Global Semiconductor Parts Cleaning Supply, Demand and Key Producers, 2026-2032
Description
The global Semiconductor Parts Cleaning market size is expected to reach $ 1612 million by 2032, rising at a market growth of 6.2% CAGR during the forecast period (2026-2032).
Semiconductor chamber parts cleaning lagged behind the "Ultra-Clean Revolution" which is central in discussing all other semiconductor process inputs (i.e., gases, chemicals and silicon). Every other semiconductor process input has a Certificate of Analysis (COA)─even new parts. However, recycled chamber part cleanliness varies significantly in particle levels and atomic level contamination. This is partly because standard practice used the tools themselves to perform the final cleaning of the parts. Verifying cleanliness targets was achieved by using many test wafers, expensive wafer metrology and wasted production time. Cleaning is a process to remove contaminants such as particles and ionic impurities of equipment parts generated during customers' process.
This report studies the precision cleaning services for semiconductor chamber parts, include the used parts and new parts of ALD, CVD, PVD, Etch, diffusion, Ion Implantation, Lithography, and quartz, etc for fabs and OEMs.
The North America market for Cleaning for Semiconductor Equipment Parts is estimated to increase from $ 104.86 million in 2024 to reach $ 155.27 million by 2031, at a CAGR of 5.66% during the forecast period of 2025 through 2031.
China Mainland market for Cleaning for Semiconductor Equipment Parts is estimated to increase from $ 225.43 million in 2024 to reach $ 397.89 million by 2031, at a CAGR of 7.92% during the forecast period of 2025 through 2031.
South Korea market for Cleaning for Semiconductor Equipment Parts is estimated to increase from $ 205.39 million in 2024 to reach $ 311.37 million by 2031, at a CAGR of 6.14% during the forecast period of 2025 through 2031.
China Taiwan market for Cleaning for Semiconductor Equipment Parts is estimated to increase from $ 254.16 million in 2024 to reach $ 372.78 million by 2031, at a CAGR of 5.89% during the forecast period of 2025 through 2031.
Currently the 300mm equipment parts are the largest application, holds a share about 65.6 % in 2024. The 200mm market is driven by the demand from car chips, MEMS, sensors, power semiconductor devices. The 150mm market is mainly driven by demand from silicon carbide (SiC) devices. Last few years, the demand from semiconductor refurbished equipment also drives the growth of precision cleaning, especially in China market.
Currently Etching is the largest application, has a share about 41.7%, followed by Thin Film (CVD/PVD), and Diffusion.
The key players of cleaning service are mainly located in USA, Germany, Japan, South Korea, China Taiwan, Singapore and China Mainland. The global top 5 players hold a share about 44.4%, while top 10 players occupied nearly 72 percent.
Currently, in the United States, the key players are UCT (Ultra Clean Holdings, Inc), Pentagon Technologies, Enpro Industries, Mitsubishi Chemical (Cleanpart), Persys Group, MSR-FSR LLC and KoMiCo (USA division).
In South Korea players include KoMiCo, Cinos, Hansol IONES, WONIK QnC, and DFtech.
In China Taiwan, key players are Shih Her Technology, Frontken (Ares Green Technology Corporation), UCT (Tainan Quantum Technologies), Enpro Industries (LeanTeq), KERTZ HIGH TECH, Hung Jie Technology Corporation, Mitsubishi Chemical Taiwan, HTCSolar and KoMiCo, etc. The China Taiwan IC manufacturing is driven by demand from High Performance Computing (HPC), Smartphone, Internet of Things, Automotive, and Digital Consumer Electronics, etc. the Incremental demand is especially driven by the HPC chips for AI, data center, servers, 5G smartphones and automotive. TSMC is the largest customer of cleaning services in China Taiwan, and According to its data, In 2024, the TSMC advanced process (16nm to 3nm) revenue occupied for 80%, and is expected to reach over 84% in 2025.
In China mainland market, key players are TOCALO (China division, Kunshan), KoMiCo (China division, KoMiCo Technology (Wuxi) Limited.), Cinos (China division, Xi’an), WONIK QnC (China division, Xi’an), DFtech (China division, Wuxi), Hung Jie Technology Corporation (China division, Nanjing HungJie Semicondutor technology), Ferrotec (Anhui) Technology Development Co., Ltd, Chongqing Genori Technology Co., Ltd and Beijing GRAND HITEK, etc. In future, more Chinese new entrants will enter this market.
