Global Semiconductor Back-End Test Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Semiconductor Back-End Test Equipment market size was valued at US$ 7003 million in 2024 and is forecast to a readjusted size of USD 13430 million by 2031 with a CAGR of 9.4% during review period.
Semiconductor equipment is mainly divided into front-end equipment and back-end packaging and testing equipment. Front-end equipment is mainly wafer manufacturing equipment, while back-end packaging and testing equipment includes testers (ATE), handlers, probe stations, thinning machines, dicing machines, etc.
This article's statistics on semiconductor back-end test equipment (integrated circuit test equipment) mainly include three types of equipment: testers (ATE), handlers, and probe stations.
Testers, also known as automated test systems (ATE), are mainly used to conduct comprehensive testing of the functions and performance parameters of wafers and chips. This includes testing of semiconductor discrete devices (such as power semiconductor discrete devices and small signal discrete devices), as well as testing of analog and mixed-signal integrated circuits. This equipment plays an important role in the semiconductor industry chain and is widely used in the main links from chip design verification, testing during wafer manufacturing, to finished product testing after packaging is completed.
Handler is mainly used in the finished product inspection link of the design verification stage and the packaging test stage of integrated circuits. Its core function is to automatically transport the chip to be tested to the test area (that is, the location where the chip is connected to the test equipment and tested). In the test area, the pins of the chip are connected to the functional units of the test equipment through specific wiring. After the test equipment completes the test, it feeds the results back to the Handler, and the Handler identifies, classifies and collects the tested chips based on these test results.
The test machine (ATE) is a special equipment for testing the function and performance of the chip. The Handler and the probe station are special equipment for connecting the tested chips and wafers to the functional modules of the test machine and realizing batch automated testing.
In the wafer inspection stage, the main test equipment used is the probe station and the test machine, while in the chip design verification and finished product testing stages, the main test equipment used is the handler and the test machine.
Semiconductor back-end test equipment is a branch of the entire semiconductor equipment. From the perspective of the distribution of global semiconductor equipment sales regions, the market is mainly concentrated in mainland China and Taiwan, China, and the market share of the two regions will exceed 60% in 2024. However, from the perspective of equipment self-sufficiency, the level of localization in China is still relatively low. High-end semiconductor back-end test equipment manufacturers mainly come from Japan and other countries. In recent years, with the support of national policies, China's semiconductor industry has developed rapidly, and the sales scale of semiconductor back-end test equipment in mainland China has continued to grow. Chinese local companies such as Hangzhou Changchuan, Beijing Huafeng Test & Control Technology, PowerTECH Co., Ltd, and JHT Design Co., Ltd have occupied a certain share in the global back-end test equipment market.
From the perspective of the downstream of the industrial chain, the customer base of semiconductor back-end test equipment presents diversified characteristics, covering four core areas of OSAT, IDM and scientific research institutions, among which packaging and testing companies are the main ones. The differences in the needs of different customers reflect the trend of division of labor refinement and technology upgrading in the semiconductor industry. With the popularization of advanced packaging technologies (such as 3D packaging and system-level packaging), the development trends of test product technology mainly include a large number of tests, fast test speed, multi-functional modules, and high test accuracy. Packaging and testing companies need to use high-precision testing equipment to cope with the testing challenges of complex chips, and rely on big data analysis capabilities to optimize the test process and reduce costs. At the same time, the coexistence and development of equipment of multiple technical levels has also become one of the core development trends of semiconductor equipment.
The growth of the scale of semiconductor back-end test equipment depends on the expansion of the scale of the integrated circuit packaging market. From a technical perspective, the continuous breakthroughs in packaging technology directly push up the threshold of testing technology. Taking 3D packaging as an example, the vertical interconnection structure of through silicon vias (TSVs) needs to be tested at the micron level through a probe station, while the heterogeneous integration of multiple chips in the system-level packaging (SiP) requires ATE equipment to have parallel testing, protocol compatibility, and extreme condition simulation capabilities. From the perspective of industrial chain division of labor, the independent operation of the packaging and testing links strengthens the stickiness of equipment demand. In order to serve global customers, OSAT needs to configure highly flexible handlers and modular ATE systems to adapt to cross-domain orders from consumer electronics to automotive electronics. Terminal application upgrades inject continuous momentum into the equipment market, such as 5G and new energy vehicles.
