Global Electrostatic Chucks for Wafer Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Electrostatic Chucks for Wafer market size was valued at US$ 256 million in 2024 and is forecast to a readjusted size of USD 365 million by 2031 with a CAGR of 5.3% during review period.
The Electrostatic Chucks (ESC) is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.
SHINKO dominated with 44.00% revenue market share, followed by TOTO with 17.00% revenue share and Creative Technology corporation with 9% revenue share.
This report is a detailed and comprehensive analysis for global Electrostatic Chucks for Wafer market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Electrostatic Chucks for Wafer market size and forecasts, in consumption value ($ Million), sales quantity (MSI), and average selling prices (USD/Unit), 2020-2031
Global Electrostatic Chucks for Wafer market size and forecasts by region and country, in consumption value ($ Million), sales quantity (MSI), and average selling prices (USD/Unit), 2020-2031
Global Electrostatic Chucks for Wafer market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (MSI), and average selling prices (USD/Unit), 2020-2031
Global Electrostatic Chucks for Wafer market shares of main players, shipments in revenue ($ Million), sales quantity (MSI), and ASP (USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Electrostatic Chucks for Wafer
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Electrostatic Chucks for Wafer market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include SHINKO, TOTO, Creative Technology Corporation, Kyocera, FM Industries, NTK CERATEC, Tsukuba Seiko, Applied Materials, II-VI M Cubed, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Electrostatic Chucks for Wafer market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Coulomb Type Electrostatic Chucks
Johnsen-Rahbek (JR) Type Electrostatic Chucks
Market segment by Application
300 mm Wafer
200 mm Wafer
150 mm Wafer
Others
Major players covered
SHINKO
TOTO
Creative Technology Corporation
Kyocera
FM Industries
NTK CERATEC
Tsukuba Seiko
Applied Materials
II-VI M Cubed
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Electrostatic Chucks for Wafer product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Electrostatic Chucks for Wafer, with price, sales quantity, revenue, and global market share of Electrostatic Chucks for Wafer from 2020 to 2025.
Chapter 3, the Electrostatic Chucks for Wafer competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Electrostatic Chucks for Wafer breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Electrostatic Chucks for Wafer market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Electrostatic Chucks for Wafer.
Chapter 14 and 15, to describe Electrostatic Chucks for Wafer sales channel, distributors, customers, research findings and conclusion.
The Electrostatic Chucks (ESC) is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.
SHINKO dominated with 44.00% revenue market share, followed by TOTO with 17.00% revenue share and Creative Technology corporation with 9% revenue share.
This report is a detailed and comprehensive analysis for global Electrostatic Chucks for Wafer market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Electrostatic Chucks for Wafer market size and forecasts, in consumption value ($ Million), sales quantity (MSI), and average selling prices (USD/Unit), 2020-2031
Global Electrostatic Chucks for Wafer market size and forecasts by region and country, in consumption value ($ Million), sales quantity (MSI), and average selling prices (USD/Unit), 2020-2031
Global Electrostatic Chucks for Wafer market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (MSI), and average selling prices (USD/Unit), 2020-2031
Global Electrostatic Chucks for Wafer market shares of main players, shipments in revenue ($ Million), sales quantity (MSI), and ASP (USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Electrostatic Chucks for Wafer
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Electrostatic Chucks for Wafer market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include SHINKO, TOTO, Creative Technology Corporation, Kyocera, FM Industries, NTK CERATEC, Tsukuba Seiko, Applied Materials, II-VI M Cubed, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Electrostatic Chucks for Wafer market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Coulomb Type Electrostatic Chucks
Johnsen-Rahbek (JR) Type Electrostatic Chucks
Market segment by Application
300 mm Wafer
200 mm Wafer
150 mm Wafer
Others
Major players covered
SHINKO
TOTO
Creative Technology Corporation
Kyocera
FM Industries
NTK CERATEC
Tsukuba Seiko
Applied Materials
II-VI M Cubed
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Electrostatic Chucks for Wafer product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Electrostatic Chucks for Wafer, with price, sales quantity, revenue, and global market share of Electrostatic Chucks for Wafer from 2020 to 2025.
Chapter 3, the Electrostatic Chucks for Wafer competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Electrostatic Chucks for Wafer breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Electrostatic Chucks for Wafer market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Electrostatic Chucks for Wafer.
Chapter 14 and 15, to describe Electrostatic Chucks for Wafer sales channel, distributors, customers, research findings and conclusion.
Table of Contents
104 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Electrostatic Chucks for Wafer by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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