Global Quad-Flat-No-Lead Packaging (QFN) Supply, Demand and Key Producers, 2026-2032
Description
The global Quad-Flat-No-Lead Packaging (QFN) market size is expected to reach $ 4593 million by 2032, rising at a market growth of 1.9% CAGR during the forecast period (2026-2032).
Quad-Flat-No-Lead (QFN) packaging is a type of surface-mount integrated circuit (IC) package that provides a compact and low-profile solution for electronic components. It is widely used in various industries, including consumer electronics, telecommunications, automotive, and industrial applications.
QFN packages are designed to have no leads protruding from the sides. Instead, the electrical connections are made through metal pads on the bottom surface of the package. This design allows for a smaller package size and improved thermal and electrical performance compared to traditional leaded packages.
QFN packaging has gained popularity in the electronics industry due to its compact size, good thermal performance, and reliability. It enables the development of smaller and more powerful electronic devices while optimizing space utilization on PCBs.
Global key players of Quad-Flat-No-Lead Packaging(QFN) include ASE(SPIL), Amkor Technology, JCET Group, Powertech Technology Inc. and Tongfu Microelectronics, etc. Top five players occupy for a share about 70%. Asia-Pacific is the largest market, with a share about 77%, followed by Europe and North America. In terms of product, Sawn Type is the largest segment, with a share over 63%. In terms of Package Size, Above 5x5 to 7x7 is the largest market, with a share over 28%.
This report studies the global Quad-Flat-No-Lead Packaging (QFN) production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Quad-Flat-No-Lead Packaging (QFN) and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Quad-Flat-No-Lead Packaging (QFN) that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Quad-Flat-No-Lead Packaging (QFN) total production and demand, 2021-2032, (KK PCS)
Global Quad-Flat-No-Lead Packaging (QFN) total production value, 2021-2032, (USD Million)
Global Quad-Flat-No-Lead Packaging (QFN) production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (KK PCS), (based on production site)
Global Quad-Flat-No-Lead Packaging (QFN) consumption by region & country, CAGR, 2021-2032 & (KK PCS)
U.S. VS China: Quad-Flat-No-Lead Packaging (QFN) domestic production, consumption, key domestic manufacturers and share
Global Quad-Flat-No-Lead Packaging (QFN) production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (KK PCS)
Global Quad-Flat-No-Lead Packaging (QFN) production by Type, production, value, CAGR, 2021-2032, (USD Million) & (KK PCS)
Global Quad-Flat-No-Lead Packaging (QFN) production by Application, production, value, CAGR, 2021-2032, (USD Million) & (KK PCS)
This report profiles key players in the global Quad-Flat-No-Lead Packaging (QFN) market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE(SPIL), Amkor Technology, JCET Group, Powertech Technology Inc., Tongfu Microelectronics, Tianshui Huatian Technology, UTAC, Orient Semiconductor, ChipMOS, King Yuan Electronics, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Quad-Flat-No-Lead Packaging (QFN) market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (KK PCS) and average price (US$/K PCS) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Quad-Flat-No-Lead Packaging (QFN) Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Quad-Flat-No-Lead Packaging (QFN) Market, Segmentation by Type:
Punched Type
Sawn Type
Global Quad-Flat-No-Lead Packaging (QFN) Market, Segmentation by Application:
Automotive
Consumer Electronics
Industrial
Communications
Others
Companies Profiled:
ASE(SPIL)
Amkor Technology
JCET Group
Powertech Technology Inc.
Tongfu Microelectronics
Tianshui Huatian Technology
UTAC
Orient Semiconductor
ChipMOS
King Yuan Electronics
SFA Semicon
Key Questions Answered:
1. How big is the global Quad-Flat-No-Lead Packaging (QFN) market?
2. What is the demand of the global Quad-Flat-No-Lead Packaging (QFN) market?
3. What is the year over year growth of the global Quad-Flat-No-Lead Packaging (QFN) market?
4. What is the production and production value of the global Quad-Flat-No-Lead Packaging (QFN) market?
5. Who are the key producers in the global Quad-Flat-No-Lead Packaging (QFN) market?
6. What are the growth factors driving the market demand?
Quad-Flat-No-Lead (QFN) packaging is a type of surface-mount integrated circuit (IC) package that provides a compact and low-profile solution for electronic components. It is widely used in various industries, including consumer electronics, telecommunications, automotive, and industrial applications.
