powerful trends are acting as tailwinds for the SiC CMP consumables market. First and foremost is the accelerated adoption of SiC in electric vehicles (EVs). SiC power devices are crucial for EV inverters, on-board chargers, and DC-DC converters due to their superior efficiency, power density, and thermal conductivity compared to traditional silicon-based solutions. As EV production scales up globally, so does the demand for SiC wafers and, by extension, the consumables used to polish them. Second, the global push for renewable energy is a significant driver. SiC components are essential for solar inverters and wind turbine systems, where they help maximize energy conversion efficiency. The third factor is the transition from 6-inch to 8-inch wafers. This shift is driven by the semiconductor industry’s constant quest for lower costs per die. As major SiC manufacturers invest heavily in 8-inch fabrication lines, the demand for high-performance CMP slurries and pads specifically optimized for these larger wafers will surge. This transition will require significant R&D investment from consumables suppliers to address new technical challenges related to polishing uniformity and defectivity on larger substrates.
Despite the robust growth drivers, the SiC CMP consumables industry faces significant challenges. The primary obstacle is the extreme hardness and chemical inertness of SiC, which makes polishing an inherently difficult and slow process. This necessitates the use of abrasive slurries and durable pads that are both effective and cost-effective. Developing new formulations that can achieve higher material removal rates (MRR) while minimizing surface defects remains a major technical hurdle. A second major challenge is the high cost and limited supply of raw materials, particularly the specialized abrasives and chemicals used in slurries. The concentrated nature of the market could also be a point of concern, as it could lead to potential supply chain vulnerabilities if a key supplier faces production issues. Furthermore, the lack of a standardized polishing process across different SiC device manufacturers adds complexity. Each manufacturer has its own proprietary recipes, requiring consumables suppliers to develop a wide range of products or work closely with individual customers on tailored solutions. This fragmentation can slow down the overall maturation of the industry and hinder the development of universal, high-yield polishing processes.
This report studies the global SiC Polishing Consumables demand, key companies, and key regions.
This report is a detailed and comprehensive analysis of the world market for SiC Polishing Consumables, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of SiC Polishing Consumables that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global SiC Polishing Consumables total market, 2021-2032, (USD Million)
Global SiC Polishing Consumables total market by region & country, CAGR, 2021-2032, (USD Million)
U.S. VS China: SiC Polishing Consumables total market, key domestic companies, and share, (USD Million)
Global SiC Polishing Consumables revenue by player, revenue and market share 2021-2026, (USD Million)
Global SiC Polishing Consumables total market by Type, CAGR, 2021-2032, (USD Million)
Global SiC Polishing Consumables total market by Wafer Size, CAGR, 2021-2032, (USD Million)
This report profiles major players in the global SiC Polishing Consumables market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DuPont, Fujibo Group, Entegris (CMC Materials), Saint-Gobain, Fujimi Corporation, Shanghai Xinanna Electronic Technology, Vibrantz (Ferro), Beijing Hangtian Saide, Beijing Grish Hitech, Tianjin Helen, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the world SiC Polishing Consumables market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Wafer Size. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global SiC Polishing Consumables Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global SiC Polishing Consumables Market, Segmentation by Type:
SiC CMP Pads
SiC CMP Slurry
Global SiC Polishing Consumables Market, Segmentation by Wafer Size:
8 Inch SiC Wafer
6 Inch SiC Wafer
4 Inch SiC Wafer
Companies Profiled:
DuPont
Fujibo Group
Entegris (CMC Materials)
Saint-Gobain
Fujimi Corporation
Shanghai Xinanna Electronic Technology
Vibrantz (Ferro)
Beijing Hangtian Saide
Beijing Grish Hitech
Tianjin Helen
CHUANYAN
Engis Corporation
Key Questions Answered
1. How big is the global SiC Polishing Consumables market?
2. What is the demand of the global SiC Polishing Consumables market?
3. What is the year over year growth of the global SiC Polishing Consumables market?
4. What is the total value of the global SiC Polishing Consumables market?
5. Who are the Major Players in the global SiC Polishing Consumables market?
6. What are the growth factors driving the market demand?
Table of Contents
129 Pages
- 1 Supply Summary
- 2 Demand Summary
- 3 World SiC Polishing Consumables Companies Competitive Analysis
- 4 United States VS China VS Rest of World (by Headquarter Location)
- 5 Market Analysis by Type
- 6 Market Analysis by Wafer Size
- 7 Company Profiles
- 8 Industry Chain Analysis
- 9 Research Findings and Conclusion
- 10 Appendix
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