The cleaning service for semiconductor equipment parts has evolved into a mission-critical support sector as device geometries scale down to <5nm and front-end tools become increasingly sensitive to trace contamination. Globally, the industry is undergoing:
Outsourcing Growth: Leading IDMs and foundries increasingly outsource cleaning of CVD/ALD reactor parts, etch shields, electrostatic chucks, and gas delivery modules to certified service providers.
Localization Trend: China, and Southeast Asia are establishing localized cleaning centers to support new fab construction and reduce import dependency.
Fab Demand Diversification: Growth in advanced packaging (2.5D/3D), power semiconductors, and compound semiconductors (SiC, GaN) expands the variety and complexity of parts requiring specialized cleaning.
This report studies the global Semiconductor Parts Cleaning demand, key companies, and key regions.
This report is a detailed and comprehensive analysis of the world market for Semiconductor Parts Cleaning, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Semiconductor Parts Cleaning that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Semiconductor Parts Cleaning total market, 2021-2032, (USD Million)
Global Semiconductor Parts Cleaning total market by region & country, CAGR, 2021-2032, (USD Million)
U.S. VS China: Semiconductor Parts Cleaning total market, key domestic companies, and share, (USD Million)
Global Semiconductor Parts Cleaning revenue by player, revenue and market share 2021-2026, (USD Million)
Global Semiconductor Parts Cleaning total market by Equipment Size, CAGR, 2021-2032, (USD Million)
Global Semiconductor Parts Cleaning total market by Equipment Type, CAGR, 2021-2032, (USD Million)
This report profiles major players in the global Semiconductor Parts Cleaning market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include UCT (Ultra Clean Holdings, Inc), Kurita (Pentagon Technologies), Enpro Industries (LeanTeq and NxEdge), TOCALO Co., Ltd., Mitsubishi Chemical (Cleanpart), KoMiCo, Cinos, Hansol IONES, WONIK QnC, Dftech, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the world Semiconductor Parts Cleaning market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Equipment Size, and by Equipment Type. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Semiconductor Parts Cleaning Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Semiconductor Parts Cleaning Market, Segmentation by Equipment Size:
300mm Equipment Parts
200mm Equipment Parts
150mm and Others
Global Semiconductor Parts Cleaning Market, Segmentation by Process Node:
High End / Advanced <14nm
Mid End 18/22/28-90nm
Low End >110nm
Global Semiconductor Parts Cleaning Market, Segmentation by Equipment Type:
Semiconductor Etching Equipment Parts
Semiconductor Thin Film (CVD/PVD)
Lithography Machines
Ion Implant
Diffusion Equipment Parts
CMP Equipment Parts
Others
Companies Profiled:
UCT (Ultra Clean Holdings, Inc)
Kurita (Pentagon Technologies)
Enpro Industries (LeanTeq and NxEdge)
TOCALO Co., Ltd.
Mitsubishi Chemical (Cleanpart)
KoMiCo
Cinos
Hansol IONES
WONIK QnC
Dftech
Frontken Corporation Berhad
KERTZ HIGH TECH
Hung Jie Technology Corporation
Shih Her Technology
HTCSolar
Persys Group
MSR-FSR LLC
Value Engineering Co., Ltd
Neutron Technology Enterprise
Ferrotec (Anhui) Technology Development Co., Ltd
Jiangsu Kaiweitesi Semiconductor Technology Co., Ltd.
HCUT Co., Ltd
Suzhou Ever Distant Technology
Chongqing Genori Technology Co., Ltd
GRAND HITEK
Shibaura Mechatronics
Key Questions Answered
1. How big is the global Semiconductor Parts Cleaning market?
2. What is the demand of the global Semiconductor Parts Cleaning market?
3. What is the year over year growth of the global Semiconductor Parts Cleaning market?
4. What is the total value of the global Semiconductor Parts Cleaning market?
5. Who are the Major Players in the global Semiconductor Parts Cleaning market?
6. What are the growth factors driving the market demand?
Semiconductor chamber parts cleaning lagged behind the "Ultra-Clean Revolution" which is central in discussing all other semiconductor process inputs (i.e., gases, chemicals and silicon). Every other semiconductor process input has a Certificate of Analysis (COA)─even new parts. However, recycled chamber part cleanliness varies significantly in particle levels and atomic level contamination. This is partly because standard practice used the tools themselves to perform the final cleaning of the parts. Verifying cleanliness targets was achieved by using many test wafers, expensive wafer metrology and wasted production time. Cleaning is a process to remove contaminants such as particles and ionic impurities of equipment parts generated during customers' process.
