Global Epitaxy Deposition Supply, Demand and Key Producers, 2026-2032
Description
The global Epitaxy Deposition market size is expected to reach $ 3120 million by 2032, rising at a market growth of 8.3% CAGR during the forecast period (2026-2032).
In 2024, global Epitaxy Deposition Equipment production capacity is 1,500 units, with production reached approximately 1,100 units, with an average global market price of around US$ 1.5 million per unit. The market gross margin is mainly 40%-50%.
Epitaxy deposition equipment is a key semiconductor device used to grow thin film materials on wafers or single-crystal substrates according to lattice orientation rules. Its core function is to achieve precise single-layer stacking of crystalline materials under controlled atmosphere, temperature, pressure, and atomic supply conditions, ensuring that the thin film and substrate maintain a consistent lattice structure, thereby endowing devices with high mobility, low defect density, and stable electrical performance. Epitaxy equipment mainly includes technologies such as MOCVD, MBE, CVD/HVPE, and SiC Epitaxy Reactor, covering III–V compound semiconductors, quantum materials, SiC power devices, and silicon-based epitaxial applications, respectively. Typical material systems include GaN, GaAs, InP, AlGaN, SiC, Epi-Si, and novel 2D materials (MoS₂, Graphene). This equipment plays a decisive role in the production of LEDs, VCSELs, lasers, RF devices, MicroLEDs, optical communication chips, power semiconductors, sensors, and quantum computing materials. It is considered the "core equipment at the very upstream of the compound semiconductor industry chain," and its performance directly determines device structure, crystal quality, and final yield, making it one of the strategic pieces of equipment in semiconductor manufacturing.
The epitaxial deposition equipment industry chain is mainly divided into three levels: upstream materials and core components, midstream equipment manufacturing and process integration, and downstream compound semiconductor and power electronics manufacturers. The upstream segment includes high-purity metal-organic sources (TMGa, TMAl, TMIn), ammonia/hydrogen, arsenic sources, silanes, and other precursors; ultra-high precision MFC mass flow controllers; high-temperature quartz devices; vacuum pumps and cavity materials; high-temperature susceptors; RF/electric heating systems; and gas distribution systems, which are crucial for temperature uniformity. The midstream segment comprises equipment manufacturers such as MOCVD, MBE, HVPE, and SiC epitaxial furnaces. Typical manufacturers include Aixtron, Veeco, Riber, TEL, and Chinese companies like AMEC and NAURA. Their competitive advantages lie in airflow design, temperature control, cavity structure, material purification capabilities, and long-term process accumulation. Downstream customers cover LED, optical communication, RF front-end (GaAs/GaN), power devices (SiC/GaN), MicroLED, automotive LiDAR, and quantum chip research institutions. Wafer fabs and packaging/testing plants are highly dependent on epitaxial quality, yield, and stability, resulting in close upstream and downstream collaboration.
The global epitaxial deposition equipment market is in a structural upswing cycle, driving rapid application expansion in multiple fields such as power semiconductors (SiC/GaN), optical communication, MicroLED displays, 5G/6G RF devices, automotive LiDAR, and quantum materials. With the increasing penetration rate of new energy vehicles and the complete shift of automotive electric drive inverters to SiC MOSFETs, the demand for SiC epitaxial capacity is expected to maintain rapid growth between 2024 and 2030; while GaN epitaxy remains strong, driven by growth in fast charging, power supplies, and automotive OBCs. Optical communication (InP/VCSEL) will maintain high growth driven by the expansion of AI servers and data centers, while MicroLED is expected to gradually enter mass production from 2026 onwards, placing higher demands on MOCVD uniformity and capacity. Furthermore, research-grade epitaxial equipment, represented by MBEs, will benefit from the growing demand in quantum computing and topological materials research.