This report is a detailed and comprehensive analysis for global Semiconductor Back-End Test Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor Back-End Test Equipment market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Back-End Test Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Back-End Test Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Back-End Test Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor Back-End Test Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor Back-End Test Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Accretech, TEL, Semics, Fittech, Sidea Semiconductor, FormFactor, Advantest, Teradyne, Cohu, Hangzhou Changchuan Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Semiconductor Back-End Test Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
ATE
Handler
Probe Station
Market segment by Application
IDM
OSAT
Scientific Research
Major players covered
Accretech
TEL
Semics
Fittech
Sidea Semiconductor
FormFactor
Advantest
Teradyne
Cohu
Hangzhou Changchuan Technology
YC Corp
Beijing Huafeng Test & Control Technology
Chroma ATE Inc
Hon Precision
SPEA
Shibasoku
Macrotest
PowerTECH
HON PRECISION, INC
JHT Design Co.,Ltd
Boston Semi Equipment
SESSCO Technologies
SYNAX
Microtec Handling Systems GmbH
Tesec Inc
Techwing
Kanematsu
UENO SEIKI NAGANO
Shanghai Cascol
Shenzhen Semishare
MPI Corporation
Micronics Japan
ASM Pacific Technology
Everbeing
MarTek
Micromanipulator
Signatone Corporation
HiSOL, Inc
KeyFactor Systems
Wentworth Laboratories
APOLLOWAVE
SemiProbe
MicroXact
KeithLink Technology
Ecopia
Shenzhen Cindbest Technology
ESDEMC Technology
Lake Shore Cryotronics
Wuhan Jingce Electronic Technology
Exatron
SEMES
Mirae Corporation
ATECO
Pentamaster
CETC45
Shenzhen Hi-Test Semiconductor Equipment Co., Ltd
Shenzhen Biaopu Semiconductor Technology
Shanghai YOUNG SOUL
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Back-End Test Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Semiconductor Back-End Test Equipment, with price, sales quantity, revenue, and global market share of Semiconductor Back-End Test Equipment from 2020 to 2025.
Chapter 3, the Semiconductor Back-End Test Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Back-End Test Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Semiconductor Back-End Test Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Back-End Test Equipment.
Chapter 14 and 15, to describe Semiconductor Back-End Test Equipment sales channel, distributors, customers, research findings and conclusion.
Semiconductor equipment is mainly divided into front-end equipment and back-end packaging and testing equipment. Front-end equipment is mainly wafer manufacturing equipment, while back-end packaging and testing equipment includes testers (ATE), handlers, probe stations, thinning machines, dicing machines, etc.
This article's statistics on semiconductor back-end test equipment (integrated circuit test equipment) mainly include three types of equipment: testers (ATE), handlers, and probe stations.
Testers, also known as automated test systems (ATE), are mainly used to conduct comprehensive testing of the functions and performance parameters of wafers and chips. This includes testing of semiconductor discrete devices (such as power semiconductor discrete devices and small signal discrete devices), as well as testing of analog and mixed-signal integrated circuits. This equipment plays an important role in the semiconductor industry chain and is widely used in the main links from chip design verification, testing during wafer manufacturing, to finished product testing after packaging is completed.
Handler is mainly used in the finished product inspection link of the design verification stage and the packaging test stage of integrated circuits. Its core function is to automatically transport the chip to be tested to the test area (that is, the location where the chip is connected to the test equipment and tested). In the test area, the pins of the chip are connected to the functional units of the test equipment through specific wiring. After the test equipment completes the test, it feeds the results back to the Handler, and the Handler identifies, classifies and collects the tested chips based on these test results.
The test machine (ATE) is a special equipment for testing the function and performance of the chip. The Handler and the probe station are special equipment for connecting the tested chips and wafers to the functional modules of the test machine and realizing batch automated testing.
In the wafer inspection stage, the main test equipment used is the probe station and the test machine, while in the chip design verification and finished product testing stages, the main test equipment used is the handler and the test machine.
Semiconductor back-end test equipment is a branch of the entire semiconductor equipment. From the perspective of the distribution of global semiconductor equipment sales regions, the market is mainly concentrated in mainland China and Taiwan, China, and the market share of the two regions will exceed 60% in 2024. However, from the perspective of equipment self-sufficiency, the level of localization in China is still relatively low. High-end semiconductor back-end test equipment manufacturers mainly come from Japan and other countries. In recent years, with the support of national policies, China's semiconductor industry has developed rapidly, and the sales scale of semiconductor back-end test equipment in mainland China has continued to grow. Chinese local companies such as Hangzhou Changchuan, Beijing Huafeng Test & Control Technology, PowerTECH Co., Ltd, and JHT Design Co., Ltd have occupied a certain share in the global back-end test equipment market.