QFN packages are designed to have no leads protruding from the sides. Instead, the electrical connections are made through metal pads on the bottom surface of the package. This design allows for a smaller package size and improved thermal and electrical performance compared to traditional leaded packages.
QFN packaging has gained popularity in the electronics industry due to its compact size, good thermal performance, and reliability. It enables the development of smaller and more powerful electronic devices while optimizing space utilization on PCBs.
Global key players of Quad-Flat-No-Lead Packaging(QFN) include ASE(SPIL), Amkor Technology, JCET Group, Powertech Technology Inc. and Tongfu Microelectronics, etc. Top five players occupy for a share about 70%. Asia-Pacific is the largest market, with a share about 77%, followed by Europe and North America. In terms of product, Sawn Type is the largest segment, with a share over 63%. In terms of Package Size, Above 5x5 to 7x7 is the largest market, with a share over 28%.
This report studies the global Quad-Flat-No-Lead Packaging (QFN) production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Quad-Flat-No-Lead Packaging (QFN) and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Quad-Flat-No-Lead Packaging (QFN) that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Quad-Flat-No-Lead Packaging (QFN) total production and demand, 2021-2032, (KK PCS)
Global Quad-Flat-No-Lead Packaging (QFN) total production value, 2021-2032, (USD Million)
Global Quad-Flat-No-Lead Packaging (QFN) production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (KK PCS), (based on production site)
Global Quad-Flat-No-Lead Packaging (QFN) consumption by region & country, CAGR, 2021-2032 & (KK PCS)
U.S. VS China: Quad-Flat-No-Lead Packaging (QFN) domestic production, consumption, key domestic manufacturers and share
Global Quad-Flat-No-Lead Packaging (QFN) production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (KK PCS)
Global Quad-Flat-No-Lead Packaging (QFN) production by Type, production, value, CAGR, 2021-2032, (USD Million) & (KK PCS)
Global Quad-Flat-No-Lead Packaging (QFN) production by Application, production, value, CAGR, 2021-2032, (USD Million) & (KK PCS)
This report profiles key players in the global Quad-Flat-No-Lead Packaging (QFN) market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE(SPIL), Amkor Technology, JCET Group, Powertech Technology Inc., Tongfu Microelectronics, Tianshui Huatian Technology, UTAC, Orient Semiconductor, ChipMOS, King Yuan Electronics, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Quad-Flat-No-Lead Packaging (QFN) market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (KK PCS) and average price (US$/K PCS) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Quad-Flat-No-Lead Packaging (QFN) Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Quad-Flat-No-Lead Packaging (QFN) Market, Segmentation by Type:
Punched Type
Sawn Type
Global Quad-Flat-No-Lead Packaging (QFN) Market, Segmentation by Application:
Automotive
Consumer Electronics
Industrial
Communications
Others
Companies Profiled:
ASE(SPIL)
Amkor Technology
JCET Group
Powertech Technology Inc.
Tongfu Microelectronics
Tianshui Huatian Technology
UTAC
Orient Semiconductor
ChipMOS
King Yuan Electronics
SFA Semicon
Key Questions Answered:
1. How big is the global Quad-Flat-No-Lead Packaging (QFN) market?
2. What is the demand of the global Quad-Flat-No-Lead Packaging (QFN) market?
3. What is the year over year growth of the global Quad-Flat-No-Lead Packaging (QFN) market?
4. What is the production and production value of the global Quad-Flat-No-Lead Packaging (QFN) market?
5. Who are the key producers in the global Quad-Flat-No-Lead Packaging (QFN) market?
6. What are the growth factors driving the market demand?
Table of Contents
116 Pages
- 1 Supply Summary
- 2 Demand Summary
- 3 World Manufacturers Competitive Analysis
- 4 United States VS China VS Rest of the World
- 5 Market Analysis by Type
- 6 Market Analysis by Application
- 7 Company Profiles
- 8 Industry Chain Analysis
- 9 Research Findings and Conclusion
- 10 Appendix
Pricing
Currency Rates
Questions or Comments?
Our team has the ability to search within reports to verify it suits your needs. We can also help maximize your budget by finding sections of reports you can purchase.