This report studies the global Epitaxy Deposition production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Epitaxy Deposition and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Epitaxy Deposition that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Epitaxy Deposition total production and demand, 2021-2032, (Units)
Global Epitaxy Deposition total production value, 2021-2032, (USD Million)
Global Epitaxy Deposition production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)
Global Epitaxy Deposition consumption by region & country, CAGR, 2021-2032 & (Units)
U.S. VS China: Epitaxy Deposition domestic production, consumption, key domestic manufacturers and share
Global Epitaxy Deposition production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)
Global Epitaxy Deposition production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)
Global Epitaxy Deposition production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)
This report profiles key players in the global Epitaxy Deposition market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include AIXTRON, Advanced Micro, Veeco, LPE (Italy), TAIYO NIPPON SANSO, ASMI, Applied Material, NuFlare, Tokyo Electron, CETC, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Epitaxy Deposition market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Epitaxy Deposition Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Epitaxy Deposition Market, Segmentation by Type:
MOCVD
Molecular Beam Epitaxy
Other CVD Epitaxy
Global Epitaxy Deposition Market, Segmentation by Capacity:
R&D Type
Mass Production Type
Global Epitaxy Deposition Market, Segmentation by Reactor Type:
Single-Wafer Reactor
Multi-Wafer Reactor
Global Epitaxy Deposition Market, Segmentation by Application:
SiC / GaN Power Devices
RF Devices
Optoelectronics
Micro LED
Others
Companies Profiled:
AIXTRON
Advanced Micro
Veeco
LPE (Italy)
TAIYO NIPPON SANSO
ASMI
Applied Material
NuFlare
Tokyo Electron
CETC
NAURA
Riber
DCA
Scienta Omicron
Pascal
Dr. Eberl MBE-Komponenten GmbH
Key Questions Answered:
1. How big is the global Epitaxy Deposition market?
2. What is the demand of the global Epitaxy Deposition market?
3. What is the year over year growth of the global Epitaxy Deposition market?
4. What is the production and production value of the global Epitaxy Deposition market?
5. Who are the key producers in the global Epitaxy Deposition market?
6. What are the growth factors driving the market demand?
In 2024, global Epitaxy Deposition Equipment production capacity is 1,500 units, with production reached approximately 1,100 units, with an average global market price of around US$ 1.5 million per unit. The market gross margin is mainly 40%-50%.
Epitaxy deposition equipment is a key semiconductor device used to grow thin film materials on wafers or single-crystal substrates according to lattice orientation rules. Its core function is to achieve precise single-layer stacking of crystalline materials under controlled atmosphere, temperature, pressure, and atomic supply conditions, ensuring that the thin film and substrate maintain a consistent lattice structure, thereby endowing devices with high mobility, low defect density, and stable electrical performance. Epitaxy equipment mainly includes technologies such as MOCVD, MBE, CVD/HVPE, and SiC Epitaxy Reactor, covering III–V compound semiconductors, quantum materials, SiC power devices, and silicon-based epitaxial applications, respectively. Typical material systems include GaN, GaAs, InP, AlGaN, SiC, Epi-Si, and novel 2D materials (MoS₂, Graphene). This equipment plays a decisive role in the production of LEDs, VCSELs, lasers, RF devices, MicroLEDs, optical communication chips, power semiconductors, sensors, and quantum computing materials. It is considered the "core equipment at the very upstream of the compound semiconductor industry chain," and its performance directly determines device structure, crystal quality, and final yield, making it one of the strategic pieces of equipment in semiconductor manufacturing.
The epitaxial deposition equipment industry chain is mainly divided into three levels: upstream materials and core components, midstream equipment manufacturing and process integration, and downstream compound semiconductor and power electronics manufacturers. The upstream segment includes high-purity metal-organic sources (TMGa, TMAl, TMIn), ammonia/hydrogen, arsenic sources, silanes, and other precursors; ultra-high precision MFC mass flow controllers; high-temperature quartz devices; vacuum pumps and cavity materials; high-temperature susceptors; RF/electric heating systems; and gas distribution systems, which are crucial for temperature uniformity. The midstream segment comprises equipment manufacturers such as MOCVD, MBE, HVPE, and SiC epitaxial furnaces. Typical manufacturers include Aixtron, Veeco, Riber, TEL, and Chinese companies like AMEC and NAURA. Their competitive advantages lie in airflow design, temperature control, cavity structure, material purification capabilities, and long-term process accumulation. Downstream customers cover LED, optical communication, RF front-end (GaAs/GaN), power devices (SiC/GaN), MicroLED, automotive LiDAR, and quantum chip research institutions. Wafer fabs and packaging/testing plants are highly dependent on epitaxial quality, yield, and stability, resulting in close upstream and downstream collaboration.
