Global Semiconductor Underfill Supply, Demand and Key Producers, 2026-2032
Description
The global Semiconductor Underfill market size is expected to reach $ 1606 million by 2032, rising at a market growth of 10.3% CAGR during the forecast period (2026-2032).
According to market research, the global output of semiconductor underfill in 2024 is estimated to be approximately 250–300 tons. Prices vary significantly depending on product specifications, with an overall price range of $2,500–3,000 per kilogram.
Semiconductor underfill is a type of material used to fill the gap between the chip and the substrate in semiconductor packaging. Its primary purpose is to enhance the mechanical strength and thermal shock resistance of semiconductor packages. Typically composed of resin, hardeners, and fillers, underfill materials infiltrate the gap between the chip and substrate and form a robust network structure during thermal curing. As semiconductor technology continues to advance, particularly with increasing integration, the demand for packaging technology has grown significantly, and underfill materials, as a key component in packaging, are seeing a rising demand.
In recent years, the rapid development of sectors like 5G communication, the Internet of Things (IoT), and automotive electronics has spurred growth in the semiconductor industry, driving innovation in packaging technologies. In particular, underfill materials play a critical role in enhancing packaging reliability, extending service life, and improving thermal management, driven by the demands for miniaturization, high frequency, and low power consumption. As a result, the underfill market holds promising potential, with major semiconductor packaging companies increasing their research and development efforts to drive market growth.
The semiconductor underfill market is experiencing unprecedented opportunities, particularly with the fast growth of industries such as 5G, IoT, and automotive electronics. As the demand for high-performance, highly reliable semiconductor packaging continues to rise, underfill materials, an essential part of the packaging process, significantly contribute to improving the reliability and stability of semiconductor packages. Additionally, advancements in underfill material technologies, along with the introduction of new materials and technologies, are enhancing the market competitiveness of underfill materials.
Despite its promising market outlook, the semiconductor underfill industry faces several challenges. On one hand, the materials and processing technologies for underfill are still developing, leading to high research and development costs. On the other hand, there is a broad range of products introduced by various manufacturers, with varying levels of product performance and quality, leading to intense market competition. Additionally, fluctuations in raw material prices and the complexity of the production process may pose risks to the industry's growth.
With the rise of industries such as 5G, automotive electronics, and artificial intelligence, downstream demand for semiconductor packaging is becoming more diverse. In these applications, the demand for high-performance, highly reliable, and low-power packaging technologies is increasing, which is driving the growth of the semiconductor underfill market. In particular, the need for better thermal management and signal integrity is making the demand for underfill materials more diversified, and this trend is expected to continue, sustaining growth in the field in the future.
This report studies the global Semiconductor Underfill production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Semiconductor Underfill and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Semiconductor Underfill that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Semiconductor Underfill total production and demand, 2021-2032, (Tons)
Global Semiconductor Underfill total production value, 2021-2032, (USD Million)
Global Semiconductor Underfill production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Tons), (based on production site)
Global Semiconductor Underfill consumption by region & country, CAGR, 2021-2032 & (Tons)
U.S. VS China: Semiconductor Underfill domestic production, consumption, key domestic manufacturers and share
Global Semiconductor Underfill production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Tons)
Global Semiconductor Underfill production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Tons)
Global Semiconductor Underfill production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Tons)
This report profiles key players in the global Semiconductor Underfill market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, NAMICS Corporation, Panasonic Lexcm, Resonac (Showa Denko), Hanstars, Shin-Etsu Chemical, MacDermid Alpha, ThreeBond, Parker LORD, Nagase ChemteX, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Semiconductor Underfill market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Tons) and average price (US$/kg) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Semiconductor Underfill Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Semiconductor Underfill Market, Segmentation by Type:
Wafer and Panel-Level Underfill
Board-Level Underfill
Global Semiconductor Underfill Market, Segmentation by Flowability:
CUF
NCF
Global Semiconductor Underfill Market, Segmentation by Material Type:
Epoxy-based Underfill
Polyurethane-based Underfill
Silicone-based Underfill
Global Semiconductor Underfill Market, Segmentation by Curing Method:
Thermal Cured Underfill
UV Cured Underfill
Global Semiconductor Underfill Market, Segmentation by Application:
Industrial Electronics
Consumer Electronics
Automotive Electronics
Others
Companies Profiled:
Henkel
NAMICS Corporation
Panasonic Lexcm
Resonac (Showa Denko)
Hanstars
Shin-Etsu Chemical
MacDermid Alpha
ThreeBond
Parker LORD
Nagase ChemteX
Bondline
AIM Solder
Zymet
Panacol-Elosol GmbH
Dover
Darbond Technology
Yantai Hightite Chemicals
Sunstar
DeepMaterial
SINY
GTA Material
H.B.Fuller
Fuji Chemical
United Adhesives
Asec Co.,Ltd.
Key Questions Answered:
1. How big is the global Semiconductor Underfill market?
2. What is the demand of the global Semiconductor Underfill market?
3. What is the year over year growth of the global Semiconductor Underfill market?
4. What is the production and production value of the global Semiconductor Underfill market?
5. Who are the key producers in the global Semiconductor Underfill market?
6. What are the growth factors driving the market demand?
According to market research, the global output of semiconductor underfill in 2024 is estimated to be approximately 250–300 tons. Prices vary significantly depending on product specifications, with an overall price range of $2,500–3,000 per kilogram.
