Global Indium Solder Preforms Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Indium Solder Preforms market size was valued at US$ 1171 million in 2024 and is forecast to a readjusted size of USD 1611 million by 2031 with a CAGR of 4.8% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Indium solder preforms are precision-engineered, pre-shaped pieces of solder made primarily from indium or indium-based alloys. These preforms are typically produced in standard shapes such as washers, rectangles, squares, or custom geometries to meet the requirements of specific bonding applications. Indium solder preforms are valued for their low melting points, excellent wetting properties, and high ductility, making them ideal for delicate or heat-sensitive components. They are commonly used in microelectronics, optoelectronics, thermal management interfaces, and hermetic sealing due to their ability to form strong, reliable, and void-free solder joints at low processing temperatures.
Indium solder preforms are available in various alloy compositions such as pure indium (99.99%), InSn50, InBi58, and InAg3.5, with melting points ranging from approximately 72 °C (InBi58) to 157 °C (pure indium), making them ideal for low-temperature applications. Typical product dimensions range from 25 to 250 µm in thickness, with customizable shapes like rectangles, washers, and discs. They offer high thermal conductivity (up to ~86 W/m·K for pure indium), excellent electrical conductivity (~11.7 × 10⁶ S/m), and strong wettability on metals like gold, copper, and nickel. These properties make indium preforms suitable for demanding uses in optoelectronics, semiconductors, aerospace, and thermal management systems.
This report is a detailed and comprehensive analysis for global Indium Solder Preforms market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Indium Solder Preforms market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Indium Solder Preforms market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Indium Solder Preforms market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Indium Solder Preforms market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Indium Solder Preforms
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Indium Solder Preforms market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Indium Corporation, Materion Corporation, Canfield Technologies, MacDermid Alpha, AIM Solder, Coining MFG, Senju Metal Industry, Guangdong Zhongshi Metals, Shenzhen Jufeng Solder, Shenzhen Fromosol Metal, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Indium Solder Preforms market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Pure Indium Preforms
Indium-Silver Preforms
Indium-Tin Preforms
Indium-Bismuth Preforms
Market segment by Application
Semiconductor
Aerospace
Medical Devices
Automotive Electronics
Consumer Electronics
Others
Major players covered
Indium Corporation
Materion Corporation
Canfield Technologies
MacDermid Alpha
AIM Solder
Coining MFG
Senju Metal Industry
Guangdong Zhongshi Metals
Shenzhen Jufeng Solder
Shenzhen Fromosol Metal
Zhejiang QLG Holdings
Samytronic
Array Solders
Element Solutions
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Indium Solder Preforms product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Indium Solder Preforms, with price, sales quantity, revenue, and global market share of Indium Solder Preforms from 2020 to 2025.
Chapter 3, the Indium Solder Preforms competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Indium Solder Preforms breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Indium Solder Preforms market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Indium Solder Preforms.
Chapter 14 and 15, to describe Indium Solder Preforms sales channel, distributors, customers, research findings and conclusion.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Indium solder preforms are precision-engineered, pre-shaped pieces of solder made primarily from indium or indium-based alloys. These preforms are typically produced in standard shapes such as washers, rectangles, squares, or custom geometries to meet the requirements of specific bonding applications. Indium solder preforms are valued for their low melting points, excellent wetting properties, and high ductility, making them ideal for delicate or heat-sensitive components. They are commonly used in microelectronics, optoelectronics, thermal management interfaces, and hermetic sealing due to their ability to form strong, reliable, and void-free solder joints at low processing temperatures.
Indium solder preforms are available in various alloy compositions such as pure indium (99.99%), InSn50, InBi58, and InAg3.5, with melting points ranging from approximately 72 °C (InBi58) to 157 °C (pure indium), making them ideal for low-temperature applications. Typical product dimensions range from 25 to 250 µm in thickness, with customizable shapes like rectangles, washers, and discs. They offer high thermal conductivity (up to ~86 W/m·K for pure indium), excellent electrical conductivity (~11.7 × 10⁶ S/m), and strong wettability on metals like gold, copper, and nickel. These properties make indium preforms suitable for demanding uses in optoelectronics, semiconductors, aerospace, and thermal management systems.
This report is a detailed and comprehensive analysis for global Indium Solder Preforms market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Indium Solder Preforms market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Indium Solder Preforms market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Indium Solder Preforms market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Indium Solder Preforms market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Indium Solder Preforms
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Indium Solder Preforms market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Indium Corporation, Materion Corporation, Canfield Technologies, MacDermid Alpha, AIM Solder, Coining MFG, Senju Metal Industry, Guangdong Zhongshi Metals, Shenzhen Jufeng Solder, Shenzhen Fromosol Metal, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Indium Solder Preforms market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Pure Indium Preforms
Indium-Silver Preforms
Indium-Tin Preforms
Indium-Bismuth Preforms
Market segment by Application
Semiconductor
Aerospace
Medical Devices
Automotive Electronics
Consumer Electronics
Others
Major players covered
Indium Corporation
Materion Corporation
Canfield Technologies
MacDermid Alpha
AIM Solder
Coining MFG
Senju Metal Industry
Guangdong Zhongshi Metals
Shenzhen Jufeng Solder
Shenzhen Fromosol Metal
Zhejiang QLG Holdings
Samytronic
Array Solders
Element Solutions
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Indium Solder Preforms product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Indium Solder Preforms, with price, sales quantity, revenue, and global market share of Indium Solder Preforms from 2020 to 2025.
Chapter 3, the Indium Solder Preforms competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Indium Solder Preforms breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Indium Solder Preforms market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Indium Solder Preforms.
Chapter 14 and 15, to describe Indium Solder Preforms sales channel, distributors, customers, research findings and conclusion.
Table of Contents
110 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Indium Solder Preforms by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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