This report studies the precision cleaning services for semiconductor chamber parts, include the used parts and new parts of ALD, CVD, PVD, Etch, diffusion, Ion Implantation, Lithography, and quartz, etc for fabs and OEMs.
The North America market for Cleaning for Semiconductor Equipment Parts is estimated to increase from $ 104.86 million in 2024 to reach $ 155.27 million by 2031, at a CAGR of 5.66% during the forecast period of 2025 through 2031.
China Mainland market for Cleaning for Semiconductor Equipment Parts is estimated to increase from $ 225.43 million in 2024 to reach $ 397.89 million by 2031, at a CAGR of 7.92% during the forecast period of 2025 through 2031.
South Korea market for Cleaning for Semiconductor Equipment Parts is estimated to increase from $ 205.39 million in 2024 to reach $ 311.37 million by 2031, at a CAGR of 6.14% during the forecast period of 2025 through 2031.
China Taiwan market for Cleaning for Semiconductor Equipment Parts is estimated to increase from $ 254.16 million in 2024 to reach $ 372.78 million by 2031, at a CAGR of 5.89% during the forecast period of 2025 through 2031.
Currently the 300mm equipment parts are the largest application, holds a share about 65.6 % in 2024. The 200mm market is driven by the demand from car chips, MEMS, sensors, power semiconductor devices. The 150mm market is mainly driven by demand from silicon carbide (SiC) devices. Last few years, the demand from semiconductor refurbished equipment also drives the growth of precision cleaning, especially in China market.
Currently Etching is the largest application, has a share about 41.7%, followed by Thin Film (CVD/PVD), and Diffusion.
The key players of cleaning service are mainly located in USA, Germany, Japan, South Korea, China Taiwan, Singapore and China Mainland. The global top 5 players hold a share about 44.4%, while top 10 players occupied nearly 72 percent.
Currently, in the United States, the key players are UCT (Ultra Clean Holdings, Inc), Pentagon Technologies, Enpro Industries, Mitsubishi Chemical (Cleanpart), Persys Group, MSR-FSR LLC and KoMiCo (USA division).
In South Korea players include KoMiCo, Cinos, Hansol IONES, WONIK QnC, and DFtech.
In China Taiwan, key players are Shih Her Technology, Frontken (Ares Green Technology Corporation), UCT (Tainan Quantum Technologies), Enpro Industries (LeanTeq), KERTZ HIGH TECH, Hung Jie Technology Corporation, Mitsubishi Chemical Taiwan, HTCSolar and KoMiCo, etc. The China Taiwan IC manufacturing is driven by demand from High Performance Computing (HPC), Smartphone, Internet of Things, Automotive, and Digital Consumer Electronics, etc. the Incremental demand is especially driven by the HPC chips for AI, data center, servers, 5G smartphones and automotive. TSMC is the largest customer of cleaning services in China Taiwan, and According to its data, In 2024, the TSMC advanced process (16nm to 3nm) revenue occupied for 80%, and is expected to reach over 84% in 2025.
In China mainland market, key players are TOCALO (China division, Kunshan), KoMiCo (China division, KoMiCo Technology (Wuxi) Limited.), Cinos (China division, Xi’an), WONIK QnC (China division, Xi’an), DFtech (China division, Wuxi), Hung Jie Technology Corporation (China division, Nanjing HungJie Semicondutor technology), Ferrotec (Anhui) Technology Development Co., Ltd, Chongqing Genori Technology Co., Ltd and Beijing GRAND HITEK, etc. In future, more Chinese new entrants will enter this market.
The cleaning service for semiconductor equipment parts has evolved into a mission-critical support sector as device geometries scale down to <5nm and front-end tools become increasingly sensitive to trace contamination. Globally, the industry is undergoing:
Outsourcing Growth: Leading IDMs and foundries increasingly outsource cleaning of CVD/ALD reactor parts, etch shields, electrostatic chucks, and gas delivery modules to certified service providers.
