Global NEV IGBT Modules Heatsink Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032
Description
According to our (Global Info Research) latest study, the global NEV IGBT Modules Heatsink market size was valued at US$ 302 million in 2025 and is forecast to a readjusted size of US$ 625 million by 2032 with a CAGR of 10.3% during review period.
NEV IGBT modules heatsink refers to a thermal management component specifically designed to dissipate the heat generated by IGBT (Insulated Gate Bipolar Transistor) modules used in New Energy Vehicles (NEVs). These heatsinks ensure the stable operation of power electronics such as inverters, DC-DC converters, and onboard chargers by effectively transferring heat away from the semiconductor junctions to maintain safe operating temperatures.
The value chain spans metals and alloys, seals/coatings, joining processes, TIM and coolant systems upstream; cold-plate/heatsink manufacturing and inspection midstream; and downstream power-module makers and Tier-1 e-drive system integrators that validate performance under automotive reliability regimes.
In 2025, global NEV IGBT modules heatsink production reached approximately 29 million units, with an average global market price is $10 per unit.
In new energy vehicles (NEVs), IGBT modules are widely adopted as core power devices in the powertrain system. Their efficient operation relies heavily on effective thermal management, with the heatsink playing a critical role in ensuring the reliability, longevity, and overall performance of the IGBT module and the vehicle.
Currently, mainstream IGBT heatsink substrates are mainly categorized into flat-base and pin-fin types. Flat-base heatsinks feature smooth surfaces, typically made from high-thermal-conductivity aluminum alloys or copper. These are attached to the IGBT module via press-fitting or bolts, ensuring close contact for efficient heat conduction. Characterized by simple structure and low manufacturing cost, flat-base heatsinks are suitable for low thermal density applications, such as hybrid vehicle power modules and on-board chargers (OBCs).
In contrast, pin-fin heatsinks employ densely arranged metal pins or columns to enhance heat exchange through liquid or air cooling. They are particularly suited for high-current, high heat-flux scenarios. Key power components such as motor control units (MCUs), motor controllers, and main inverter systems typically use pin-fin structures combined with cold plates to achieve high-performance thermal dissipation.
From an application standpoint, these heatsinks are widely used in motor controllers (MCUs), DC/AC inverters, OBC charging modules, and DC/DC converters in battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). As NEVs evolve toward higher voltage and greater power output, IGBT modules are becoming increasingly integrated, imposing new demands on heatsinks for lightweight construction, compact design, and efficient thermal conductivity.
Looking ahead, with SiC devices gradually replacing traditional IGBTs, further improvements in thermal resistance control and structural compatibility are expected. This will drive the broader adoption of liquid cooling and hybrid cooling technologies in NEVs. As the demand for high-voltage, high-frequency, and high-power-density IGBT modules continues to rise, modular and integrated heatsink designs are becoming the trend, advancing toward lightweight, highly integrated structures with multi-channel flow paths.
This report is a detailed and comprehensive analysis for global NEV IGBT Modules Heatsink market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global NEV IGBT Modules Heatsink market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2021-2032
Global NEV IGBT Modules Heatsink market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2021-2032
Global NEV IGBT Modules Heatsink market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2021-2032
Global NEV IGBT Modules Heatsink market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for NEV IGBT Modules Heatsink
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global NEV IGBT Modules Heatsink market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Huangshan Googe, Heatsink Advanced Materials, Kunshan Gootage Thermal Technology, Dana Incorporated, Jentech Precision Industrial, Amulaire Thermal Technology, TAIWA CO., Ltd., Wieland Microcool, Jiangyin Saiying Electron, Suzhou Haoli Electronic Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
NEV IGBT Modules Heatsink market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Flat-base Heat Sink
Pin-fin Heat Sink
Market segment by Material
Cu Baseplate
AlSIC Baseplate
Other
Market segment by Vehicle
Passenger Car
Commercial Vehicle
Market segment by Application
BEV
PHEV
Major players covered
Huangshan Googe
Heatsink Advanced Materials
Kunshan Gootage Thermal Technology
Dana Incorporated
Jentech Precision Industrial
Amulaire Thermal Technology
TAIWA CO., Ltd.
Wieland Microcool
Jiangyin Saiying Electron
Suzhou Haoli Electronic Technology
Sitritec Thermal Control Materials
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe NEV IGBT Modules Heatsink product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of NEV IGBT Modules Heatsink, with price, sales quantity, revenue, and global market share of NEV IGBT Modules Heatsink from 2021 to 2026.
Chapter 3, the NEV IGBT Modules Heatsink competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the NEV IGBT Modules Heatsink breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and NEV IGBT Modules Heatsink market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of NEV IGBT Modules Heatsink.
