Global IC Package Substrates Supply, Demand and Key Producers, 2026-2032

The global IC Package Substrates market size is expected to reach $ 32970 million by 2032, rising at a market growth of 8.7% CAGR during the forecast period (2026-2032).

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.

The major manufacturers that provide IC Package Substrates in China include SCC, Nanya and Access Substrates, etc. The top three manufacturers account for more than 50% of the market share. Among them, WB BGA and FC-CSP accounted for 39% and 38%, respectively. Smartphones and PCs (tablets and laptops) are the most widely used, accounting for 64% and 23%, respectively.

Surging Demand for Advanced Processors in AI and High-Performance Computing (HPC): The proliferation of artificial intelligence (AI) applications and HPC has escalated the need for sophisticated processors. These processors require advanced IC substrates to ensure efficient performance and reliability.

Expansion of Data Centers and Cloud Computing Services: The global increase in data centers and cloud services necessitates high-performance IC substrates to support robust server and storage solutions, driving market growth.

Advancements in 5G and Emerging 6G Technologies: The rollout of 5G networks and the anticipation of 6G have heightened the demand for advanced IC substrates capable of supporting faster and more efficient data transmission.

Miniaturization and Heterogeneous Integration in Electronics: The trend toward smaller, more complex electronic devices has led to increased adoption of heterogeneous integration. Advanced IC substrates are essential in accommodating multiple chips within compact designs.

Growth in Automotive Electronics: The automotive industry's shift toward electric vehicles (EVs) and autonomous driving technologies has amplified the need for advanced IC substrates to support complex electronic systems within vehicles.

Emergence of Internet of Things (IoT) Devices: The expanding IoT landscape requires efficient and compact IC substrates to facilitate connectivity and functionality across a myriad of devices.

This report studies the global IC Package Substrates production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for IC Package Substrates and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of IC Package Substrates that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global IC Package Substrates total production and demand, 2021-2032, (K Sqm)

Global IC Package Substrates total production value, 2021-2032, (USD Million)

Global IC Package Substrates production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (K Sqm), (based on production site)

Global IC Package Substrates consumption by region & country, CAGR, 2021-2032 & (K Sqm)

U.S. VS China: IC Package Substrates domestic production, consumption, key domestic manufacturers and share

Global IC Package Substrates production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (K Sqm)

Global IC Package Substrates production by Type, production, value, CAGR, 2021-2032, (USD Million) & (K Sqm)

Global IC Package Substrates production by Application, production, value, CAGR, 2021-2032, (USD Million) & (K Sqm)

This report profiles key players in the global IC Package Substrates market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Ibiden, Kinsus Interconnect Technology, Unimicron, Shinko Electric Industries, Semco, Simmtech, Nanya, Kyocera, LG Innotek, AT&S, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World IC Package Substrates market

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Sqm) and average price (US$/Sqm) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.

Global IC Package Substrates Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global IC Package Substrates Market, Segmentation by Type:
FC-BGA
FC-CSP
WB BGA
WB CSP
RF Module
Others

Global IC Package Substrates Market, Segmentation by Application:
Automotive
Mobile Electronics
PC (Tablet, Laptop)
Medical
Industrial
Other

Companies Profiled:
Ibiden
Kinsus Interconnect Technology
Unimicron
Shinko Electric Industries
Semco
Simmtech
Nanya
Kyocera
LG Innotek
AT&S
ASE
Daeduck
Shennan Circuit
Zhen Ding Technology
KCC (Korea Circuit Company)
ACCESS
Shenzhen Fastprint Circuit Tech
AKM Meadville
Toppan Printing

Key Questions Answered:

1. How big is the global IC Package Substrates market?

2. What is the demand of the global IC Package Substrates market?

3. What is the year over year growth of the global IC Package Substrates market?

4. What is the production and production value of the global IC Package Substrates market?

5. Who are the key producers in the global IC Package Substrates market?

6. What are the growth factors driving the market demand? Show more