Global Semiconductor CMP Polishing Pad Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Semiconductor CMP Polishing Pad market size was valued at US$ 1089 million in 2024 and is forecast to a readjusted size of USD 1737 million by 2031 with a CAGR of 7.0% during review period.
Chemical Mechanical Polishing (CMP), a key technology in the integrated circuit manufacturing process, uses both chemical erosion and mechanical force to planarize single-crystal silicon wafers and metal interconnect layers during processing. The semiconductor CMP polishing pad, also known as the chemical mechanical polishing pad, is a critical core material used in the chemical mechanical polishing process. It primarily serves to store the polishing slurry and distribute it evenly across the entire working area of the wafer, ensuring uniform polishing, removing residues generated during the polishing process, transmitting the mechanical energy required for material removal, and maintaining the necessary mechanical and chemical environment throughout the polishing process.
In the CMP process, the selection and use of the polishing pad are crucial for ensuring product quality and improving production efficiency. The appropriate polishing pad must be chosen based on various factors such as the type of silicon wafer material, the size and shape of the abrasive particles, the composition and application method of the polishing slurry, and other parameters. Strict control over these parameters during the polishing process is essential to achieve optimal polishing results.
The CMP polishing pad is an indispensable material in semiconductor manufacturing, and its performance directly affects the quality of the wafer surface. By selecting the appropriate polishing pad and strictly controlling the parameters during the polishing process, high-quality wafer surfaces can be ensured.
Currently, considering cost factors and the impact of silicon wafer size on the performance and efficiency of integrated circuits, the trend towards larger wafer sizes has become an inevitable and mainstream direction. Especially for 8-inch and 12-inch products, there is a possibility of moving towards 18-inch wafers in the future. However, as the size increases, so does the difficulty in producing corresponding CMP pads. As the trend towards larger downstream sizes becomes inevitable, to capture the market, it will be necessary to develop large-sized polishing pads; otherwise, one risks being phased out by the market. With the increasing expectations for superior performance of integrated circuits, the polishing performance of CMP pads must also improve. Therefore, more stringent requirements will be placed on their performance in the future.
From a consumer perspective, South Korea is currently the largest global consumer market, accounting for 23.52% of market revenue share in 2023, followed by mainland China and Taiwan, with shares of 21.71% and 19.02%, respectively. It is projected that China will experience the fastest growth over the next few years, with a CAGR of 9.30% from 2024 to 2030. In the coming years, China may reduce its import volume and rely more on domestic suppliers, although these companies may find it difficult to export. Given that the major consumption regions already have leading global enterprises, Europe might be the first region where Chinese companies can break through. Therefore, in the next few years, domestic Chinese enterprises' products will primarily focus on the domestic market. Additionally, due to current trade frictions and international political factors, this period could be the best opportunity for domestic CMP polishing pad manufacturers to capture the market, with national policy support expected to increase significantly in the coming years. Thus, the next few years present a significant localization opportunity for Chinese enterprises. We predict that Hubei Dinglong Holding Co., Ltd. might proactively lower product prices to aggressively capture market share.
In terms of producers, globally, key vendors of CMP polishing pads include DuPont, Entegris, Hubei Dinglong, Fujibo, and IVT Technologies, among others. In 2023, the top-tier vendors, mainly DuPont and Entegris, accounted for 76% of the market's revenue share; second-tier vendors, including Hubei Dinglong, Fujibo, and others, collectively held 15.84% of the revenue share. The CMP (Chemical Mechanical Polishing) polishing pad industry is currently in a stage of continuous growth, primarily driven by the demand for higher performance and smaller node sizes in semiconductor manufacturing. CMP polishing pads play a critical role in ensuring the precise flatness of the semiconductor wafer surface, especially in advanced node technologies (such as 7nm and 5nm processes), which require even stricter polishing standards. As a foundational, pioneering, and strategic pillar industry crucial to the national economy and social development, the semiconductor industry receives strong support from national and local policies. Among these, the substantial need for localization of core process materials in the semiconductor industry has become a widely recognized consensus, presenting a favorable situation of rapid growth. The dependence on imported semiconductor materials in China is quite high, making the demand for import substitution urgent. Under the combined influence of market demand, technological advancements, and policy incentives, domestic semiconductor material enterprises are showing an accelerated growth trend, with vast potential for development.
