Global Semiconductor Compression Molding Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Semiconductor Compression Molding Equipment market size was valued at US$ 1467 million in 2024 and is forecast to a readjusted size of USD 2367 million by 2031 with a CAGR of 6.4% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Semiconductor compression molding equipment is a key equipment dedicated to the chip packaging stage. It is mainly used to mold packaging materials such as thermosetting epoxy resin under high temperature and high pressure to package semiconductor components such as chips, power modules, and sensors. Its working principle is to accurately inject resin into the chip cavity through the mold system under heating, and solidify it in a vacuum environment or under the protection of inert gas to achieve sealed protection of the chip. The equipment is suitable for a variety of packaging forms, including QFN, BGA, SOP, DIP, etc., and has the characteristics of high packaging accuracy, high efficiency, and strong adaptability.
Market Trends
As the global semiconductor industry continues to develop towards high integration, miniaturization and high performance, compression molding packaging, as a packaging technology with high reliability, high production capacity and low cost advantages, is being adopted by more and more chip manufacturers, especially in power devices, automotive-grade ICs, MEMS devices and advanced packaging (such as SiP, 3D packaging). At the same time, the development of smart manufacturing and digital factories has also accelerated the upgrading of equipment towards intelligent, remote monitoring and data tracking systems.
Market Disadvantages
The technical barriers of equipment are high. Key links such as core control systems, precision mold manufacturing technology, temperature control and heat equalization technology are mainly controlled by a few equipment giants such as Japan, the United States and South Korea. The technical accumulation of domestic equipment manufacturers is still weak. Packaging customers have extremely high requirements for equipment stability and packaging consistency. The trial and error cost is high and the verification cycle is long. It is difficult for new brand equipment to quickly replace existing mature models.
Market Outlook
Against the background of rapid development in new energy vehicles, 5G communications, the Internet of Things and high-performance computing, the surge in demand for high thermal stability and high mechanical strength packaging solutions will further create market space for high-end compression molding equipment. Equipment technology will evolve towards high-precision mold control, rapid mold change, multi-cavity synchronization, high automation and AI control systems, while promoting collaborative innovation in materials, processes and equipment.
This report is a detailed and comprehensive analysis for global Semiconductor Compression Molding Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor Compression Molding Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Compression Molding Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Compression Molding Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Compression Molding Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor Compression Molding Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor Compression Molding Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include TOWA Corporation, Yamaha Motor Robotics Holdings, Takara Tool & Die, I-PEX, Besi, Shanghai Xinsheng Semiconductor Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Semiconductor Compression Molding Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Semi-automatic Type
Fully Automatic Type
Market segment by Application
Traditional Packaging
Advanced Packaging
Major players covered
TOWA Corporation
Yamaha Motor Robotics Holdings
Takara Tool & Die
I-PEX
Besi
Shanghai Xinsheng Semiconductor Technology
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Compression Molding Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Semiconductor Compression Molding Equipment, with price, sales quantity, revenue, and global market share of Semiconductor Compression Molding Equipment from 2020 to 2025.
Chapter 3, the Semiconductor Compression Molding Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Compression Molding Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Semiconductor Compression Molding Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Compression Molding Equipment.
Chapter 14 and 15, to describe Semiconductor Compression Molding Equipment sales channel, distributors, customers, research findings and conclusion.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Semiconductor compression molding equipment is a key equipment dedicated to the chip packaging stage. It is mainly used to mold packaging materials such as thermosetting epoxy resin under high temperature and high pressure to package semiconductor components such as chips, power modules, and sensors. Its working principle is to accurately inject resin into the chip cavity through the mold system under heating, and solidify it in a vacuum environment or under the protection of inert gas to achieve sealed protection of the chip. The equipment is suitable for a variety of packaging forms, including QFN, BGA, SOP, DIP, etc., and has the characteristics of high packaging accuracy, high efficiency, and strong adaptability.
Market Trends
As the global semiconductor industry continues to develop towards high integration, miniaturization and high performance, compression molding packaging, as a packaging technology with high reliability, high production capacity and low cost advantages, is being adopted by more and more chip manufacturers, especially in power devices, automotive-grade ICs, MEMS devices and advanced packaging (such as SiP, 3D packaging). At the same time, the development of smart manufacturing and digital factories has also accelerated the upgrading of equipment towards intelligent, remote monitoring and data tracking systems.
Market Disadvantages
The technical barriers of equipment are high. Key links such as core control systems, precision mold manufacturing technology, temperature control and heat equalization technology are mainly controlled by a few equipment giants such as Japan, the United States and South Korea. The technical accumulation of domestic equipment manufacturers is still weak. Packaging customers have extremely high requirements for equipment stability and packaging consistency. The trial and error cost is high and the verification cycle is long. It is difficult for new brand equipment to quickly replace existing mature models.
Market Outlook
Against the background of rapid development in new energy vehicles, 5G communications, the Internet of Things and high-performance computing, the surge in demand for high thermal stability and high mechanical strength packaging solutions will further create market space for high-end compression molding equipment. Equipment technology will evolve towards high-precision mold control, rapid mold change, multi-cavity synchronization, high automation and AI control systems, while promoting collaborative innovation in materials, processes and equipment.
This report is a detailed and comprehensive analysis for global Semiconductor Compression Molding Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor Compression Molding Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Compression Molding Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Compression Molding Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Compression Molding Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor Compression Molding Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor Compression Molding Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include TOWA Corporation, Yamaha Motor Robotics Holdings, Takara Tool & Die, I-PEX, Besi, Shanghai Xinsheng Semiconductor Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Semiconductor Compression Molding Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Semi-automatic Type
Fully Automatic Type
Market segment by Application
Traditional Packaging
Advanced Packaging
Major players covered
TOWA Corporation
Yamaha Motor Robotics Holdings
Takara Tool & Die
I-PEX
Besi
Shanghai Xinsheng Semiconductor Technology
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Compression Molding Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Semiconductor Compression Molding Equipment, with price, sales quantity, revenue, and global market share of Semiconductor Compression Molding Equipment from 2020 to 2025.
Chapter 3, the Semiconductor Compression Molding Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Compression Molding Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Semiconductor Compression Molding Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Compression Molding Equipment.
Chapter 14 and 15, to describe Semiconductor Compression Molding Equipment sales channel, distributors, customers, research findings and conclusion.
Table of Contents
89 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Semiconductor Compression Molding Equipment by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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