Semiconductor underfill is a type of material used to fill the gap between the chip and the substrate in semiconductor packaging. Its primary purpose is to enhance the mechanical strength and thermal shock resistance of semiconductor packages. Typically composed of resin, hardeners, and fillers, underfill materials infiltrate the gap between the chip and substrate and form a robust network structure during thermal curing. As semiconductor technology continues to advance, particularly with increasing integration, the demand for packaging technology has grown significantly, and underfill materials, as a key component in packaging, are seeing a rising demand.
In recent years, the rapid development of sectors like 5G communication, the Internet of Things (IoT), and automotive electronics has spurred growth in the semiconductor industry, driving innovation in packaging technologies. In particular, underfill materials play a critical role in enhancing packaging reliability, extending service life, and improving thermal management, driven by the demands for miniaturization, high frequency, and low power consumption. As a result, the underfill market holds promising potential, with major semiconductor packaging companies increasing their research and development efforts to drive market growth.
The semiconductor underfill market is experiencing unprecedented opportunities, particularly with the fast growth of industries such as 5G, IoT, and automotive electronics. As the demand for high-performance, highly reliable semiconductor packaging continues to rise, underfill materials, an essential part of the packaging process, significantly contribute to improving the reliability and stability of semiconductor packages. Additionally, advancements in underfill material technologies, along with the introduction of new materials and technologies, are enhancing the market competitiveness of underfill materials.
Despite its promising market outlook, the semiconductor underfill industry faces several challenges. On one hand, the materials and processing technologies for underfill are still developing, leading to high research and development costs. On the other hand, there is a broad range of products introduced by various manufacturers, with varying levels of product performance and quality, leading to intense market competition. Additionally, fluctuations in raw material prices and the complexity of the production process may pose risks to the industry's growth.
With the rise of industries such as 5G, automotive electronics, and artificial intelligence, downstream demand for semiconductor packaging is becoming more diverse. In these applications, the demand for high-performance, highly reliable, and low-power packaging technologies is increasing, which is driving the growth of the semiconductor underfill market. In particular, the need for better thermal management and signal integrity is making the demand for underfill materials more diversified, and this trend is expected to continue, sustaining growth in the field in the future.
This report studies the global Semiconductor Underfill production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Semiconductor Underfill and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Semiconductor Underfill that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Semiconductor Underfill total production and demand, 2021-2032, (Tons)
Global Semiconductor Underfill total production value, 2021-2032, (USD Million)
Global Semiconductor Underfill production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Tons), (based on production site)
Global Semiconductor Underfill consumption by region & country, CAGR, 2021-2032 & (Tons)
U.S. VS China: Semiconductor Underfill domestic production, consumption, key domestic manufacturers and share
Global Semiconductor Underfill production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Tons)
Global Semiconductor Underfill production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Tons)
Global Semiconductor Underfill production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Tons)
This report profiles key players in the global Semiconductor Underfill market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, NAMICS Corporation, Panasonic Lexcm, Resonac (Showa Denko), Hanstars, Shin-Etsu Chemical, MacDermid Alpha, ThreeBond, Parker LORD, Nagase ChemteX, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Semiconductor Underfill market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Tons) and average price (US$/kg) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Semiconductor Underfill Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Semiconductor Underfill Market, Segmentation by Type:
Wafer and Panel-Level Underfill
Board-Level Underfill
Global Semiconductor Underfill Market, Segmentation by Flowability:
CUF
NCF
Global Semiconductor Underfill Market, Segmentation by Material Type:
Epoxy-based Underfill
Polyurethane-based Underfill
Silicone-based Underfill
Global Semiconductor Underfill Market, Segmentation by Curing Method:
Thermal Cured Underfill
UV Cured Underfill
Global Semiconductor Underfill Market, Segmentation by Application:
Industrial Electronics
Consumer Electronics
Automotive Electronics
Others
Companies Profiled:
Henkel
NAMICS Corporation
Panasonic Lexcm
Resonac (Showa Denko)
Hanstars
Shin-Etsu Chemical
MacDermid Alpha
ThreeBond
Parker LORD
Nagase ChemteX
Bondline
AIM Solder
Zymet
Panacol-Elosol GmbH
Dover
Darbond Technology
Yantai Hightite Chemicals
Sunstar
DeepMaterial
SINY
GTA Material
H.B.Fuller
Fuji Chemical
United Adhesives
Asec Co.,Ltd.
Key Questions Answered:
1. How big is the global Semiconductor Underfill market?
2. What is the demand of the global Semiconductor Underfill market?
3. What is the year over year growth of the global Semiconductor Underfill market?
4. What is the production and production value of the global Semiconductor Underfill market?
5. Who are the key producers in the global Semiconductor Underfill market?
6. What are the growth factors driving the market demand?
Table of Contents
162 Pages
- 1 Supply Summary
- 2 Demand Summary
- 3 World Manufacturers Competitive Analysis
- 4 United States VS China VS Rest of the World
- 5 Market Analysis by Type
- 6 Market Analysis by Flowability
- 7 Market Analysis by Material Type
- 8 Market Analysis by Curing Method
- 9 Market Analysis by Application
- 10 Company Profiles
- 11 Industry Chain Analysis
- 12 Research Findings and Conclusion
- 13 Appendix
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