Global Power Electronic DCB & AMB Substrates Supply, Demand and Key Producers, 2026-2032
Description
The global Power Electronic DCB & AMB Substrates market size is expected to reach $ 2295 million by 2032, rising at a market growth of 11.9% CAGR during the forecast period (2026-2032).
DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate. Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.
The global DBC ceramic substrates market is dominated by few players like Rogers Corporation, Ferrotec, NGK Electronics Devices, KCC, Shengda Tech, BYD, Heraeus Electronics and Nanjing Zhongjiang New Material, etc. Global five players hold a share over 79.8 percent in 2024. In recent years, more and more Chinese players enter the DBC ceramic substrates market, driven by the rapid growth of new energy vehicles in China market. In future, the Chinese players will play more roles around the world.
The global key manufacturers of AMB Ceramic Substrate include Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials, etc. In 2023, the global top eight players had a share approximately 85% in terms of revenue.
Currently the AMB ceramic substrates are mainly produced in Japan, Germany and China, which account for 27.3%, 24.56% and 43.5% of the market share respectively in 2023. It is expected that China's production share will reach 57% in 2030. As NGK Electronics Devices and Ferrotec have started or built factories to produce AMB in Malaysia, Southeast Asia is expected to play an important role as a production base in the next few years.
This report studies the global Power Electronic DCB & AMB Substrates production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Power Electronic DCB & AMB Substrates and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Power Electronic DCB & AMB Substrates that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Power Electronic DCB & AMB Substrates total production and demand, 2021-2032, (Square Meters)
Global Power Electronic DCB & AMB Substrates total production value, 2021-2032, (USD Million)
Global Power Electronic DCB & AMB Substrates production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Square Meters), (based on production site)
Global Power Electronic DCB & AMB Substrates consumption by region & country, CAGR, 2021-2032 & (Square Meters)
U.S. VS China: Power Electronic DCB & AMB Substrates domestic production, consumption, key domestic manufacturers and share
Global Power Electronic DCB & AMB Substrates production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Square Meters)
Global Power Electronic DCB & AMB Substrates production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Square Meters)
Global Power Electronic DCB & AMB Substrates production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Square Meters)
This report profiles key players in the global Power Electronic DCB & AMB Substrates market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Rogers Corporation, Heraeus Electronics, Kyocera, NGK Electronics Devices, Toshiba Materials, Denka, DOWA METALTECH, KCC, Proterial, Mitsubishi Materials, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Power Electronic DCB & AMB Substrates market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Square Meters) and average price (US$/Sq m) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Power Electronic DCB & AMB Substrates Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Power Electronic DCB & AMB Substrates Market, Segmentation by Type:
DBC Ceramic Substrates
AMB Ceramic Substrate
Global Power Electronic DCB & AMB Substrates Market, Segmentation by Application:
Automotive & EV/HEV
PV and Wind Power
Industrial Drives
Rail Transport
Consumer & White Goods
Military & Avionics
Thermoelectric Module (TEM)
Others
Companies Profiled:
Rogers Corporation
Heraeus Electronics
Kyocera
NGK Electronics Devices
Toshiba Materials
Denka
DOWA METALTECH
KCC
Proterial
Mitsubishi Materials
Jiangsu Fulehua Semiconductor Technology
BYD
Bomin Electronics
Zhejiang TC Ceramic Electronic
Shengda Tech
Beijing Moshi Technology
Nantong Winspower
Wuxi Tianyang Electronics
Fengpeng Electronics (Zhuhai)
Guangzhou Xianyi Electronic Technology
Fujian Huaqing Electronic Material Technology
Konfoong Materials International
Chengdu Wanshida Ceramic Industry
Littelfuse IXYS
Zhejiang Jingci Semiconductor
Taotao Technology
FJ Composite
Anhui Taoxinke Semiconductor
Guangde Dongfeng Semiconductor
Suzhou Aicheng Technology
Key Questions Answered:
1. How big is the global Power Electronic DCB & AMB Substrates market?
2. What is the demand of the global Power Electronic DCB & AMB Substrates market?
3. What is the year over year growth of the global Power Electronic DCB & AMB Substrates market?
4. What is the production and production value of the global Power Electronic DCB & AMB Substrates market?
5. Who are the key producers in the global Power Electronic DCB & AMB Substrates market?
6. What are the growth factors driving the market demand?
DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate. Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.
