Global Semiconductor Equipment Machined Parts Market 2025 by Company, Regions, Type and Application, Forecast to 2031
Description
According to our latest research, the global Semiconductor Equipment Machined Parts market size will reach USD 32920 million in 2031, growing at a CAGR of 6.0% over the analysis period.
Semiconductor equipment components are the individual parts required during the fabrication of semiconductor tools, designed to meet stringent requirements for materials, structural integrity, process compatibility, precision, reliability, and stability. Mechanical components in particular establish the overall framework and basic structure of the equipment, maintain the controlled wafer reaction environment, and enable specialized functions—thereby ensuring high process yields and extending equipment lifetime. These mechanical parts are further classified into metal parts (the largest share), quartz parts, and ceramic parts. Typical metal mechanical components include reaction chambers, transfer chambers, transition chambers, chamber liners, gas distribution plates, wafer susceptors or trays, cooling plates, machine bases, and cast-steel platforms.
The market for metal mechanical components in semiconductor equipment is highly fragmented, with most suppliers focusing on specific process technologies or part families. For example, Jingjiang Pioneer specializes in precision metal fabrications; Torrance Precision Machines focuses on aluminum-alloy and stainless-steel chambers and shaft components; Jiangfeng Electronics supplies components for PVD, CVD, CMP, and wafer cleaning tools; and Xianfeng Precision concentrates on metal parts for etch and thin-film deposition tools. This segmentation reflects the diversity of component types and the specialized expertise required for each process step, leading to a landscape of niche suppliers rather than a few dominant players.
According to Semiconductor Industry Association (SIA), global semiconductor chip sales hit $627.6 billion in 2024, an increase of 19.1% compared to the 2023 total of $526.8 billion. The global semiconductor market experienced its highest-ever sales year in 2024, topping $600 billion in annual sales for the first time, and double-digit market growth is projected for 2025. Semiconductors enable virtually all modern technologies – including medical devices, communications, defense applications, AI, advanced transportation, and countless others – and the long-term industry outlook is incredibly strong. Regionally, yearly sales were up in the Americas (44.8%), China (18.3%), and Asia Pacific/All Others (12.5%), but down in Japan (-0.4%), and Europe (-8.1%).
Several semiconductor product segments stood out in 2024. Sales of logic products totaled $212.6 billion in 2024, making it the largest product category by sales. Memory products were second in terms of sales, increasing by 78.9% in 2024 to a total of $165.1 billion. DRAM products, a subset of memory, recorded an 82.6% sales increase, the largest percentage growth of any product category in 2024.
The development of Semiconductor Equipment Machined Parts is closely intertwined with the overall trends in semiconductor equipment. As Moore's Law continues to evolve, the precision and efficiency requirements for chip manufacturing have been consistently escalating, driving continuous advancements in semiconductor equipment technology. This technological progress subsequently enables sustained improvements in chip performance and cost reductions, meeting the growing demand for chip products in the digital economy era. In recent years, despite intensified global trade fluctuations, emerging market demands from artificial intelligence, new energy vehicles, and low-altitude economy sectors have maintained strong global demand for wafer fabrication plant construction. It is anticipated that in the coming years, the global semiconductor equipment industry will continue to experience rapid development, which will further propel the advancement of Semiconductor Equipment Machined Parts.
This report is a detailed and comprehensive analysis for global Semiconductor Equipment Machined Parts market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor Equipment Machined Parts market size and forecasts, in consumption value ($ Million), 2020-2031
Global Semiconductor Equipment Machined Parts market size and forecasts by region and country, in consumption value ($ Million), 2020-2031
Global Semiconductor Equipment Machined Parts market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031
Global Semiconductor Equipment Machined Parts market shares of main players, in revenue ($ Million), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor Equipment Machined Parts
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor Equipment Machined Parts market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Fiti Group, VACGEN, N2TECH CO., LTD, Calitech, Marumae Co., Ltd, KSM Co., Ltd, Technetics Semi, EKK Eagle Semicon Components, Inc, VALQUA, LTD., Bellows Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
Semiconductor Equipment Machined Parts market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Semiconductor Equipment Metal Parts
Semiconductor Equipment Ceramic Parts
Semiconductor Equipment Parts
Market segment by Application
Semiconductor Deposition Equipment
Semiconductor Etch Equipment
Lithography Machines
Ion Implant Equipment
Heat Treatment Equipment
CMP Equipment
Wafer Handling
Assembly Equipment
Others
Market segment by players, this report covers
Fiti Group
VACGEN
N2TECH CO., LTD
Calitech
Marumae Co., Ltd
KSM Co., Ltd
Technetics Semi
EKK Eagle Semicon Components, Inc
VALQUA, LTD.
