Global High Speed PCB Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global High Speed PCB market size was valued at US$ 6218 million in 2024 and is forecast to a readjusted size of USD 9018 million by 2031 with a CAGR of 5.2% during review period.
High-speed PCB designs are becoming more prevalent today. High-speed PCB design refers to the process of designing printed circuit boards that are intended to transmit and receive signals at high frequencies. These types of PCBs are commonly used in electronic devices such as computers, smartphones, routers, and other high-speed data communication systems. The signal densities of high-speed PCBs run into a few GHz. Hence, the fundamentals of high-speed design, routing, and layout are crucial to mitigate issues such as EMI in these boards. With the rise of advanced technologies like 5G, the Internet of Things (IoT), and artificial intelligence (AI), designers are challenged to create PCBs that can support high-speed communication, processing, and storage.
High-Speed Printed Circuit Boards (PCBs) are engineered to handle high-frequency signals, typically above 50 MHz, ensuring reliable and rapid data transmission. These PCBs are essential in applications where signal integrity and minimal latency are critical.
High-Speed PCBs are foundational to modern electronics, driven by advancements in AI, 5G, and automotive innovation. Regional markets like China and North America will continue to lead production and R&D, while material science and miniaturization will define future competitiveness. Companies must prioritize collaboration with IC designers and adopt eco-friendly practices to align with global regulatory trends.
The global PCB market was valued at US$ 78.9billion in 2024 and is anticipated to reach US$ 101.6 billion by 2031, witnessing a CAGR of 4.86% during the forecast period 2025-2031. Asia-Pacific dominates the market, accounting for over 85% of global PCB production, led by China Mainland, China Taiwan, and South Korea. The major global manufacturers of PCB include Unimicron, DSBJ (Dongshan Precision), Zhen Ding Technology, Kinwong, Shennan Circuit, Tripod Technology, Suntak Technology, Shenzhen Fastprint Circuit Tech, and Gul Technologies Group, etc. In 2024, the world's top 20 manufacturers accounted for approximately 54.12 % of the revenue.
This report is a detailed and comprehensive analysis for global High Speed PCB market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global High Speed PCB market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031
Global High Speed PCB market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031
Global High Speed PCB market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031
Global High Speed PCB market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sqm), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for High Speed PCB
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global High Speed PCB market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Kinwong, Shennan Circuit, Suntak Technology, Shenzhen Fastprint Circuit Tech, Gul Technologies Group, Kingboard Holdings, WUS Printed Circuit (Kunshan), Victory Giant Technology, Dongguan Shengyi Electronics, Murata Manufacturing, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
High Speed PCB market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Multilayer PCB
HDI PCB
FPC PCB
Market segment by Application
Wireline & Wireless Networks
Server & Storage
Enterprise Network
Others
Major players covered
Kinwong
Shennan Circuit
Suntak Technology
Shenzhen Fastprint Circuit Tech
Gul Technologies Group
Kingboard Holdings
WUS Printed Circuit (Kunshan)
Victory Giant Technology
Dongguan Shengyi Electronics
Murata Manufacturing
Bomin Electronics
Guangdong Ellington Electronic Technology
DSBJ (Dongshan Precision)
Unimicron
Founder PCB
Nippon Mektron
TTM Technologies, Inc
Nan Ya PCB
Meiko Electronics
Daeduck Electronics
Simmtech
AKM Meadville
Fujikura Printed Circuits
CMK Corporation
Aoshikang Technology
Dynamic Electronics
Jiangsu Allfavor Intelligent Circuits Technology
Guangdong Kingshine Electronics
Sunshine Global Circuits
Glorysky Electronics
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe High Speed PCB product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of High Speed PCB, with price, sales quantity, revenue, and global market share of High Speed PCB from 2020 to 2025.
Chapter 3, the High Speed PCB competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the High Speed PCB breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and High Speed PCB market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of High Speed PCB.