The global DBC ceramic substrates market is dominated by few players like Rogers Corporation, Ferrotec, NGK Electronics Devices, KCC, Shengda Tech, BYD, Heraeus Electronics and Nanjing Zhongjiang New Material, etc. Global five players hold a share over 79.8 percent in 2024. In recent years, more and more Chinese players enter the DBC ceramic substrates market, driven by the rapid growth of new energy vehicles in China market. In future, the Chinese players will play more roles around the world.
The global key manufacturers of AMB Ceramic Substrate include Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials, etc. In 2023, the global top eight players had a share approximately 85% in terms of revenue.
Currently the AMB ceramic substrates are mainly produced in Japan, Germany and China, which account for 27.3%, 24.56% and 43.5% of the market share respectively in 2023. It is expected that China's production share will reach 57% in 2030. As NGK Electronics Devices and Ferrotec have started or built factories to produce AMB in Malaysia, Southeast Asia is expected to play an important role as a production base in the next few years.
This report studies the global Power Electronic DCB & AMB Substrates production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Power Electronic DCB & AMB Substrates and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Power Electronic DCB & AMB Substrates that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Power Electronic DCB & AMB Substrates total production and demand, 2021-2032, (Square Meters)
Global Power Electronic DCB & AMB Substrates total production value, 2021-2032, (USD Million)
Global Power Electronic DCB & AMB Substrates production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Square Meters), (based on production site)
Global Power Electronic DCB & AMB Substrates consumption by region & country, CAGR, 2021-2032 & (Square Meters)
U.S. VS China: Power Electronic DCB & AMB Substrates domestic production, consumption, key domestic manufacturers and share
Global Power Electronic DCB & AMB Substrates production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Square Meters)
Global Power Electronic DCB & AMB Substrates production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Square Meters)
Global Power Electronic DCB & AMB Substrates production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Square Meters)
This report profiles key players in the global Power Electronic DCB & AMB Substrates market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Rogers Corporation, Heraeus Electronics, Kyocera, NGK Electronics Devices, Toshiba Materials, Denka, DOWA METALTECH, KCC, Proterial, Mitsubishi Materials, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Power Electronic DCB & AMB Substrates market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Square Meters) and average price (US$/Sq m) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Power Electronic DCB & AMB Substrates Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Power Electronic DCB & AMB Substrates Market, Segmentation by Type:
DBC Ceramic Substrates
AMB Ceramic Substrate
Global Power Electronic DCB & AMB Substrates Market, Segmentation by Application:
Automotive & EV/HEV
PV and Wind Power
Industrial Drives
Rail Transport
Consumer & White Goods
Military & Avionics
Thermoelectric Module (TEM)
Others
Companies Profiled:
Rogers Corporation
Heraeus Electronics
Kyocera
NGK Electronics Devices
Toshiba Materials
Denka
DOWA METALTECH
KCC
Proterial
Mitsubishi Materials
Jiangsu Fulehua Semiconductor Technology
BYD
Bomin Electronics
Zhejiang TC Ceramic Electronic
Shengda Tech
Beijing Moshi Technology
Nantong Winspower
Wuxi Tianyang Electronics
Fengpeng Electronics (Zhuhai)
Guangzhou Xianyi Electronic Technology
Fujian Huaqing Electronic Material Technology
Konfoong Materials International
Chengdu Wanshida Ceramic Industry
Littelfuse IXYS
Zhejiang Jingci Semiconductor
Taotao Technology
FJ Composite
Anhui Taoxinke Semiconductor
Guangde Dongfeng Semiconductor
Suzhou Aicheng Technology
Key Questions Answered:
1. How big is the global Power Electronic DCB & AMB Substrates market?
2. What is the demand of the global Power Electronic DCB & AMB Substrates market?
3. What is the year over year growth of the global Power Electronic DCB & AMB Substrates market?
4. What is the production and production value of the global Power Electronic DCB & AMB Substrates market?
5. Who are the key producers in the global Power Electronic DCB & AMB Substrates market?
6. What are the growth factors driving the market demand?
Table of Contents
189 Pages
- 1 Supply Summary
- 2 Demand Summary
- 3 World Manufacturers Competitive Analysis
- 4 United States VS China VS Rest of the World
- 5 Market Analysis by Type
- 6 Market Analysis by Application
- 7 Company Profiles
- 8 Industry Chain Analysis
- 9 Research Findings and Conclusion
- 10 Appendix
Pricing
Currency Rates
Questions or Comments?
Our team has the ability to search within reports to verify it suits your needs. We can also help maximize your budget by finding sections of reports you can purchase.
