Global Flip Chip Bonder Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Flip Chip Bonder market size was valued at US$ 306 million in 2024 and is forecast to a readjusted size of USD 331 million by 2031 with a CAGR of 1.2% during review period.
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following: 1. Die is picked up and place on a "flipping device" 2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions 3. The tool then places the die on the bump with a programmed amount of force Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support. Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%. China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent. In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
This report is a detailed and comprehensive analysis for global Flip Chip Bonder market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Flip Chip Bonder market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Flip Chip Bonder market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Flip Chip Bonder market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Flip Chip Bonder market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Flip Chip Bonder
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Flip Chip Bonder market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include BESI, ASMPT, Shibaura, Muehlbauer, K&S, Hamni, AMICRA Microtechnologies, SET, Athlete FA, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Flip Chip Bonder market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fully Automatic
Semi-Automatic
Market segment by Application
IDMs
OSAT
Major players covered
BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
AMICRA Microtechnologies
SET
Athlete FA
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Flip Chip Bonder product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Flip Chip Bonder, with price, sales quantity, revenue, and global market share of Flip Chip Bonder from 2020 to 2025.
Chapter 3, the Flip Chip Bonder competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Flip Chip Bonder breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Flip Chip Bonder market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Flip Chip Bonder.
Chapter 14 and 15, to describe Flip Chip Bonder sales channel, distributors, customers, research findings and conclusion.
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following: 1. Die is picked up and place on a "flipping device" 2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions 3. The tool then places the die on the bump with a programmed amount of force Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support. Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%. China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent. In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
This report is a detailed and comprehensive analysis for global Flip Chip Bonder market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Flip Chip Bonder market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Flip Chip Bonder market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Flip Chip Bonder market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Flip Chip Bonder market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Flip Chip Bonder
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Flip Chip Bonder market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include BESI, ASMPT, Shibaura, Muehlbauer, K&S, Hamni, AMICRA Microtechnologies, SET, Athlete FA, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Flip Chip Bonder market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fully Automatic
Semi-Automatic
Market segment by Application
IDMs
OSAT
Major players covered
BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
AMICRA Microtechnologies
SET
Athlete FA
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Flip Chip Bonder product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Flip Chip Bonder, with price, sales quantity, revenue, and global market share of Flip Chip Bonder from 2020 to 2025.
Chapter 3, the Flip Chip Bonder competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Flip Chip Bonder breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Flip Chip Bonder market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Flip Chip Bonder.
Chapter 14 and 15, to describe Flip Chip Bonder sales channel, distributors, customers, research findings and conclusion.
Table of Contents
105 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Flip Chip Bonder by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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