The global epitaxial deposition equipment market is in a structural upswing cycle, driving rapid application expansion in multiple fields such as power semiconductors (SiC/GaN), optical communication, MicroLED displays, 5G/6G RF devices, automotive LiDAR, and quantum materials. With the increasing penetration rate of new energy vehicles and the complete shift of automotive electric drive inverters to SiC MOSFETs, the demand for SiC epitaxial capacity is expected to maintain rapid growth between 2024 and 2030; while GaN epitaxy remains strong, driven by growth in fast charging, power supplies, and automotive OBCs. Optical communication (InP/VCSEL) will maintain high growth driven by the expansion of AI servers and data centers, while MicroLED is expected to gradually enter mass production from 2026 onwards, placing higher demands on MOCVD uniformity and capacity. Furthermore, research-grade epitaxial equipment, represented by MBEs, will benefit from the growing demand in quantum computing and topological materials research.
This report studies the global Epitaxy Deposition production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Epitaxy Deposition and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Epitaxy Deposition that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Epitaxy Deposition total production and demand, 2021-2032, (Units)
Global Epitaxy Deposition total production value, 2021-2032, (USD Million)
Global Epitaxy Deposition production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)
Global Epitaxy Deposition consumption by region & country, CAGR, 2021-2032 & (Units)
U.S. VS China: Epitaxy Deposition domestic production, consumption, key domestic manufacturers and share
Global Epitaxy Deposition production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)
Global Epitaxy Deposition production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)
Global Epitaxy Deposition production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)
This report profiles key players in the global Epitaxy Deposition market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include AIXTRON, Advanced Micro, Veeco, LPE (Italy), TAIYO NIPPON SANSO, ASMI, Applied Material, NuFlare, Tokyo Electron, CETC, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Epitaxy Deposition market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Epitaxy Deposition Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Epitaxy Deposition Market, Segmentation by Type:
MOCVD
Molecular Beam Epitaxy
Other CVD Epitaxy
Global Epitaxy Deposition Market, Segmentation by Capacity:
R&D Type
Mass Production Type
Global Epitaxy Deposition Market, Segmentation by Reactor Type:
Single-Wafer Reactor
Multi-Wafer Reactor
Global Epitaxy Deposition Market, Segmentation by Application:
SiC / GaN Power Devices
RF Devices
Optoelectronics
Micro LED
Others
Companies Profiled:
AIXTRON
Advanced Micro
Veeco
LPE (Italy)
TAIYO NIPPON SANSO
ASMI
Applied Material
NuFlare
Tokyo Electron
CETC
NAURA
Riber
DCA
Scienta Omicron
Pascal
Dr. Eberl MBE-Komponenten GmbH
Key Questions Answered:
1. How big is the global Epitaxy Deposition market?
2. What is the demand of the global Epitaxy Deposition market?
3. What is the year over year growth of the global Epitaxy Deposition market?
4. What is the production and production value of the global Epitaxy Deposition market?
5. Who are the key producers in the global Epitaxy Deposition market?
6. What are the growth factors driving the market demand?
Table of Contents
149 Pages
- 1 Supply Summary
- 2 Demand Summary
- 3 World Manufacturers Competitive Analysis
- 4 United States VS China VS Rest of the World
- 5 Market Analysis by Type
- 6 Market Analysis by Application
- 7 Company Profiles
- 8 Industry Chain Analysis
- 9 Research Findings and Conclusion
- 10 Appendix
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