Global Liquid Molding Compounds (LMC) Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Liquid Molding Compounds (LMC) market size was valued at US$ 617 million in 2024 and is forecast to a readjusted size of USD 1000 million by 2031 with a CAGR of 6.9% during review period.
Liquid Molding Compounds (LMC) are widely used in the semiconductor industry for the encapsulation of electronic components, particularly semiconductor devices such as integrated circuits (ICs), power semiconductors, and other microelectronics. LMCs serve as protective materials, ensuring that the sensitive internal circuitry of semiconductors is shielded from environmental factors such as moisture, chemicals, and physical stress. They also provide electrical insulation, thermal conductivity, and mechanical protection, which are critical for the long-term reliability and performance of semiconductor devices.
The Liquid Molding Compounds (LMC) market has been evolving as a critical component in semiconductor packaging, especially in advanced applications like 5G, automotive electronics, AI, and consumer electronics. LMC is used in encapsulating and protecting semiconductor devices during the packaging process, and its importance has surged with the increasing complexity and miniaturization of electronic components.
Demand Driven by Advanced Semiconductor Packaging:
High-performance packaging: With the rapid advancement in semiconductor technology, especially in areas like 5G and automotive electronics, LMC plays a crucial role in the protection and encapsulation of complex chips. System-in-Package (SiP) and 3D-IC packaging are growing, and LMC is essential for providing efficient, reliable, and high-performance protection in these advanced packaging techniques.
Miniaturization and integration: As semiconductor devices become smaller and more densely packed, LMC formulations are being adapted for thinner layers, higher precision, and more effective heat dissipation.
Technological Advancements in LMC:
Customization for specific applications: The trend is toward more specialized LMC formulations tailored for different semiconductor packages, such as flip-chip, ball grid array (BGA), and chip-on-wafer (COW). This ensures the performance characteristics (such as thermal conductivity, reliability, and moisture resistance) are optimized for the respective device.
Higher thermal conductivity: As power densities in devices increase, LMC with higher thermal conductivity is becoming more critical to efficiently dissipate heat from the chip, preventing thermal damage.
Low-stress formulations: To avoid damaging delicate semiconductor components, the focus has shifted toward developing low-stress LMCs that minimize mechanical stress during the curing process, especially important for advanced and stacked ICs.
This report is a detailed and comprehensive analysis for global Liquid Molding Compounds (LMC) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Liquid Molding Compounds (LMC) market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global Liquid Molding Compounds (LMC) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global Liquid Molding Compounds (LMC) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global Liquid Molding Compounds (LMC) market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Kg), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Liquid Molding Compounds (LMC)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Liquid Molding Compounds (LMC) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Nagase ChemteX, NAMICS, Shin-Etsu Chemical, Eternal Materials, HHCK, Scienchem, Wuhan Sanxuan Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Liquid Molding Compounds (LMC) market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Liquid Epoxy Underfill
Liquid Epoxy Encapsulat Material
Market segment by Application
Fan-Out Wafer Level Packaging (FOWLP)
Ball Grid Array Package (BGA)
Other
Major players covered
Nagase ChemteX
NAMICS
Shin-Etsu Chemical
Eternal Materials
HHCK
Scienchem
Wuhan Sanxuan Technology
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Liquid Molding Compounds (LMC) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Liquid Molding Compounds (LMC), with price, sales quantity, revenue, and global market share of Liquid Molding Compounds (LMC) from 2020 to 2025.
Chapter 3, the Liquid Molding Compounds (LMC) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Liquid Molding Compounds (LMC) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Liquid Molding Compounds (LMC) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Liquid Molding Compounds (LMC).
Chapter 14 and 15, to describe Liquid Molding Compounds (LMC) sales channel, distributors, customers, research findings and conclusion.
Liquid Molding Compounds (LMC) are widely used in the semiconductor industry for the encapsulation of electronic components, particularly semiconductor devices such as integrated circuits (ICs), power semiconductors, and other microelectronics. LMCs serve as protective materials, ensuring that the sensitive internal circuitry of semiconductors is shielded from environmental factors such as moisture, chemicals, and physical stress. They also provide electrical insulation, thermal conductivity, and mechanical protection, which are critical for the long-term reliability and performance of semiconductor devices.
The Liquid Molding Compounds (LMC) market has been evolving as a critical component in semiconductor packaging, especially in advanced applications like 5G, automotive electronics, AI, and consumer electronics. LMC is used in encapsulating and protecting semiconductor devices during the packaging process, and its importance has surged with the increasing complexity and miniaturization of electronic components.
Demand Driven by Advanced Semiconductor Packaging:
High-performance packaging: With the rapid advancement in semiconductor technology, especially in areas like 5G and automotive electronics, LMC plays a crucial role in the protection and encapsulation of complex chips. System-in-Package (SiP) and 3D-IC packaging are growing, and LMC is essential for providing efficient, reliable, and high-performance protection in these advanced packaging techniques.
Miniaturization and integration: As semiconductor devices become smaller and more densely packed, LMC formulations are being adapted for thinner layers, higher precision, and more effective heat dissipation.
Technological Advancements in LMC:
Customization for specific applications: The trend is toward more specialized LMC formulations tailored for different semiconductor packages, such as flip-chip, ball grid array (BGA), and chip-on-wafer (COW). This ensures the performance characteristics (such as thermal conductivity, reliability, and moisture resistance) are optimized for the respective device.
Higher thermal conductivity: As power densities in devices increase, LMC with higher thermal conductivity is becoming more critical to efficiently dissipate heat from the chip, preventing thermal damage.
Low-stress formulations: To avoid damaging delicate semiconductor components, the focus has shifted toward developing low-stress LMCs that minimize mechanical stress during the curing process, especially important for advanced and stacked ICs.
This report is a detailed and comprehensive analysis for global Liquid Molding Compounds (LMC) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Liquid Molding Compounds (LMC) market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global Liquid Molding Compounds (LMC) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global Liquid Molding Compounds (LMC) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global Liquid Molding Compounds (LMC) market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Kg), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Liquid Molding Compounds (LMC)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Liquid Molding Compounds (LMC) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Nagase ChemteX, NAMICS, Shin-Etsu Chemical, Eternal Materials, HHCK, Scienchem, Wuhan Sanxuan Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Liquid Molding Compounds (LMC) market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Liquid Epoxy Underfill
Liquid Epoxy Encapsulat Material
Market segment by Application
Fan-Out Wafer Level Packaging (FOWLP)
Ball Grid Array Package (BGA)
Other
Major players covered
Nagase ChemteX
NAMICS
Shin-Etsu Chemical
Eternal Materials
HHCK
Scienchem
Wuhan Sanxuan Technology
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Liquid Molding Compounds (LMC) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Liquid Molding Compounds (LMC), with price, sales quantity, revenue, and global market share of Liquid Molding Compounds (LMC) from 2020 to 2025.
Chapter 3, the Liquid Molding Compounds (LMC) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Liquid Molding Compounds (LMC) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Liquid Molding Compounds (LMC) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Liquid Molding Compounds (LMC).
Chapter 14 and 15, to describe Liquid Molding Compounds (LMC) sales channel, distributors, customers, research findings and conclusion.
Table of Contents
86 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Liquid Molding Compounds (LMC) by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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