Global IGBT Laser Annealing Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global IGBT Laser Annealing Equipment market size was valued at US$ 463 million in 2024 and is forecast to a readjusted size of USD 857 million by 2031 with a CAGR of 9.5% during review period.
Laser annealing equipment refers to special equipment that uses high-energy laser beams to automatically anneal wafers. Its main function is to project a laser beam spot of a specific shape and uniform energy distribution onto a semiconductor wafer, and the moving table carries and adsorbs the wafer for scanning to complete the annealing of the entire wafer. Laser annealing equipment mainly includes IGBT laser annealing and IC front-end laser annealing equipment.
Among them, IGBT laser annealing is mainly aimed at the manufacture of IGBT power devices. For 4-inch, 6-inch, 8-inch, and 12-inch wafers, high-energy laser beams are used for automatic annealing process processing, which has the advantages of high instantaneous temperature, short action time, and low thermal budget. It can better meet the process requirements of plate processing and efficient activation.
In the manufacturing process of semiconductor devices, in order to form specific doping in silicon wafers, multiple ion implantation processes are required during the manufacturing process. During the ion input process, the bombardment of impurity ions will cause a certain degree of lattice damage to the silicon atoms in the wafer, resulting in the impurity ions not being able to be located in the correct lattice position and not having the proper electrical activity. Therefore, the wafer needs to be heat treated to repair the lattice and activate the electrical activity of the impurity ions. This heat treatment process is called annealing.
IGBT has become one of the fastest-growing power devices with its excellent performance. With the maturity of wafer thinning technology, thin-film high-voltage IGBT will become a future development trend; in addition, as the research and development of the third-generation wide bandgap semiconductor material SiC becomes more mature, the demand for SiC devices will gradually increase. IGBT laser annealing will still be one of the mainstream technologies in the future.
This report is a detailed and comprehensive analysis for global IGBT Laser Annealing Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global IGBT Laser Annealing Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global IGBT Laser Annealing Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global IGBT Laser Annealing Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global IGBT Laser Annealing Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for IGBT Laser Annealing Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global IGBT Laser Annealing Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions, Hitachi, YAC BEAM, SMEE, EO Technics, Beijing U-PRECISION Tech, Chengdu Laipu Technology, Hans DSI, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
IGBT Laser Annealing Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
200mm
300mm
Others
Market segment by Application
Automotice
Industrial Control
Home Appliances
Wind Power and Photovoltaics
Rail Transportation
Aerospace
Others
Major players covered
Mitsui Group (JSW)
Sumitomo Heavy Industries
SCREEN Semiconductor Solutions
Hitachi
YAC BEAM
SMEE
EO Technics
Beijing U-PRECISION Tech
Chengdu Laipu Technology
Hans DSI
ETA Semitech
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe IGBT Laser Annealing Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of IGBT Laser Annealing Equipment, with price, sales quantity, revenue, and global market share of IGBT Laser Annealing Equipment from 2020 to 2025.
Chapter 3, the IGBT Laser Annealing Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the IGBT Laser Annealing Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and IGBT Laser Annealing Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of IGBT Laser Annealing Equipment.
Chapter 14 and 15, to describe IGBT Laser Annealing Equipment sales channel, distributors, customers, research findings and conclusion.
Laser annealing equipment refers to special equipment that uses high-energy laser beams to automatically anneal wafers. Its main function is to project a laser beam spot of a specific shape and uniform energy distribution onto a semiconductor wafer, and the moving table carries and adsorbs the wafer for scanning to complete the annealing of the entire wafer. Laser annealing equipment mainly includes IGBT laser annealing and IC front-end laser annealing equipment.
Among them, IGBT laser annealing is mainly aimed at the manufacture of IGBT power devices. For 4-inch, 6-inch, 8-inch, and 12-inch wafers, high-energy laser beams are used for automatic annealing process processing, which has the advantages of high instantaneous temperature, short action time, and low thermal budget. It can better meet the process requirements of plate processing and efficient activation.
In the manufacturing process of semiconductor devices, in order to form specific doping in silicon wafers, multiple ion implantation processes are required during the manufacturing process. During the ion input process, the bombardment of impurity ions will cause a certain degree of lattice damage to the silicon atoms in the wafer, resulting in the impurity ions not being able to be located in the correct lattice position and not having the proper electrical activity. Therefore, the wafer needs to be heat treated to repair the lattice and activate the electrical activity of the impurity ions. This heat treatment process is called annealing.
IGBT has become one of the fastest-growing power devices with its excellent performance. With the maturity of wafer thinning technology, thin-film high-voltage IGBT will become a future development trend; in addition, as the research and development of the third-generation wide bandgap semiconductor material SiC becomes more mature, the demand for SiC devices will gradually increase. IGBT laser annealing will still be one of the mainstream technologies in the future.
This report is a detailed and comprehensive analysis for global IGBT Laser Annealing Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global IGBT Laser Annealing Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global IGBT Laser Annealing Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global IGBT Laser Annealing Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global IGBT Laser Annealing Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for IGBT Laser Annealing Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global IGBT Laser Annealing Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions, Hitachi, YAC BEAM, SMEE, EO Technics, Beijing U-PRECISION Tech, Chengdu Laipu Technology, Hans DSI, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
IGBT Laser Annealing Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
200mm
300mm
Others
Market segment by Application
Automotice
Industrial Control
Home Appliances
Wind Power and Photovoltaics
Rail Transportation
Aerospace
Others
Major players covered
Mitsui Group (JSW)
Sumitomo Heavy Industries
SCREEN Semiconductor Solutions
Hitachi
YAC BEAM
SMEE
EO Technics
Beijing U-PRECISION Tech
Chengdu Laipu Technology
Hans DSI
ETA Semitech
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe IGBT Laser Annealing Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of IGBT Laser Annealing Equipment, with price, sales quantity, revenue, and global market share of IGBT Laser Annealing Equipment from 2020 to 2025.
Chapter 3, the IGBT Laser Annealing Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the IGBT Laser Annealing Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and IGBT Laser Annealing Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of IGBT Laser Annealing Equipment.
Chapter 14 and 15, to describe IGBT Laser Annealing Equipment sales channel, distributors, customers, research findings and conclusion.
Table of Contents
108 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: IGBT Laser Annealing Equipment by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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