Global Through Glass Via (TGV) Foundry Service Market 2025 by Company, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Through Glass Via (TGV) Foundry Service market size was valued at US$ 376 million in 2024 and is forecast to a readjusted size of USD 1231 million by 2031 with a CAGR of 18.4% during review period.
Through-glass via (TGV) foundry refers to the process of making tiny vertical through holes (usually with a diameter of 10μm~100μm) on high-quality borosilicate glass or quartz glass substrates through a series of high-precision processes, and filling these through holes with conductive materials (such as copper) to achieve electrical connections. This technology uses laser etching, inductively coupled plasma dry etching and other methods to prepare through holes. It has the advantages of excellent high-frequency electrical properties, strong mechanical stability, low cost, and simple process flow. It has broad application prospects in the fields of precision devices such as Mini/Micro LED direct display and semiconductor advanced packaging substrates.
This report is a detailed and comprehensive analysis for global Through Glass Via (TGV) Foundry Service market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Through Glass Via (TGV) Foundry Service market size and forecasts, in consumption value ($ Million), 2020-2031
Global Through Glass Via (TGV) Foundry Service market size and forecasts by region and country, in consumption value ($ Million), 2020-2031
Global Through Glass Via (TGV) Foundry Service market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031
Global Through Glass Via (TGV) Foundry Service market shares of main players, in revenue ($ Million), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Through Glass Via (TGV) Foundry Service
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Through Glass Via (TGV) Foundry Service market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Corning, Samtec, Plan Optik, Vitrion (LPKF), WOP, E&R（鈦昇科技）, Kiso Micro, 3D Glass Solutions, Nanosystems, NSC, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
Through Glass Via (TGV) Foundry Service market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
300 mm
200 mm
Market segment by Application
Consumer Electronics
Automotive Industry
Others
Market segment by players, this report covers
Corning
Samtec
Plan Optik
Vitrion (LPKF)
WOP
E&R（鈦昇科技）
Kiso Micro
3D Glass Solutions
Nanosystems
NSC
NICHIWA KOGYO
Sky Semiconductor
Jiangxi Woge Optoelectronics
Chengdu Micro-Technology
Hubei W-OLF PHOTOELECTRIC Technology
Sai MicroElectronics
Zhejiang Lante Optics
Suzhou Senwan Electronics Technology
Group Up Industrial
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Through Glass Via (TGV) Foundry Service product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Through Glass Via (TGV) Foundry Service, with revenue, gross margin, and global market share of Through Glass Via (TGV) Foundry Service from 2020 to 2025.
Chapter 3, the Through Glass Via (TGV) Foundry Service competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Through Glass Via (TGV) Foundry Service market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Through Glass Via (TGV) Foundry Service.
Chapter 13, to describe Through Glass Via (TGV) Foundry Service research findings and conclusion.
Through-glass via (TGV) foundry refers to the process of making tiny vertical through holes (usually with a diameter of 10μm~100μm) on high-quality borosilicate glass or quartz glass substrates through a series of high-precision processes, and filling these through holes with conductive materials (such as copper) to achieve electrical connections. This technology uses laser etching, inductively coupled plasma dry etching and other methods to prepare through holes. It has the advantages of excellent high-frequency electrical properties, strong mechanical stability, low cost, and simple process flow. It has broad application prospects in the fields of precision devices such as Mini/Micro LED direct display and semiconductor advanced packaging substrates.
This report is a detailed and comprehensive analysis for global Through Glass Via (TGV) Foundry Service market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Through Glass Via (TGV) Foundry Service market size and forecasts, in consumption value ($ Million), 2020-2031
Global Through Glass Via (TGV) Foundry Service market size and forecasts by region and country, in consumption value ($ Million), 2020-2031
Global Through Glass Via (TGV) Foundry Service market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031
Global Through Glass Via (TGV) Foundry Service market shares of main players, in revenue ($ Million), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Through Glass Via (TGV) Foundry Service
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Through Glass Via (TGV) Foundry Service market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Corning, Samtec, Plan Optik, Vitrion (LPKF), WOP, E&R（鈦昇科技）, Kiso Micro, 3D Glass Solutions, Nanosystems, NSC, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
Through Glass Via (TGV) Foundry Service market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
300 mm
200 mm
Market segment by Application
Consumer Electronics
Automotive Industry
Others
Market segment by players, this report covers
Corning
Samtec
Plan Optik
Vitrion (LPKF)
WOP
E&R（鈦昇科技）
Kiso Micro
3D Glass Solutions
Nanosystems
NSC
NICHIWA KOGYO
Sky Semiconductor
Jiangxi Woge Optoelectronics
Chengdu Micro-Technology
Hubei W-OLF PHOTOELECTRIC Technology
Sai MicroElectronics
Zhejiang Lante Optics
Suzhou Senwan Electronics Technology
Group Up Industrial
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Through Glass Via (TGV) Foundry Service product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Through Glass Via (TGV) Foundry Service, with revenue, gross margin, and global market share of Through Glass Via (TGV) Foundry Service from 2020 to 2025.
Chapter 3, the Through Glass Via (TGV) Foundry Service competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Through Glass Via (TGV) Foundry Service market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Through Glass Via (TGV) Foundry Service.
Chapter 13, to describe Through Glass Via (TGV) Foundry Service research findings and conclusion.
Table of Contents
124 Pages
- 1 Market Overview
- 2 Company Profiles
- 3 Market Competition, by Players
- 4 Market Size Segment by Type
- 5 Market Size Segment by Application
- 6 North America
- 7 Europe
- 8 Asia-Pacific
- 9 South America
- 10 Middle East & Africa
- 11 Market Dynamics
- 12 Industry Chain Analysis
- 13 Research Findings and Conclusion
- 14 Appendix
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