Global IC and LED Lead Frames Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global IC and LED Lead Frames market size was valued at US$ 3995 million in 2024 and is forecast to a readjusted size of USD 5684 million by 2031 with a CAGR of 5.2% during review period.
Lead Frame is the basic component that delivers electric signal to external circuits and supports the chip inside of semiconductor package mechanically. A lead frame consists of a die mounting paddle and lead fingers. The die paddle serves primarily to mechanically support the die during package manufacture. The lead fingers connect the die to the circuitry external to the package.
Sumitomo Metal Mining Co., Ltd. (SMM) has withdrawn from the lead frame business, based on an assessment of the changing business environment. The lead frame market itself has gone from a growth market to the mature phase, resulting in over-commoditization of lead frame products. Moreover, the emergence of Chinese local manufacturers has intensified competition for these products. On March 17, 2017, Chang Wah Technology purchased SH Asia Pacific Pte. Ltd., a Singapore-based investment company, from SH Materials Co., Ltd. (SHM). In 2017, Jin Lin Technology has merger and acquisition three power device lead manufacturer from Japan Sumitomo Metals (SMM), which are SH Precision Co., Ltd (Japan), Suzhou SH Precision Co., Ltd (China) and Malaysian SH Precision Sdn Bhd (Malaysia). Nowadays, Jih Lin Technology is status as the top power devices lead frame manufacturer of the world. On 28 July 2020, ASM Pacific Technology, together with Wise Road Capital LTD and Asia-IO Capital Management Limited, announced the formation of a Strategic Joint Venture (“SJV”) for ASM Pacific Technology’s Materials Segment Business Unit, which produces lead frames.
This report is a detailed and comprehensive analysis for global IC and LED Lead Frames market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global IC and LED Lead Frames market size and forecasts, in consumption value ($ Million), sales quantity (B Units), and average selling prices (US$/K Units), 2020-2031
Global IC and LED Lead Frames market size and forecasts by region and country, in consumption value ($ Million), sales quantity (B Units), and average selling prices (US$/K Units), 2020-2031
Global IC and LED Lead Frames market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (B Units), and average selling prices (US$/K Units), 2020-2031
Global IC and LED Lead Frames market shares of main players, shipments in revenue ($ Million), sales quantity (B Units), and ASP (US$/K Units), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for IC and LED Lead Frames
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global IC and LED Lead Frames market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsui High-tec, Shinko, Chang Wah Technology, Advanced Assembly Materials International, HAESUNG DS, SDI, Fusheng Electronics, Enomoto, Kangqiang, POSSEHL, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
IC and LED Lead Frames market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
DIP
SOP
SOT
QFP
DFN
QFN
FC
TO
Others
Market segment by Application
Integrated Circuit
Discrete Device
LED
Major players covered
Mitsui High-tec
Shinko
Chang Wah Technology
Advanced Assembly Materials International
HAESUNG DS
SDI
Fusheng Electronics
Enomoto
Kangqiang
POSSEHL
JIH LIN TECHNOLOGY
Jentech
Hualong
Dynacraft Industries
QPL Limited
WUXI HUAJING LEADFRAME
HUAYANG ELECTRONIC
DNP
Xiamen Jsun Precision Technology
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe IC and LED Lead Frames product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of IC and LED Lead Frames, with price, sales quantity, revenue, and global market share of IC and LED Lead Frames from 2020 to 2025.
Chapter 3, the IC and LED Lead Frames competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the IC and LED Lead Frames breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and IC and LED Lead Frames market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of IC and LED Lead Frames.
Chapter 14 and 15, to describe IC and LED Lead Frames sales channel, distributors, customers, research findings and conclusion.
Lead Frame is the basic component that delivers electric signal to external circuits and supports the chip inside of semiconductor package mechanically. A lead frame consists of a die mounting paddle and lead fingers. The die paddle serves primarily to mechanically support the die during package manufacture. The lead fingers connect the die to the circuitry external to the package.
Sumitomo Metal Mining Co., Ltd. (SMM) has withdrawn from the lead frame business, based on an assessment of the changing business environment. The lead frame market itself has gone from a growth market to the mature phase, resulting in over-commoditization of lead frame products. Moreover, the emergence of Chinese local manufacturers has intensified competition for these products. On March 17, 2017, Chang Wah Technology purchased SH Asia Pacific Pte. Ltd., a Singapore-based investment company, from SH Materials Co., Ltd. (SHM). In 2017, Jin Lin Technology has merger and acquisition three power device lead manufacturer from Japan Sumitomo Metals (SMM), which are SH Precision Co., Ltd (Japan), Suzhou SH Precision Co., Ltd (China) and Malaysian SH Precision Sdn Bhd (Malaysia). Nowadays, Jih Lin Technology is status as the top power devices lead frame manufacturer of the world. On 28 July 2020, ASM Pacific Technology, together with Wise Road Capital LTD and Asia-IO Capital Management Limited, announced the formation of a Strategic Joint Venture (“SJV”) for ASM Pacific Technology’s Materials Segment Business Unit, which produces lead frames.
This report is a detailed and comprehensive analysis for global IC and LED Lead Frames market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global IC and LED Lead Frames market size and forecasts, in consumption value ($ Million), sales quantity (B Units), and average selling prices (US$/K Units), 2020-2031
Global IC and LED Lead Frames market size and forecasts by region and country, in consumption value ($ Million), sales quantity (B Units), and average selling prices (US$/K Units), 2020-2031
Global IC and LED Lead Frames market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (B Units), and average selling prices (US$/K Units), 2020-2031
Global IC and LED Lead Frames market shares of main players, shipments in revenue ($ Million), sales quantity (B Units), and ASP (US$/K Units), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for IC and LED Lead Frames
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global IC and LED Lead Frames market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsui High-tec, Shinko, Chang Wah Technology, Advanced Assembly Materials International, HAESUNG DS, SDI, Fusheng Electronics, Enomoto, Kangqiang, POSSEHL, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
IC and LED Lead Frames market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
DIP
SOP
SOT
QFP
DFN
QFN
FC
TO
Others
Market segment by Application
Integrated Circuit
Discrete Device
LED
Major players covered
Mitsui High-tec
Shinko
Chang Wah Technology
Advanced Assembly Materials International
HAESUNG DS
SDI
Fusheng Electronics
Enomoto
Kangqiang
POSSEHL
JIH LIN TECHNOLOGY
Jentech
Hualong
Dynacraft Industries
QPL Limited
WUXI HUAJING LEADFRAME
HUAYANG ELECTRONIC
DNP
Xiamen Jsun Precision Technology
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe IC and LED Lead Frames product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of IC and LED Lead Frames, with price, sales quantity, revenue, and global market share of IC and LED Lead Frames from 2020 to 2025.
Chapter 3, the IC and LED Lead Frames competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the IC and LED Lead Frames breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and IC and LED Lead Frames market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of IC and LED Lead Frames.
Chapter 14 and 15, to describe IC and LED Lead Frames sales channel, distributors, customers, research findings and conclusion.
Table of Contents
144 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: IC and LED Lead Frames by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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