Global Metal and Hard Mask Etch System Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Metal and Hard Mask Etch System market size was valued at US$ 1663 million in 2024 and is forecast to a readjusted size of USD 3736 million by 2031 with a CAGR of 12.4% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
An etch system shapes the thin film into a desired patterns using liquid chemicals, reaction gases or ion chemical reaction. An etch system is used in manufacturing lines for semiconductors and other electronic devices. This report mainly covers metal etch and hard mask etch system market.
North America have a larger market share which account for nearly 70%, followed by Japan and Asia-Pacific region. The world TOP 5 players in the Metal and Hard Mask Etch System market are Lam Research, Applied Materials, Hitachi High-tech, Tokyo Electron and Oxford Instruments, which account for more than 65% of the total market share.
Analysis of market driving factors
1. Technology node shrinkage and process upgrade
Demand background: As chip manufacturing processes advance to 3nm and below, traditional photoresist masks are difficult to meet the requirements of line width control (<10nm) and aspect ratio (>50:1).
Technology driver: Hard mask etching systems have become key supporting equipment for extreme ultraviolet lithography (EUV) and double patterning processes through high selectivity and plasma resistance.
2. Explosion of demand for 5G/AIoT and high-performance computing
Market demand: The demand for high-frequency and low-power chips in scenarios such as 5G base stations, AI accelerators, and autonomous driving has surged. Process requirements: Copper interconnect layer: Hard mask ensures the layout accuracy of copper wires and reduces resistance and signal delay. Low dielectric constant (Low-K) materials: Hard mask protects porous ultra-low K dielectrics from plasma damage.
3. Policy support and accelerated domestic substitution
Global policy: US CHIPS Act: Invest $52 billion to support local semiconductor manufacturing, including hard mask material research and development. EU Chip Act: The goal is to increase the share of European chip production capacity to 20% by 2030. China's domestic substitution: policy-driven: The second phase of the National Integrated Circuit Industry Investment Fund (Big Fund) focuses on supporting the localization of etching equipment.
4. Expansion of emerging application fields
Advanced packaging:
TSV (Through Silicon Via): Hard masks are used for high-density vertical interconnection to increase the communication bandwidth between chips.
Fan-Out packaging: Hard masks enable high-precision redistribution layer (RDL) etching.
Third-generation semiconductors:
SiC/GaN devices: Hard masks solve the problem of hard material etching and improve device withstand voltage and switching speed.
5. Industry chain integration and cost optimization
Vertical integration: Leading companies (such as Lam Research) cover the entire process from hard mask material development to etching equipment manufacturing, shortening the R&D cycle.
Cost reduction: Optimize etching parameters (such as power, pressure, gas flow) through AI, reduce consumables consumption, and reduce the cost of single wafers.
3. Market trends and prospects
Technical direction:
High-K hard mask: using materials such as HfO₂ to further reduce thickness to <10nm.
Self-assembled hard mask: using block copolymers to achieve line width control below 5nm.
AI-driven process: optimizing etching uniformity through machine learning and improving yield to more than 99%.
As the core equipment of semiconductor manufacturing, the market demand for metal and hard mask etching systems is jointly driven by the shrinking of technology nodes, the outbreak of 5G/AIoT, policy support and the expansion of emerging application fields. In the future, with the deep integration of industrial chain integration and AI technology, this field will develop in the direction of higher precision, lower cost and more intelligence, providing key support for the upgrading of the global semiconductor industry.
This report is a detailed and comprehensive analysis for global Metal and Hard Mask Etch System market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Metal and Hard Mask Etch System market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Metal and Hard Mask Etch System market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Metal and Hard Mask Etch System market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Metal and Hard Mask Etch System market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Metal and Hard Mask Etch System
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Metal and Hard Mask Etch System market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Lam Research, Applied Materials, Hitachi High-tech, Tokyo Electron, Oxford Instruments, NAURA Technology Group, SPTS Technologies Ltd., AMEC, Ulvac, Samco, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Metal and Hard Mask Etch System market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Silicon Etch Equipment
Dielectric Etch Equipment
Metal Etch Equipment
Hard Mask Etch Equipment
Market segment by Application
Front End of Line (FEOL)
Back End of Line (BEOL)
Major players covered
Lam Research
Applied Materials
Hitachi High-tech
Tokyo Electron
Oxford Instruments
NAURA Technology Group
SPTS Technologies Ltd.
AMEC
Ulvac
Samco
Plasma Therm
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Metal and Hard Mask Etch System product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Metal and Hard Mask Etch System, with price, sales quantity, revenue, and global market share of Metal and Hard Mask Etch System from 2020 to 2025.
Chapter 3, the Metal and Hard Mask Etch System competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Metal and Hard Mask Etch System breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Metal and Hard Mask Etch System market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Metal and Hard Mask Etch System.