Bellows Technology
AK Tech Co
Senior Flexonics
Shiny Precision CO., LTD
VAT Group AG
Hy-Lok USA, Inc.
Metal-Flex® Welded Bellows, Inc
Ohno Bellows Industry
IRIE KOKEN CO., LTD.
NABELL Corporation
BELLOWS KUZE CO.,LTD.
ANZ Corporation
GST CO.,LTD.
Everfit Technology Co.,Ltd
Sanyue ST co., Ltd
Liaoning SEALTECH Technology
Sprint Precision Technologies Co., Ltd
KFMI
Shenyang Fortune Precision Equipment Co., Ltd
Tolerance Technology (Shanghai)
Duratek Technology Co., Ltd.
IRIE KOKEN
BoBoo
InSource
GNB-KL Group
Kaiser Aluminum (Imperial Machine & Tool)
LACO Technologies
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Semiconductor Equipment Machined Parts product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Semiconductor Equipment Machined Parts, with revenue, gross margin, and global market share of Semiconductor Equipment Machined Parts from 2020 to 2025.
Chapter 3, the Semiconductor Equipment Machined Parts competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Semiconductor Equipment Machined Parts market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Semiconductor Equipment Machined Parts.
Chapter 13, to describe Semiconductor Equipment Machined Parts research findings and conclusion.
Semiconductor equipment components are the individual parts required during the fabrication of semiconductor tools, designed to meet stringent requirements for materials, structural integrity, process compatibility, precision, reliability, and stability. Mechanical components in particular establish the overall framework and basic structure of the equipment, maintain the controlled wafer reaction environment, and enable specialized functions—thereby ensuring high process yields and extending equipment lifetime. These mechanical parts are further classified into metal parts (the largest share), quartz parts, and ceramic parts. Typical metal mechanical components include reaction chambers, transfer chambers, transition chambers, chamber liners, gas distribution plates, wafer susceptors or trays, cooling plates, machine bases, and cast-steel platforms.
The market for metal mechanical components in semiconductor equipment is highly fragmented, with most suppliers focusing on specific process technologies or part families. For example, Jingjiang Pioneer specializes in precision metal fabrications; Torrance Precision Machines focuses on aluminum-alloy and stainless-steel chambers and shaft components; Jiangfeng Electronics supplies components for PVD, CVD, CMP, and wafer cleaning tools; and Xianfeng Precision concentrates on metal parts for etch and thin-film deposition tools. This segmentation reflects the diversity of component types and the specialized expertise required for each process step, leading to a landscape of niche suppliers rather than a few dominant players.
According to Semiconductor Industry Association (SIA), global semiconductor chip sales hit $627.6 billion in 2024, an increase of 19.1% compared to the 2023 total of $526.8 billion. The global semiconductor market experienced its highest-ever sales year in 2024, topping $600 billion in annual sales for the first time, and double-digit market growth is projected for 2025. Semiconductors enable virtually all modern technologies – including medical devices, communications, defense applications, AI, advanced transportation, and countless others – and the long-term industry outlook is incredibly strong. Regionally, yearly sales were up in the Americas (44.8%), China (18.3%), and Asia Pacific/All Others (12.5%), but down in Japan (-0.4%), and Europe (-8.1%).
Several semiconductor product segments stood out in 2024. Sales of logic products totaled $212.6 billion in 2024, making it the largest product category by sales. Memory products were second in terms of sales, increasing by 78.9% in 2024 to a total of $165.1 billion. DRAM products, a subset of memory, recorded an 82.6% sales increase, the largest percentage growth of any product category in 2024.
