Global Low Pressure Molding Adhesive Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Low Pressure Molding Adhesive market size was valued at US$ 275 million in 2024 and is forecast to a readjusted size of USD 463 million by 2031 with a CAGR of 7.8% during review period.
The low-pressure injection molding process is a packaging process that uses very low injection pressure to inject hot melt adhesive material into the mold and quickly solidify and mold (the speed is only 1-50 seconds). It uses hot melt adhesive as the material, has excellent sealing and excellent physical properties, and the product performance has achieved insulation, temperature resistance, impact resistance, shock absorption, moisture resistance, waterproof, dustproof, chemical corrosion resistance and other effects.
This process is currently mainly used for the packaging and protection of precision and sensitive electronic components, including: printed circuit boards (PCBs), automotive electronics, mobile phone batteries, wiring harnesses, waterproof connectors, sensors, micro switches, inductors, antennas, etc.
Low-pressure injection molding plays a good protective role for electronic components. The traditional injection molding process is defective due to excessive pressure. Because low-pressure molding only requires a small pressure to make the melt flow into a small mold space, it will not damage the fragile components that need to be encapsulated, greatly reducing the scrap rate. The low-pressure injection molding process is not only environmentally friendly, but also greatly improves production efficiency and can help reduce the total production cost.
Low-pressure molding adhesives, this material is able to reach small areas without high pressure, making it ideal for sensitive components. The adhesive properties of polyamide provide the best adhesion and can effectively seal out moisture and other environmental contaminants. The high chemical resistance of low-pressure molding hot melt adhesives represented by polyamide to oil, diesel, grease and mild acids also improves the performance of the finished product.
From the historical data, due to the downturn in the consumer electronics industry and the cumulative impact of the COVID-19 pandemic, the development of low-pressure molding adhesives slowed down from 2019 to 2021, and the market entered an adjustment period. Since 2021, with the development of the new energy vehicle industry and the electrification transformation of automobiles, the industry has once again ushered in a new growth point; at the same time, the consumer electronics industry has also ushered in new growth opportunities with home office and study.
From a regional perspective, the Chinese market has changed rapidly in the past few years, accounting for about 24% of the world.
China is in a leading position in the electronics, new energy vehicles and semiconductor packaging industries, so the demand for low-pressure molding adhesives is relatively strong. It is also the current largest market, and there is still a lot of room for growth in the future.
In terms of product type and technology, polyamide occupies a major market share, accounting for 90.00% of the overall market.
At present, the world's major manufacturers include Henkel, Bostik (Arkema), Huntsman, etc. In 2022, the share of major manufacturers will exceed 83%. It is expected that industry competition will be more intense in the next few years, especially in the Chinese market.
The electrification of the automotive industry has brought new development directions to the low-pressure molding adhesive industry; due to its particularity, the automotive industry has high requirements for the durability and stability of parts, so the low-pressure molding process has a good application prospect; and with the new energy revolution in the automotive industry, more and more electronic devices are beginning to be used in automobiles, thus bringing new development opportunities for the low-pressure molding process. In addition, the sales of electronics and automotive industries in the Asia-Pacific region have grown rapidly in recent years, and the sales of low-pressure molding hot melt adhesives may increase significantly in the future.
This report is a detailed and comprehensive analysis for global Low Pressure Molding Adhesive market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Low Pressure Molding Adhesive market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Low Pressure Molding Adhesive market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Low Pressure Molding Adhesive market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Low Pressure Molding Adhesive market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Low Pressure Molding Adhesive
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Low Pressure Molding Adhesive market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, Bostik, Huntsman, SUNTIP, Liri New Chemical Materials, Bühnen, Darbond, KY Chemical, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Low Pressure Molding Adhesive market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
TPU
PO
Market segment by Application
Consumer electronics
Automotive
Medical Devices
Other
Major players covered
Henkel
Bostik
Huntsman
SUNTIP
Liri New Chemical Materials
Bühnen
Darbond
KY Chemical
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Low Pressure Molding Adhesive product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Low Pressure Molding Adhesive, with price, sales quantity, revenue, and global market share of Low Pressure Molding Adhesive from 2020 to 2025.
Chapter 3, the Low Pressure Molding Adhesive competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Low Pressure Molding Adhesive breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Low Pressure Molding Adhesive market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Low Pressure Molding Adhesive.