Currently, none of the several marketized companies in China have obtained foreign certifications, thus they do not export. Since the main downstream enterprises are concentrated in Japan, Taiwan, South Korea, and Europe and America, and given that, apart from Europe and South Korea, the other regions have significant market positions for their local CMP polishing pad enterprises, domestic Chinese enterprises' products will primarily target the domestic market in the next few years.
This report is a detailed and comprehensive analysis for global Semiconductor CMP Polishing Pad market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor CMP Polishing Pad market size and forecasts, in consumption value ($ Million), sales quantity (K Pcs), and average selling prices (US$/Pcs), 2020-2031
Global Semiconductor CMP Polishing Pad market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Pcs), and average selling prices (US$/Pcs), 2020-2031
Global Semiconductor CMP Polishing Pad market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Pcs), and average selling prices (US$/Pcs), 2020-2031
Global Semiconductor CMP Polishing Pad market shares of main players, shipments in revenue ($ Million), sales quantity (K Pcs), and ASP (US$/Pcs), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor CMP Polishing Pad
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor CMP Polishing Pad market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DuPont, Entegris, Hubei Dinglong, Fujibo, IVT Technologies, SK enpulse, KPX Chemical, TWI Incorporated, 3M, FNS TECH, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Semiconductor CMP Polishing Pad market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Polymer CMP Pad
Non-woven CMP Pad
Composite CMP Pad
Market segment by Application
300 mm Wafer
200 mm Wafer
Others
Major players covered
DuPont
Entegris
Hubei Dinglong
Fujibo
IVT Technologies
SK enpulse
KPX Chemical
TWI Incorporated
3M
FNS TECH
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor CMP Polishing Pad product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Semiconductor CMP Polishing Pad, with price, sales quantity, revenue, and global market share of Semiconductor CMP Polishing Pad from 2020 to 2025.
Chapter 3, the Semiconductor CMP Polishing Pad competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor CMP Polishing Pad breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Semiconductor CMP Polishing Pad market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor CMP Polishing Pad.
Chapter 14 and 15, to describe Semiconductor CMP Polishing Pad sales channel, distributors, customers, research findings and conclusion.
Chemical Mechanical Polishing (CMP), a key technology in the integrated circuit manufacturing process, uses both chemical erosion and mechanical force to planarize single-crystal silicon wafers and metal interconnect layers during processing. The semiconductor CMP polishing pad, also known as the chemical mechanical polishing pad, is a critical core material used in the chemical mechanical polishing process. It primarily serves to store the polishing slurry and distribute it evenly across the entire working area of the wafer, ensuring uniform polishing, removing residues generated during the polishing process, transmitting the mechanical energy required for material removal, and maintaining the necessary mechanical and chemical environment throughout the polishing process.
In the CMP process, the selection and use of the polishing pad are crucial for ensuring product quality and improving production efficiency. The appropriate polishing pad must be chosen based on various factors such as the type of silicon wafer material, the size and shape of the abrasive particles, the composition and application method of the polishing slurry, and other parameters. Strict control over these parameters during the polishing process is essential to achieve optimal polishing results.
The CMP polishing pad is an indispensable material in semiconductor manufacturing, and its performance directly affects the quality of the wafer surface. By selecting the appropriate polishing pad and strictly controlling the parameters during the polishing process, high-quality wafer surfaces can be ensured.
Currently, considering cost factors and the impact of silicon wafer size on the performance and efficiency of integrated circuits, the trend towards larger wafer sizes has become an inevitable and mainstream direction. Especially for 8-inch and 12-inch products, there is a possibility of moving towards 18-inch wafers in the future. However, as the size increases, so does the difficulty in producing corresponding CMP pads. As the trend towards larger downstream sizes becomes inevitable, to capture the market, it will be necessary to develop large-sized polishing pads; otherwise, one risks being phased out by the market. With the increasing expectations for superior performance of integrated circuits, the polishing performance of CMP pads must also improve. Therefore, more stringent requirements will be placed on their performance in the future.
