Global Semiconductor Packaging Materials Supply, Demand and Key Producers, 2026-2032
Description
The global Semiconductor Packaging Materials market size is expected to reach $ 90030 million by 2032, rising at a market growth of 12.7% CAGR during the forecast period (2026-2032).
Semiconductor packaging has four main functions: protection, support, connection and reliability. It protects the chip to operate normally in various environments, supports the chip to facilitate connection with the circuit, and connects the electrode of the chip with the external circuit to form reliability and can Used in various applications. This report focusses on Semiconductor Packaging Materials market.
A semiconductor is a substance that conducts electricity under some but not all circumstances. Manufacturers are able to customize the conductivity of a semiconductor, such as introducing a sensitivity to heat or light, or altering conductivity based on the direction of the current. Semiconductors are an important component of many commonly used electronic devices including smartphones, tablets, and PCs. Notable semiconductor chip makers include Intel and Samsung Electronics, with Intel generating 48.7 billion U.S. dollars and Samsung generating 39.9 billion U.S. dollars in semiconductor revenue in 2023, placing them among the largest companies in terms of semiconductor industry revenues. The semiconductor industry comprises companies that design, fabricate, assemble, test, and supply semiconductors that are suitable for various applications. In 2024, semiconductor sales were expected to reach 611.23 billion U.S. dollars worldwide. Semiconductors are crucial components of electronics devices and the industry is highly competitive. The year-on-year decline rate in 2023 equated to 9.4 percent, although a swift recovery is expected in 2024 with growth of 16 percent. The growing global consumer electronics consumption further supports the market growth. In addition, the development of artificial intelligence (AI), the Internet of Things (IoT), and machine learning (ML) technologies in the new age of electronic systems is generating lucrative market growth opportunities. These technologies assist and enhance memory chip processing time to process large amounts of data in no time. Moreover, the potentially rising demand for faster and more advanced memory chips in data center applications is expected to drive the market growth over the forecast timeline. Global Semiconductor Packaging Materials includes Kyocera, Shinko, and Ibiden, etc. Global top three companies hold a share over 22%.
This report studies the global Semiconductor Packaging Materials demand, key companies, and key regions.
This report is a detailed and comprehensive analysis of the world market for Semiconductor Packaging Materials, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Semiconductor Packaging Materials that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Semiconductor Packaging Materials total market, 2021-2032, (USD Million)
Global Semiconductor Packaging Materials total market by region & country, CAGR, 2021-2032, (USD Million)
U.S. VS China: Semiconductor Packaging Materials total market, key domestic companies, and share, (USD Million)
Global Semiconductor Packaging Materials revenue by player, revenue and market share 2021-2026, (USD Million)
Global Semiconductor Packaging Materials total market by Type, CAGR, 2021-2032, (USD Million)
Global Semiconductor Packaging Materials total market by Application, CAGR, 2021-2032, (USD Million)
This report profiles major players in the global Semiconductor Packaging Materials market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Kyocera, Shinko, Ibiden, LG Innotek, Unimicron Technology, ZhenDing Tech, Semco, KINSUS INTERCONNECT TECHNOLOGY, Nan Ya PCB, Nippon Micrometal Corporation, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the world Semiconductor Packaging Materials market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Semiconductor Packaging Materials Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Semiconductor Packaging Materials Market, Segmentation by Type:
Packaging Substrate
Lead Frame
Bonding Wire
Encapsulating Resin
Ceramic Packaging Material
Chip Bonding Material
Others
Global Semiconductor Packaging Materials Market, Segmentation by Application:
Consume Electrons
Automobiles
Communications
Medical
Others
Companies Profiled:
Kyocera
Shinko
Ibiden
LG Innotek
Unimicron Technology
ZhenDing Tech
Semco
KINSUS INTERCONNECT TECHNOLOGY
Nan Ya PCB
Nippon Micrometal Corporation
Simmtech
Mitsui High-tec, Inc.
HAESUNG
Shin-Etsu
Heraeus
AAMI
Henkel
Shennan Circuits
Kangqiang Electronics
LG Chem
NGK/NTK
MK Electron
Toppan Printing Co., Ltd.
Tanaka
MARUWA
Momentive
SCHOTT
Element Solutions
Hitachi Chemical
Fastprint
Hongchang Electronic
Sumitomo
Key Questions Answered
1. How big is the global Semiconductor Packaging Materials market?
2. What is the demand of the global Semiconductor Packaging Materials market?
3. What is the year over year growth of the global Semiconductor Packaging Materials market?
4. What is the total value of the global Semiconductor Packaging Materials market?
5. Who are the Major Players in the global Semiconductor Packaging Materials market?
6. What are the growth factors driving the market demand?
Semiconductor packaging has four main functions: protection, support, connection and reliability. It protects the chip to operate normally in various environments, supports the chip to facilitate connection with the circuit, and connects the electrode of the chip with the external circuit to form reliability and can Used in various applications. This report focusses on Semiconductor Packaging Materials market.