Chapter 14 and 15, to describe Low Pressure Molding Adhesive sales channel, distributors, customers, research findings and conclusion.
The low-pressure injection molding process is a packaging process that uses very low injection pressure to inject hot melt adhesive material into the mold and quickly solidify and mold (the speed is only 1-50 seconds). It uses hot melt adhesive as the material, has excellent sealing and excellent physical properties, and the product performance has achieved insulation, temperature resistance, impact resistance, shock absorption, moisture resistance, waterproof, dustproof, chemical corrosion resistance and other effects.
This process is currently mainly used for the packaging and protection of precision and sensitive electronic components, including: printed circuit boards (PCBs), automotive electronics, mobile phone batteries, wiring harnesses, waterproof connectors, sensors, micro switches, inductors, antennas, etc.
Low-pressure injection molding plays a good protective role for electronic components. The traditional injection molding process is defective due to excessive pressure. Because low-pressure molding only requires a small pressure to make the melt flow into a small mold space, it will not damage the fragile components that need to be encapsulated, greatly reducing the scrap rate. The low-pressure injection molding process is not only environmentally friendly, but also greatly improves production efficiency and can help reduce the total production cost.
Low-pressure molding adhesives, this material is able to reach small areas without high pressure, making it ideal for sensitive components. The adhesive properties of polyamide provide the best adhesion and can effectively seal out moisture and other environmental contaminants. The high chemical resistance of low-pressure molding hot melt adhesives represented by polyamide to oil, diesel, grease and mild acids also improves the performance of the finished product.
From the historical data, due to the downturn in the consumer electronics industry and the cumulative impact of the COVID-19 pandemic, the development of low-pressure molding adhesives slowed down from 2019 to 2021, and the market entered an adjustment period. Since 2021, with the development of the new energy vehicle industry and the electrification transformation of automobiles, the industry has once again ushered in a new growth point; at the same time, the consumer electronics industry has also ushered in new growth opportunities with home office and study.
From a regional perspective, the Chinese market has changed rapidly in the past few years, accounting for about 24% of the world.
China is in a leading position in the electronics, new energy vehicles and semiconductor packaging industries, so the demand for low-pressure molding adhesives is relatively strong. It is also the current largest market, and there is still a lot of room for growth in the future.
In terms of product type and technology, polyamide occupies a major market share, accounting for 90.00% of the overall market.
At present, the world's major manufacturers include Henkel, Bostik (Arkema), Huntsman, etc. In 2022, the share of major manufacturers will exceed 83%. It is expected that industry competition will be more intense in the next few years, especially in the Chinese market.
The electrification of the automotive industry has brought new development directions to the low-pressure molding adhesive industry; due to its particularity, the automotive industry has high requirements for the durability and stability of parts, so the low-pressure molding process has a good application prospect; and with the new energy revolution in the automotive industry, more and more electronic devices are beginning to be used in automobiles, thus bringing new development opportunities for the low-pressure molding process. In addition, the sales of electronics and automotive industries in the Asia-Pacific region have grown rapidly in recent years, and the sales of low-pressure molding hot melt adhesives may increase significantly in the future.
This report is a detailed and comprehensive analysis for global Low Pressure Molding Adhesive market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Low Pressure Molding Adhesive market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Low Pressure Molding Adhesive market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Low Pressure Molding Adhesive market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Low Pressure Molding Adhesive market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Low Pressure Molding Adhesive
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Low Pressure Molding Adhesive market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, Bostik, Huntsman, SUNTIP, Liri New Chemical Materials, Bühnen, Darbond, KY Chemical, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Low Pressure Molding Adhesive market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
TPU
PO
Market segment by Application
Consumer electronics
Automotive
Medical Devices
Other
Major players covered
Henkel
Bostik
Huntsman
SUNTIP
Liri New Chemical Materials
Bühnen
Darbond
KY Chemical
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Low Pressure Molding Adhesive product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Low Pressure Molding Adhesive, with price, sales quantity, revenue, and global market share of Low Pressure Molding Adhesive from 2020 to 2025.
Chapter 3, the Low Pressure Molding Adhesive competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Low Pressure Molding Adhesive breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Low Pressure Molding Adhesive market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Low Pressure Molding Adhesive.
Chapter 14 and 15, to describe Low Pressure Molding Adhesive sales channel, distributors, customers, research findings and conclusion.
Table of Contents
88 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Low Pressure Molding Adhesive by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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