From the perspective of the downstream of the industrial chain, the customer base of semiconductor back-end test equipment presents diversified characteristics, covering four core areas of OSAT, IDM and scientific research institutions, among which packaging and testing companies are the main ones. The differences in the needs of different customers reflect the trend of division of labor refinement and technology upgrading in the semiconductor industry. With the popularization of advanced packaging technologies (such as 3D packaging and system-level packaging), the development trends of test product technology mainly include a large number of tests, fast test speed, multi-functional modules, and high test accuracy. Packaging and testing companies need to use high-precision testing equipment to cope with the testing challenges of complex chips, and rely on big data analysis capabilities to optimize the test process and reduce costs. At the same time, the coexistence and development of equipment of multiple technical levels has also become one of the core development trends of semiconductor equipment.
The growth of the scale of semiconductor back-end test equipment depends on the expansion of the scale of the integrated circuit packaging market. From a technical perspective, the continuous breakthroughs in packaging technology directly push up the threshold of testing technology. Taking 3D packaging as an example, the vertical interconnection structure of through silicon vias (TSVs) needs to be tested at the micron level through a probe station, while the heterogeneous integration of multiple chips in the system-level packaging (SiP) requires ATE equipment to have parallel testing, protocol compatibility, and extreme condition simulation capabilities. From the perspective of industrial chain division of labor, the independent operation of the packaging and testing links strengthens the stickiness of equipment demand. In order to serve global customers, OSAT needs to configure highly flexible handlers and modular ATE systems to adapt to cross-domain orders from consumer electronics to automotive electronics. Terminal application upgrades inject continuous momentum into the equipment market, such as 5G and new energy vehicles.
This report is a detailed and comprehensive analysis for global Semiconductor Back-End Test Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor Back-End Test Equipment market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Back-End Test Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Back-End Test Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Back-End Test Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor Back-End Test Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor Back-End Test Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Accretech, TEL, Semics, Fittech, Sidea Semiconductor, FormFactor, Advantest, Teradyne, Cohu, Hangzhou Changchuan Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Semiconductor Back-End Test Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
ATE
Handler
Probe Station
Market segment by Application
IDM
OSAT
Scientific Research
Major players covered
Accretech
TEL
Semics
Fittech
Sidea Semiconductor
FormFactor
Advantest
Teradyne
Cohu
Hangzhou Changchuan Technology
YC Corp
Beijing Huafeng Test & Control Technology
Chroma ATE Inc
Hon Precision
SPEA
Shibasoku
Macrotest
PowerTECH
HON PRECISION, INC
JHT Design Co.,Ltd
Boston Semi Equipment
SESSCO Technologies
SYNAX
Microtec Handling Systems GmbH
Tesec Inc
Techwing
Kanematsu
UENO SEIKI NAGANO
Shanghai Cascol
Shenzhen Semishare
MPI Corporation
Micronics Japan
ASM Pacific Technology
Everbeing
MarTek
Micromanipulator
Signatone Corporation
HiSOL, Inc
KeyFactor Systems
Wentworth Laboratories
APOLLOWAVE
SemiProbe
MicroXact
KeithLink Technology
Ecopia
Shenzhen Cindbest Technology
ESDEMC Technology
Lake Shore Cryotronics
Wuhan Jingce Electronic Technology
Exatron
SEMES
Mirae Corporation
ATECO
Pentamaster
CETC45
Shenzhen Hi-Test Semiconductor Equipment Co., Ltd
Shenzhen Biaopu Semiconductor Technology
Shanghai YOUNG SOUL
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Back-End Test Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Semiconductor Back-End Test Equipment, with price, sales quantity, revenue, and global market share of Semiconductor Back-End Test Equipment from 2020 to 2025.
Chapter 3, the Semiconductor Back-End Test Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Back-End Test Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Semiconductor Back-End Test Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Back-End Test Equipment.
Chapter 14 and 15, to describe Semiconductor Back-End Test Equipment sales channel, distributors, customers, research findings and conclusion.
Table of Contents
214 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Semiconductor Back-End Test Equipment by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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