Chapter 14 and 15, to describe Metal and Hard Mask Etch System sales channel, distributors, customers, research findings and conclusion.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
An etch system shapes the thin film into a desired patterns using liquid chemicals, reaction gases or ion chemical reaction. An etch system is used in manufacturing lines for semiconductors and other electronic devices. This report mainly covers metal etch and hard mask etch system market.
North America have a larger market share which account for nearly 70%, followed by Japan and Asia-Pacific region. The world TOP 5 players in the Metal and Hard Mask Etch System market are Lam Research, Applied Materials, Hitachi High-tech, Tokyo Electron and Oxford Instruments, which account for more than 65% of the total market share.
Analysis of market driving factors
1. Technology node shrinkage and process upgrade
Demand background: As chip manufacturing processes advance to 3nm and below, traditional photoresist masks are difficult to meet the requirements of line width control (<10nm) and aspect ratio (>50:1).
Technology driver: Hard mask etching systems have become key supporting equipment for extreme ultraviolet lithography (EUV) and double patterning processes through high selectivity and plasma resistance.
2. Explosion of demand for 5G/AIoT and high-performance computing
Market demand: The demand for high-frequency and low-power chips in scenarios such as 5G base stations, AI accelerators, and autonomous driving has surged. Process requirements: Copper interconnect layer: Hard mask ensures the layout accuracy of copper wires and reduces resistance and signal delay. Low dielectric constant (Low-K) materials: Hard mask protects porous ultra-low K dielectrics from plasma damage.
3. Policy support and accelerated domestic substitution
Global policy: US CHIPS Act: Invest $52 billion to support local semiconductor manufacturing, including hard mask material research and development. EU Chip Act: The goal is to increase the share of European chip production capacity to 20% by 2030. China's domestic substitution: policy-driven: The second phase of the National Integrated Circuit Industry Investment Fund (Big Fund) focuses on supporting the localization of etching equipment.
4. Expansion of emerging application fields
Advanced packaging:
TSV (Through Silicon Via): Hard masks are used for high-density vertical interconnection to increase the communication bandwidth between chips.
Fan-Out packaging: Hard masks enable high-precision redistribution layer (RDL) etching.
Third-generation semiconductors:
SiC/GaN devices: Hard masks solve the problem of hard material etching and improve device withstand voltage and switching speed.
5. Industry chain integration and cost optimization
Vertical integration: Leading companies (such as Lam Research) cover the entire process from hard mask material development to etching equipment manufacturing, shortening the R&D cycle.
Cost reduction: Optimize etching parameters (such as power, pressure, gas flow) through AI, reduce consumables consumption, and reduce the cost of single wafers.
3. Market trends and prospects
Technical direction:
High-K hard mask: using materials such as HfO₂ to further reduce thickness to <10nm.
Self-assembled hard mask: using block copolymers to achieve line width control below 5nm.
AI-driven process: optimizing etching uniformity through machine learning and improving yield to more than 99%.
As the core equipment of semiconductor manufacturing, the market demand for metal and hard mask etching systems is jointly driven by the shrinking of technology nodes, the outbreak of 5G/AIoT, policy support and the expansion of emerging application fields. In the future, with the deep integration of industrial chain integration and AI technology, this field will develop in the direction of higher precision, lower cost and more intelligence, providing key support for the upgrading of the global semiconductor industry.
This report is a detailed and comprehensive analysis for global Metal and Hard Mask Etch System market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Metal and Hard Mask Etch System market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Metal and Hard Mask Etch System market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Metal and Hard Mask Etch System market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Metal and Hard Mask Etch System market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Metal and Hard Mask Etch System
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Metal and Hard Mask Etch System market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Lam Research, Applied Materials, Hitachi High-tech, Tokyo Electron, Oxford Instruments, NAURA Technology Group, SPTS Technologies Ltd., AMEC, Ulvac, Samco, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Metal and Hard Mask Etch System market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Silicon Etch Equipment
Dielectric Etch Equipment
Metal Etch Equipment
Hard Mask Etch Equipment
Market segment by Application
Front End of Line (FEOL)
Back End of Line (BEOL)
Major players covered
Lam Research
Applied Materials
Hitachi High-tech
Tokyo Electron
Oxford Instruments
NAURA Technology Group
SPTS Technologies Ltd.
AMEC
Ulvac
Samco
Plasma Therm
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Metal and Hard Mask Etch System product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Metal and Hard Mask Etch System, with price, sales quantity, revenue, and global market share of Metal and Hard Mask Etch System from 2020 to 2025.
Chapter 3, the Metal and Hard Mask Etch System competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Metal and Hard Mask Etch System breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Metal and Hard Mask Etch System market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Metal and Hard Mask Etch System.
Chapter 14 and 15, to describe Metal and Hard Mask Etch System sales channel, distributors, customers, research findings and conclusion.
Table of Contents
109 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Metal and Hard Mask Etch System by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
Pricing
Currency Rates
Questions or Comments?
Our team has the ability to search within reports to verify it suits your needs. We can also help maximize your budget by finding sections of reports you can purchase.