The development of Semiconductor Equipment Machined Parts is closely intertwined with the overall trends in semiconductor equipment. As Moore's Law continues to evolve, the precision and efficiency requirements for chip manufacturing have been consistently escalating, driving continuous advancements in semiconductor equipment technology. This technological progress subsequently enables sustained improvements in chip performance and cost reductions, meeting the growing demand for chip products in the digital economy era. In recent years, despite intensified global trade fluctuations, emerging market demands from artificial intelligence, new energy vehicles, and low-altitude economy sectors have maintained strong global demand for wafer fabrication plant construction. It is anticipated that in the coming years, the global semiconductor equipment industry will continue to experience rapid development, which will further propel the advancement of Semiconductor Equipment Machined Parts.
This report is a detailed and comprehensive analysis for global Semiconductor Equipment Machined Parts market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor Equipment Machined Parts market size and forecasts, in consumption value ($ Million), 2020-2031
Global Semiconductor Equipment Machined Parts market size and forecasts by region and country, in consumption value ($ Million), 2020-2031
Global Semiconductor Equipment Machined Parts market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031
Global Semiconductor Equipment Machined Parts market shares of main players, in revenue ($ Million), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor Equipment Machined Parts
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor Equipment Machined Parts market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Fiti Group, VACGEN, N2TECH CO., LTD, Calitech, Marumae Co., Ltd, KSM Co., Ltd, Technetics Semi, EKK Eagle Semicon Components, Inc, VALQUA, LTD., Bellows Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
Semiconductor Equipment Machined Parts market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Semiconductor Equipment Metal Parts
Semiconductor Equipment Ceramic Parts
Semiconductor Equipment Parts
Market segment by Application
Semiconductor Deposition Equipment
Semiconductor Etch Equipment
Lithography Machines
Ion Implant Equipment
Heat Treatment Equipment
CMP Equipment
Wafer Handling
Assembly Equipment
Others
Market segment by players, this report covers
Fiti Group
VACGEN
N2TECH CO., LTD
Calitech
Marumae Co., Ltd
KSM Co., Ltd
Technetics Semi
EKK Eagle Semicon Components, Inc
VALQUA, LTD.
Bellows Technology
AK Tech Co
Senior Flexonics
Shiny Precision CO., LTD
VAT Group AG
Hy-Lok USA, Inc.
Metal-Flex® Welded Bellows, Inc
Ohno Bellows Industry
IRIE KOKEN CO., LTD.
NABELL Corporation
BELLOWS KUZE CO.,LTD.
ANZ Corporation
GST CO.,LTD.
Everfit Technology Co.,Ltd
Sanyue ST co., Ltd
Liaoning SEALTECH Technology
Sprint Precision Technologies Co., Ltd
KFMI
Shenyang Fortune Precision Equipment Co., Ltd
Tolerance Technology (Shanghai)
Duratek Technology Co., Ltd.
IRIE KOKEN
BoBoo
InSource
GNB-KL Group
Kaiser Aluminum (Imperial Machine & Tool)
LACO Technologies
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Semiconductor Equipment Machined Parts product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Semiconductor Equipment Machined Parts, with revenue, gross margin, and global market share of Semiconductor Equipment Machined Parts from 2020 to 2025.
Chapter 3, the Semiconductor Equipment Machined Parts competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Semiconductor Equipment Machined Parts market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Semiconductor Equipment Machined Parts.
Chapter 13, to describe Semiconductor Equipment Machined Parts research findings and conclusion.
Table of Contents
214 Pages
- 1 Market Overview
- 2 Company Profiles
- 3 Market Competition, by Players
- 4 Market Size Segment by Type
- 5 Market Size Segment by Application
- 6 North America
- 7 Europe
- 8 Asia-Pacific
- 9 South America
- 10 Middle East & Africa
- 11 Market Dynamics
- 12 Industry Chain Analysis
- 13 Research Findings and Conclusion
- 14 Appendix
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