Chapter 14 and 15, to describe High Speed PCB sales channel, distributors, customers, research findings and conclusion.
High-speed PCB designs are becoming more prevalent today. High-speed PCB design refers to the process of designing printed circuit boards that are intended to transmit and receive signals at high frequencies. These types of PCBs are commonly used in electronic devices such as computers, smartphones, routers, and other high-speed data communication systems. The signal densities of high-speed PCBs run into a few GHz. Hence, the fundamentals of high-speed design, routing, and layout are crucial to mitigate issues such as EMI in these boards. With the rise of advanced technologies like 5G, the Internet of Things (IoT), and artificial intelligence (AI), designers are challenged to create PCBs that can support high-speed communication, processing, and storage.
High-Speed Printed Circuit Boards (PCBs) are engineered to handle high-frequency signals, typically above 50 MHz, ensuring reliable and rapid data transmission. These PCBs are essential in applications where signal integrity and minimal latency are critical.
High-Speed PCBs are foundational to modern electronics, driven by advancements in AI, 5G, and automotive innovation. Regional markets like China and North America will continue to lead production and R&D, while material science and miniaturization will define future competitiveness. Companies must prioritize collaboration with IC designers and adopt eco-friendly practices to align with global regulatory trends.
The global PCB market was valued at US$ 78.9billion in 2024 and is anticipated to reach US$ 101.6 billion by 2031, witnessing a CAGR of 4.86% during the forecast period 2025-2031. Asia-Pacific dominates the market, accounting for over 85% of global PCB production, led by China Mainland, China Taiwan, and South Korea. The major global manufacturers of PCB include Unimicron, DSBJ (Dongshan Precision), Zhen Ding Technology, Kinwong, Shennan Circuit, Tripod Technology, Suntak Technology, Shenzhen Fastprint Circuit Tech, and Gul Technologies Group, etc. In 2024, the world's top 20 manufacturers accounted for approximately 54.12 % of the revenue.
This report is a detailed and comprehensive analysis for global High Speed PCB market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global High Speed PCB market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031
Global High Speed PCB market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031
Global High Speed PCB market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031
Global High Speed PCB market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sqm), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for High Speed PCB
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global High Speed PCB market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Kinwong, Shennan Circuit, Suntak Technology, Shenzhen Fastprint Circuit Tech, Gul Technologies Group, Kingboard Holdings, WUS Printed Circuit (Kunshan), Victory Giant Technology, Dongguan Shengyi Electronics, Murata Manufacturing, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
High Speed PCB market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Multilayer PCB
HDI PCB
FPC PCB
Market segment by Application
Wireline & Wireless Networks
Server & Storage
Enterprise Network
Others
Major players covered
Kinwong
Shennan Circuit
Suntak Technology
Shenzhen Fastprint Circuit Tech
Gul Technologies Group
Kingboard Holdings
WUS Printed Circuit (Kunshan)
Victory Giant Technology
Dongguan Shengyi Electronics
Murata Manufacturing
Bomin Electronics
Guangdong Ellington Electronic Technology
DSBJ (Dongshan Precision)
Unimicron
Founder PCB
Nippon Mektron
TTM Technologies, Inc
Nan Ya PCB
Meiko Electronics
Daeduck Electronics
Simmtech
AKM Meadville
Fujikura Printed Circuits
CMK Corporation
Aoshikang Technology
Dynamic Electronics
Jiangsu Allfavor Intelligent Circuits Technology
Guangdong Kingshine Electronics
Sunshine Global Circuits
Glorysky Electronics
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe High Speed PCB product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of High Speed PCB, with price, sales quantity, revenue, and global market share of High Speed PCB from 2020 to 2025.
Chapter 3, the High Speed PCB competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the High Speed PCB breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and High Speed PCB market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of High Speed PCB.
Chapter 14 and 15, to describe High Speed PCB sales channel, distributors, customers, research findings and conclusion.
Table of Contents
180 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: High Speed PCB by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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