Global Grinding Wheels for Wafers Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Grinding Wheels for Wafers market size was valued at US$ 95.8 million in 2024 and is forecast to a readjusted size of USD 171 million by 2031 with a CAGR of 8.6% during review period.

Grinding wheels for wafers are specialized tools used in semiconductor manufacturing to thin and shape silicon wafers with high precision. These wheels are made of abrasive materials, such as diamond or cubic boron nitride, bonded to a substrate, enabling them to achieve the fine surface finishes and tight tolerances required in wafer processing. They play a critical role in back-grinding processes, reducing wafer thickness to meet specific design and performance requirements for electronic devices, while minimizing surface damage and maintaining structural integrity.

This report is a detailed and comprehensive analysis for global Grinding Wheels for Wafers market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Grinding Wheels for Wafers market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global Grinding Wheels for Wafers market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global Grinding Wheels for Wafers market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global Grinding Wheels for Wafers market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Grinding Wheels for Wafers

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Grinding Wheels for Wafers market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Tokyo Diamond, Disco, Asahi Diamond, Saint-Gobain, Tyrolit Group, Noritake, Kinik, EHWA Diamond, Shinhan Diamond, Qingdao Gaoce Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Grinding Wheels for Wafers market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type

Vitrified Bond

Resinoid Bond

Others

Market segment by Application

Rough Grinding

Fine Grinding

Major players covered

Tokyo Diamond

Disco

Asahi Diamond

Saint-Gobain

Tyrolit Group

Noritake

Kinik

EHWA Diamond

Shinhan Diamond

Qingdao Gaoce Technology

Kure Grinding Wheel

Zhengzhou Research Institute For Abrasives & Grinding

Suzhou Sail Science & Technology

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Grinding Wheels for Wafers product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Grinding Wheels for Wafers, with price, sales quantity, revenue, and global market share of Grinding Wheels for Wafers from 2020 to 2025.

Chapter 3, the Grinding Wheels for Wafers competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Grinding Wheels for Wafers breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Grinding Wheels for Wafers market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Grinding Wheels for Wafers.

Chapter 14 and 15, to describe Grinding Wheels for Wafers sales channel, distributors, customers, research findings and conclusion.