A semiconductor is a substance that conducts electricity under some but not all circumstances. Manufacturers are able to customize the conductivity of a semiconductor, such as introducing a sensitivity to heat or light, or altering conductivity based on the direction of the current. Semiconductors are an important component of many commonly used electronic devices including smartphones, tablets, and PCs. Notable semiconductor chip makers include Intel and Samsung Electronics, with Intel generating 48.7 billion U.S. dollars and Samsung generating 39.9 billion U.S. dollars in semiconductor revenue in 2023, placing them among the largest companies in terms of semiconductor industry revenues. The semiconductor industry comprises companies that design, fabricate, assemble, test, and supply semiconductors that are suitable for various applications. In 2024, semiconductor sales were expected to reach 611.23 billion U.S. dollars worldwide. Semiconductors are crucial components of electronics devices and the industry is highly competitive. The year-on-year decline rate in 2023 equated to 9.4 percent, although a swift recovery is expected in 2024 with growth of 16 percent. The growing global consumer electronics consumption further supports the market growth. In addition, the development of artificial intelligence (AI), the Internet of Things (IoT), and machine learning (ML) technologies in the new age of electronic systems is generating lucrative market growth opportunities. These technologies assist and enhance memory chip processing time to process large amounts of data in no time. Moreover, the potentially rising demand for faster and more advanced memory chips in data center applications is expected to drive the market growth over the forecast timeline. Global Semiconductor Packaging Materials includes Kyocera, Shinko, and Ibiden, etc. Global top three companies hold a share over 22%.
This report studies the global Semiconductor Packaging Materials demand, key companies, and key regions.
This report is a detailed and comprehensive analysis of the world market for Semiconductor Packaging Materials, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Semiconductor Packaging Materials that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Semiconductor Packaging Materials total market, 2021-2032, (USD Million)
Global Semiconductor Packaging Materials total market by region & country, CAGR, 2021-2032, (USD Million)
U.S. VS China: Semiconductor Packaging Materials total market, key domestic companies, and share, (USD Million)
Global Semiconductor Packaging Materials revenue by player, revenue and market share 2021-2026, (USD Million)
Global Semiconductor Packaging Materials total market by Type, CAGR, 2021-2032, (USD Million)
Global Semiconductor Packaging Materials total market by Application, CAGR, 2021-2032, (USD Million)
This report profiles major players in the global Semiconductor Packaging Materials market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Kyocera, Shinko, Ibiden, LG Innotek, Unimicron Technology, ZhenDing Tech, Semco, KINSUS INTERCONNECT TECHNOLOGY, Nan Ya PCB, Nippon Micrometal Corporation, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the world Semiconductor Packaging Materials market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Semiconductor Packaging Materials Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Semiconductor Packaging Materials Market, Segmentation by Type:
Packaging Substrate
Lead Frame
Bonding Wire
Encapsulating Resin
Ceramic Packaging Material
Chip Bonding Material
Others
Global Semiconductor Packaging Materials Market, Segmentation by Application:
Consume Electrons
Automobiles
Communications
Medical
Others
Companies Profiled:
Kyocera
Shinko
Ibiden
LG Innotek
Unimicron Technology
ZhenDing Tech
Semco
KINSUS INTERCONNECT TECHNOLOGY
Nan Ya PCB
Nippon Micrometal Corporation
Simmtech
Mitsui High-tec, Inc.
HAESUNG
Shin-Etsu
Heraeus
AAMI
Henkel
Shennan Circuits
Kangqiang Electronics
LG Chem
NGK/NTK
MK Electron
Toppan Printing Co., Ltd.
Tanaka
MARUWA
Momentive
SCHOTT
Element Solutions
Hitachi Chemical
Fastprint
Hongchang Electronic
Sumitomo
Key Questions Answered
1. How big is the global Semiconductor Packaging Materials market?
2. What is the demand of the global Semiconductor Packaging Materials market?
3. What is the year over year growth of the global Semiconductor Packaging Materials market?
4. What is the total value of the global Semiconductor Packaging Materials market?
5. Who are the Major Players in the global Semiconductor Packaging Materials market?
6. What are the growth factors driving the market demand?
Table of Contents
202 Pages
- 1 Supply Summary
- 2 Demand Summary
- 3 World Semiconductor Packaging Materials Companies Competitive Analysis
- 4 United States VS China VS Rest of World (by Headquarter Location)
- 5 Market Analysis by Type
- 6 Market Analysis by Application
- 7 Company Profiles
- 8 Industry Chain Analysis
- 9 Research Findings and Conclusion
- 10 Appendix
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