Global Epoxy Resin Thermal Conductive Potting Glue Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Epoxy Resin Thermal Conductive Potting Glue market size was valued at US$ 379 million in 2024 and is forecast to a readjusted size of USD 605 million by 2031 with a CAGR of 7.1% during review period.

Epoxy resin thermal conductive potting glue is a protective material specially designed for electronic components and circuit boards. It combines the excellent mechanical properties and high thermal conductivity of epoxy resin, and can form a strong protective layer with good thermal conductivity after curing. This potting glue is mainly used to fill and seal the gaps between electronic components, effectively conduct the heat generated inside, prevent damage caused by overheating, and provide multiple protection functions such as moisture-proof, corrosion-proof, and earthquake-proof. Epoxy resin thermal conductive potting glue is widely used in LED lamps, power modules, automotive electronics and other fields to ensure the reliability and long life of electronic equipment in complex environments.

The development trend of epoxy resin thermal conductive potting glue is moving towards high performance and multifunctionality. Future products will pay more attention to improving thermal conductivity and reducing thermal resistance while maintaining good mechanical properties and chemical stability. In addition, increasingly stringent environmental regulations have prompted manufacturers to develop halogen-free, low-volatile organic compound (VOC) green products. With the trend of electronic products towards miniaturization and lightweight, the requirements for potting glue are also increasing, including better fluidity and the ability to adapt to complex shapes, as well as higher temperature resistance and anti-aging performance to meet the needs of emerging markets such as electric vehicles, 5G communication equipment and high-performance computing equipment.

This report is a detailed and comprehensive analysis for global Epoxy Resin Thermal Conductive Potting Glue market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Epoxy Resin Thermal Conductive Potting Glue market size and forecasts, in consumption value ($ Million), sales quantity (Kilotons), and average selling prices (US$/Ton), 2020-2031

Global Epoxy Resin Thermal Conductive Potting Glue market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Kilotons), and average selling prices (US$/Ton), 2020-2031

Global Epoxy Resin Thermal Conductive Potting Glue market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Kilotons), and average selling prices (US$/Ton), 2020-2031

Global Epoxy Resin Thermal Conductive Potting Glue market shares of main players, shipments in revenue ($ Million), sales quantity (Kilotons), and ASP (US$/Ton), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Epoxy Resin Thermal Conductive Potting Glue

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Epoxy Resin Thermal Conductive Potting Glue market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Anchuam, Parker, MG Chemicals, Henkel, KYOCERA, 3M, Kafuter, Elantas, Shengkangtai Silicone Materials, Zhaoke Electronic Materials Technology Co., Ltd., etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Epoxy Resin Thermal Conductive Potting Glue market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
One-component
Two-component

Market segment by Application
Aircraft
Automobile
Electronics
Other

Major players covered
Anchuam
Parker
MG Chemicals
Henkel
KYOCERA
3M
Kafuter
Elantas
Shengkangtai Silicone Materials
Zhaoke Electronic Materials Technology Co., Ltd.
Jiaxing Shaohua Plastic New Materials Co., Ltd.
Shenzhen Dabond Technology Co., Ltd.

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Epoxy Resin Thermal Conductive Potting Glue product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Epoxy Resin Thermal Conductive Potting Glue, with price, sales quantity, revenue, and global market share of Epoxy Resin Thermal Conductive Potting Glue from 2020 to 2025.

Chapter 3, the Epoxy Resin Thermal Conductive Potting Glue competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Epoxy Resin Thermal Conductive Potting Glue breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Epoxy Resin Thermal Conductive Potting Glue market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Epoxy Resin Thermal Conductive Potting Glue.

Chapter 14 and 15, to describe Epoxy Resin Thermal Conductive Potting Glue sales channel, distributors, customers, research findings and conclusion.