Localization Trend: China, and Southeast Asia are establishing localized cleaning centers to support new fab construction and reduce import dependency.
Fab Demand Diversification: Growth in advanced packaging (2.5D/3D), power semiconductors, and compound semiconductors (SiC, GaN) expands the variety and complexity of parts requiring specialized cleaning.
This report studies the global Semiconductor Parts Cleaning demand, key companies, and key regions.
This report is a detailed and comprehensive analysis of the world market for Semiconductor Parts Cleaning, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Semiconductor Parts Cleaning that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Semiconductor Parts Cleaning total market, 2021-2032, (USD Million)
Global Semiconductor Parts Cleaning total market by region & country, CAGR, 2021-2032, (USD Million)
U.S. VS China: Semiconductor Parts Cleaning total market, key domestic companies, and share, (USD Million)
Global Semiconductor Parts Cleaning revenue by player, revenue and market share 2021-2026, (USD Million)
Global Semiconductor Parts Cleaning total market by Equipment Size, CAGR, 2021-2032, (USD Million)
Global Semiconductor Parts Cleaning total market by Equipment Type, CAGR, 2021-2032, (USD Million)
This report profiles major players in the global Semiconductor Parts Cleaning market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include UCT (Ultra Clean Holdings, Inc), Kurita (Pentagon Technologies), Enpro Industries (LeanTeq and NxEdge), TOCALO Co., Ltd., Mitsubishi Chemical (Cleanpart), KoMiCo, Cinos, Hansol IONES, WONIK QnC, Dftech, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the world Semiconductor Parts Cleaning market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Equipment Size, and by Equipment Type. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Semiconductor Parts Cleaning Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Semiconductor Parts Cleaning Market, Segmentation by Equipment Size:
300mm Equipment Parts
200mm Equipment Parts
150mm and Others
Global Semiconductor Parts Cleaning Market, Segmentation by Process Node:
High End / Advanced <14nm
Mid End 18/22/28-90nm
Low End >110nm
Global Semiconductor Parts Cleaning Market, Segmentation by Equipment Type:
Semiconductor Etching Equipment Parts
Semiconductor Thin Film (CVD/PVD)
Lithography Machines
Ion Implant
Diffusion Equipment Parts
CMP Equipment Parts
Others
Companies Profiled:
UCT (Ultra Clean Holdings, Inc)
Kurita (Pentagon Technologies)
Enpro Industries (LeanTeq and NxEdge)
TOCALO Co., Ltd.
Mitsubishi Chemical (Cleanpart)
KoMiCo
Cinos
Hansol IONES
WONIK QnC
Dftech
Frontken Corporation Berhad
KERTZ HIGH TECH
Hung Jie Technology Corporation
Shih Her Technology
HTCSolar
Persys Group
MSR-FSR LLC
Value Engineering Co., Ltd
Neutron Technology Enterprise
Ferrotec (Anhui) Technology Development Co., Ltd
Jiangsu Kaiweitesi Semiconductor Technology Co., Ltd.
HCUT Co., Ltd
Suzhou Ever Distant Technology
Chongqing Genori Technology Co., Ltd
GRAND HITEK
Shibaura Mechatronics
Key Questions Answered
1. How big is the global Semiconductor Parts Cleaning market?
2. What is the demand of the global Semiconductor Parts Cleaning market?
3. What is the year over year growth of the global Semiconductor Parts Cleaning market?
4. What is the total value of the global Semiconductor Parts Cleaning market?
5. Who are the Major Players in the global Semiconductor Parts Cleaning market?
6. What are the growth factors driving the market demand?
Table of Contents
186 Pages
- 1 Supply Summary
- 2 Demand Summary
- 3 World Semiconductor Parts Cleaning Companies Competitive Analysis
- 4 United States VS China VS Rest of World (by Headquarter Location)
- 5 Market Analysis by Equipment Size
- 6 Market Analysis by Process Node
- 7 Market Analysis by Equipment Type
- 8 Company Profiles
- 9 Industry Chain Analysis
- 10 Research Findings and Conclusion
- 11 Appendix
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