From a consumer perspective, South Korea is currently the largest global consumer market, accounting for 23.52% of market revenue share in 2023, followed by mainland China and Taiwan, with shares of 21.71% and 19.02%, respectively. It is projected that China will experience the fastest growth over the next few years, with a CAGR of 9.30% from 2024 to 2030. In the coming years, China may reduce its import volume and rely more on domestic suppliers, although these companies may find it difficult to export. Given that the major consumption regions already have leading global enterprises, Europe might be the first region where Chinese companies can break through. Therefore, in the next few years, domestic Chinese enterprises' products will primarily focus on the domestic market. Additionally, due to current trade frictions and international political factors, this period could be the best opportunity for domestic CMP polishing pad manufacturers to capture the market, with national policy support expected to increase significantly in the coming years. Thus, the next few years present a significant localization opportunity for Chinese enterprises. We predict that Hubei Dinglong Holding Co., Ltd. might proactively lower product prices to aggressively capture market share.
In terms of producers, globally, key vendors of CMP polishing pads include DuPont, Entegris, Hubei Dinglong, Fujibo, and IVT Technologies, among others. In 2023, the top-tier vendors, mainly DuPont and Entegris, accounted for 76% of the market's revenue share; second-tier vendors, including Hubei Dinglong, Fujibo, and others, collectively held 15.84% of the revenue share. The CMP (Chemical Mechanical Polishing) polishing pad industry is currently in a stage of continuous growth, primarily driven by the demand for higher performance and smaller node sizes in semiconductor manufacturing. CMP polishing pads play a critical role in ensuring the precise flatness of the semiconductor wafer surface, especially in advanced node technologies (such as 7nm and 5nm processes), which require even stricter polishing standards. As a foundational, pioneering, and strategic pillar industry crucial to the national economy and social development, the semiconductor industry receives strong support from national and local policies. Among these, the substantial need for localization of core process materials in the semiconductor industry has become a widely recognized consensus, presenting a favorable situation of rapid growth. The dependence on imported semiconductor materials in China is quite high, making the demand for import substitution urgent. Under the combined influence of market demand, technological advancements, and policy incentives, domestic semiconductor material enterprises are showing an accelerated growth trend, with vast potential for development.
Currently, none of the several marketized companies in China have obtained foreign certifications, thus they do not export. Since the main downstream enterprises are concentrated in Japan, Taiwan, South Korea, and Europe and America, and given that, apart from Europe and South Korea, the other regions have significant market positions for their local CMP polishing pad enterprises, domestic Chinese enterprises' products will primarily target the domestic market in the next few years.
This report is a detailed and comprehensive analysis for global Semiconductor CMP Polishing Pad market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor CMP Polishing Pad market size and forecasts, in consumption value ($ Million), sales quantity (K Pcs), and average selling prices (US$/Pcs), 2020-2031
Global Semiconductor CMP Polishing Pad market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Pcs), and average selling prices (US$/Pcs), 2020-2031
Global Semiconductor CMP Polishing Pad market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Pcs), and average selling prices (US$/Pcs), 2020-2031
Global Semiconductor CMP Polishing Pad market shares of main players, shipments in revenue ($ Million), sales quantity (K Pcs), and ASP (US$/Pcs), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor CMP Polishing Pad
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor CMP Polishing Pad market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DuPont, Entegris, Hubei Dinglong, Fujibo, IVT Technologies, SK enpulse, KPX Chemical, TWI Incorporated, 3M, FNS TECH, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Semiconductor CMP Polishing Pad market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Polymer CMP Pad
Non-woven CMP Pad
Composite CMP Pad
Market segment by Application
300 mm Wafer
200 mm Wafer
Others
Major players covered
DuPont
Entegris
Hubei Dinglong
Fujibo
IVT Technologies
SK enpulse
KPX Chemical
TWI Incorporated
3M
FNS TECH
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor CMP Polishing Pad product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Semiconductor CMP Polishing Pad, with price, sales quantity, revenue, and global market share of Semiconductor CMP Polishing Pad from 2020 to 2025.
Chapter 3, the Semiconductor CMP Polishing Pad competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor CMP Polishing Pad breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Semiconductor CMP Polishing Pad market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor CMP Polishing Pad.
Chapter 14 and 15, to describe Semiconductor CMP Polishing Pad sales channel, distributors, customers, research findings and conclusion.
Table of Contents
100 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Semiconductor CMP Polishing Pad by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
Pricing
Currency Rates
Questions or Comments?
Our team has the ability to search within reports to verify it suits your needs. We can also help maximize your budget by finding sections of reports you can purchase.