Chapter 14 and 15, to describe NEV IGBT Modules Heatsink sales channel, distributors, customers, research findings and conclusion.
NEV IGBT modules heatsink refers to a thermal management component specifically designed to dissipate the heat generated by IGBT (Insulated Gate Bipolar Transistor) modules used in New Energy Vehicles (NEVs). These heatsinks ensure the stable operation of power electronics such as inverters, DC-DC converters, and onboard chargers by effectively transferring heat away from the semiconductor junctions to maintain safe operating temperatures.
The value chain spans metals and alloys, seals/coatings, joining processes, TIM and coolant systems upstream; cold-plate/heatsink manufacturing and inspection midstream; and downstream power-module makers and Tier-1 e-drive system integrators that validate performance under automotive reliability regimes.
In 2025, global NEV IGBT modules heatsink production reached approximately 29 million units, with an average global market price is $10 per unit.
In new energy vehicles (NEVs), IGBT modules are widely adopted as core power devices in the powertrain system. Their efficient operation relies heavily on effective thermal management, with the heatsink playing a critical role in ensuring the reliability, longevity, and overall performance of the IGBT module and the vehicle.
Currently, mainstream IGBT heatsink substrates are mainly categorized into flat-base and pin-fin types. Flat-base heatsinks feature smooth surfaces, typically made from high-thermal-conductivity aluminum alloys or copper. These are attached to the IGBT module via press-fitting or bolts, ensuring close contact for efficient heat conduction. Characterized by simple structure and low manufacturing cost, flat-base heatsinks are suitable for low thermal density applications, such as hybrid vehicle power modules and on-board chargers (OBCs).
In contrast, pin-fin heatsinks employ densely arranged metal pins or columns to enhance heat exchange through liquid or air cooling. They are particularly suited for high-current, high heat-flux scenarios. Key power components such as motor control units (MCUs), motor controllers, and main inverter systems typically use pin-fin structures combined with cold plates to achieve high-performance thermal dissipation.
From an application standpoint, these heatsinks are widely used in motor controllers (MCUs), DC/AC inverters, OBC charging modules, and DC/DC converters in battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). As NEVs evolve toward higher voltage and greater power output, IGBT modules are becoming increasingly integrated, imposing new demands on heatsinks for lightweight construction, compact design, and efficient thermal conductivity.
Looking ahead, with SiC devices gradually replacing traditional IGBTs, further improvements in thermal resistance control and structural compatibility are expected. This will drive the broader adoption of liquid cooling and hybrid cooling technologies in NEVs. As the demand for high-voltage, high-frequency, and high-power-density IGBT modules continues to rise, modular and integrated heatsink designs are becoming the trend, advancing toward lightweight, highly integrated structures with multi-channel flow paths.
This report is a detailed and comprehensive analysis for global NEV IGBT Modules Heatsink market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global NEV IGBT Modules Heatsink market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2021-2032
Global NEV IGBT Modules Heatsink market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2021-2032
Global NEV IGBT Modules Heatsink market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2021-2032
Global NEV IGBT Modules Heatsink market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for NEV IGBT Modules Heatsink
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global NEV IGBT Modules Heatsink market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Huangshan Googe, Heatsink Advanced Materials, Kunshan Gootage Thermal Technology, Dana Incorporated, Jentech Precision Industrial, Amulaire Thermal Technology, TAIWA CO., Ltd., Wieland Microcool, Jiangyin Saiying Electron, Suzhou Haoli Electronic Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
NEV IGBT Modules Heatsink market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Flat-base Heat Sink
Pin-fin Heat Sink
Market segment by Material
Cu Baseplate
AlSIC Baseplate
Other
Market segment by Vehicle
Passenger Car
Commercial Vehicle
Market segment by Application
BEV
PHEV
Major players covered
Huangshan Googe
Heatsink Advanced Materials
Kunshan Gootage Thermal Technology
Dana Incorporated
Jentech Precision Industrial
Amulaire Thermal Technology
TAIWA CO., Ltd.
Wieland Microcool
Jiangyin Saiying Electron
Suzhou Haoli Electronic Technology
Sitritec Thermal Control Materials
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe NEV IGBT Modules Heatsink product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of NEV IGBT Modules Heatsink, with price, sales quantity, revenue, and global market share of NEV IGBT Modules Heatsink from 2021 to 2026.
Chapter 3, the NEV IGBT Modules Heatsink competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the NEV IGBT Modules Heatsink breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and NEV IGBT Modules Heatsink market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of NEV IGBT Modules Heatsink.
Chapter 14 and 15, to describe NEV IGBT Modules Heatsink sales channel, distributors, customers, research findings and conclusion.
Table of Contents
111 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: NEV IGBT Modules Heatsink by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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