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Global High Bandwidth Memory (HBM) Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

Publisher GlobalInfoResearch
Published Sep 16, 2025
Length 73 Pages
SKU # GFSH20403145

Description

According to our (Global Info Research) latest study, the global High Bandwidth Memory (HBM) market size was valued at US$ 3913 million in 2024 and is forecast to a readjusted size of USD 134370 million by 2031 with a CAGR of 66.5% during review period.

High Bandwidth Memory (HBM) is a high-speed computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM).

The core manufacturers of High Bandwidth Memory (HBM) in the world include SK Hynix and Samsung. The top two companies have a market share of about 91 percent. North America is the world's largest High Bandwidth Memory (HBM) market with a market share of around 55%, followed by Asia Pacific and Europe with a market share of 27% and 18%, respectively. In terms of product type, HBM2E is the largest segment with approximately 54% market share. In terms of application, Servers is the largest downstream segment, accounting for about 63 percent of the market.

This report is a detailed and comprehensive analysis for global High Bandwidth Memory (HBM) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global High Bandwidth Memory (HBM) market size and forecasts, in consumption value ($ Million), sales quantity (Million GB), and average selling prices (US$/GB), 2020-2031

Global High Bandwidth Memory (HBM) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Million GB), and average selling prices (US$/GB), 2020-2031

Global High Bandwidth Memory (HBM) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Million GB), and average selling prices (US$/GB), 2020-2031

Global High Bandwidth Memory (HBM) market shares of main players, shipments in revenue ($ Million), sales quantity (Million GB), and ASP (US$/GB), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for High Bandwidth Memory (HBM)

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global High Bandwidth Memory (HBM) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include SK Hynix, Samsung, Micron, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

High Bandwidth Memory (HBM) market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
HBM2
HBM2E
HBM3
HBM3E
Others

Market segment by Application
Servers
Networking
Consumer
Others

Major players covered
SK Hynix
Samsung
Micron

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe High Bandwidth Memory (HBM) product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of High Bandwidth Memory (HBM), with price, sales quantity, revenue, and global market share of High Bandwidth Memory (HBM) from 2020 to 2025.

Chapter 3, the High Bandwidth Memory (HBM) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the High Bandwidth Memory (HBM) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and High Bandwidth Memory (HBM) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of High Bandwidth Memory (HBM).

Chapter 14 and 15, to describe High Bandwidth Memory (HBM) sales channel, distributors, customers, research findings and conclusion.

Table of Contents

73 Pages
1 Market Overview
2 Manufacturers Profiles
3 Competitive Environment: High Bandwidth Memory (HBM) by Manufacturer
4 Consumption Analysis by Region
5 Market Segment by Type
6 Market Segment by Application
7 North America
8 Europe
9 Asia-Pacific
10 South America
11 Middle East & Africa
12 Market Dynamics
13 Raw Material and Industry Chain
14 Shipments by Distribution Channel
15 Research Findings and Conclusion
16 Appendix
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