Global Die Sorting Equipment Supply, Demand and Key Producers, 2026-2032
Description
The global Die Sorting Equipment market size is expected to reach $ 569 million by 2032, rising at a market growth of 5.5% CAGR during the forecast period (2026-2032).
Die sorting equipment, often referred to as die sorters, are machines used in semiconductor manufacturing to sort and categorize individual dies based on various criteria such as performance, electrical characteristics, or defects. These machines play a crucial role in the production of integrated circuits (ICs) and other electronic devices by ensuring that only dies meeting specific quality standards are used in the assembly process.
The global die sorting equipment market plays a critical role in the semiconductor backend process, facilitating the precise placement of individual semiconductor dies onto substrates or packages. As semiconductor node geometries shrink and chip integration increases, the need for high-throughput, high-precision die sorting solutions has become more pressing. The market is currently led by key players such as KLA-Tencor, YAC Garter, and Ueno Seiki, with the top three vendors collectively accounting for approximately 37% of the global market. These companies are recognized for their continuous innovation in automation, vision inspection, and throughput efficiency, positioning them as integral players in an industry characterized by rapid technological advancement and tight production tolerances.
Asia-Pacific (APAC) dominates the global market, commanding an overwhelming share of approximately 83%, driven by the region's concentration of semiconductor foundries, outsourced semiconductor assembly and test (OSAT) facilities, and electronics manufacturing hubs. Countries like Taiwan, South Korea, China, and Japan serve as the backbone of global semiconductor packaging and assembly, with substantial capital investments flowing into advanced packaging and heterogeneous integration. The presence of high-volume manufacturing in APAC, coupled with government support and robust supply chain infrastructure, continues to propel regional demand for die sorting equipment.
From a product segmentation perspective, High Speed Die Sorting systems account for around 83% of total market share, reflecting the industry’s strong preference for equipment that supports ultra-fast die placement and sorting accuracy. These systems are particularly vital for applications requiring high throughput, such as mobile processors, memory chips, and sensors. Technological enhancements in vision alignment, defect detection, and wafer mapping have further optimized these machines for large-scale, defect-free production environments.
In terms of application, OSATs (Outsourced Semiconductor Assembly and Test providers) represent the largest end-user segment, capturing roughly 76% of the market. These players rely heavily on die sorting equipment to meet the stringent quality and delivery expectations of global chipmakers and systems integrators. As advanced packaging technologies—such as 2.5D/3D ICs, chiplets, and fan-out wafer-level packaging—gain traction, OSATs are increasingly demanding flexible, high-performance die sorting platforms. Looking ahead, the global die sorting equipment market is expected to remain on a growth trajectory, supported by expanding semiconductor demand, the proliferation of AI and 5G applications, and the shift toward more complex chip architectures that require precision back-end manufacturing solutions.
This report studies the global Die Sorting Equipment production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Die Sorting Equipment and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Die Sorting Equipment that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Die Sorting Equipment total production and demand, 2021-2032, (Units)
Global Die Sorting Equipment total production value, 2021-2032, (USD Million)
Global Die Sorting Equipment production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)
Global Die Sorting Equipment consumption by region & country, CAGR, 2021-2032 & (Units)
U.S. VS China: Die Sorting Equipment domestic production, consumption, key domestic manufacturers and share
Global Die Sorting Equipment production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)
Global Die Sorting Equipment production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)
Global Die Sorting Equipment production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)
This report profiles key players in the global Die Sorting Equipment market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include KLA-Tencor, YAC Garter, Ueno Seiki, MPI Corporation, Semiconductor Technologies & Instruments Pte Ltd, Air-Vac Automation, Suzhou MTS Automation Equipment, Mühlbauer, Canon Machinery, Cohu, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Die Sorting Equipment market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Die Sorting Equipment Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Die Sorting Equipment Market, Segmentation by Type:
High Speed Die Sorting
Standard Speed Die Sorting
Global Die Sorting Equipment Market, Segmentation by Application:
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
Companies Profiled:
KLA-Tencor
YAC Garter
Ueno Seiki
MPI Corporation
Semiconductor Technologies & Instruments Pte Ltd
Air-Vac Automation
Suzhou MTS Automation Equipment
Mühlbauer
Canon Machinery
Cohu
Hangzhou Changchuan Technology
Royce Instruments
Syagrus Systems
Key Questions Answered:
1. How big is the global Die Sorting Equipment market?
2. What is the demand of the global Die Sorting Equipment market?
3. What is the year over year growth of the global Die Sorting Equipment market?
4. What is the production and production value of the global Die Sorting Equipment market?
5. Who are the key producers in the global Die Sorting Equipment market?
6. What are the growth factors driving the market demand?
Die sorting equipment, often referred to as die sorters, are machines used in semiconductor manufacturing to sort and categorize individual dies based on various criteria such as performance, electrical characteristics, or defects. These machines play a crucial role in the production of integrated circuits (ICs) and other electronic devices by ensuring that only dies meeting specific quality standards are used in the assembly process.
The global die sorting equipment market plays a critical role in the semiconductor backend process, facilitating the precise placement of individual semiconductor dies onto substrates or packages. As semiconductor node geometries shrink and chip integration increases, the need for high-throughput, high-precision die sorting solutions has become more pressing. The market is currently led by key players such as KLA-Tencor, YAC Garter, and Ueno Seiki, with the top three vendors collectively accounting for approximately 37% of the global market. These companies are recognized for their continuous innovation in automation, vision inspection, and throughput efficiency, positioning them as integral players in an industry characterized by rapid technological advancement and tight production tolerances.
Asia-Pacific (APAC) dominates the global market, commanding an overwhelming share of approximately 83%, driven by the region's concentration of semiconductor foundries, outsourced semiconductor assembly and test (OSAT) facilities, and electronics manufacturing hubs. Countries like Taiwan, South Korea, China, and Japan serve as the backbone of global semiconductor packaging and assembly, with substantial capital investments flowing into advanced packaging and heterogeneous integration. The presence of high-volume manufacturing in APAC, coupled with government support and robust supply chain infrastructure, continues to propel regional demand for die sorting equipment.
From a product segmentation perspective, High Speed Die Sorting systems account for around 83% of total market share, reflecting the industry’s strong preference for equipment that supports ultra-fast die placement and sorting accuracy. These systems are particularly vital for applications requiring high throughput, such as mobile processors, memory chips, and sensors. Technological enhancements in vision alignment, defect detection, and wafer mapping have further optimized these machines for large-scale, defect-free production environments.
In terms of application, OSATs (Outsourced Semiconductor Assembly and Test providers) represent the largest end-user segment, capturing roughly 76% of the market. These players rely heavily on die sorting equipment to meet the stringent quality and delivery expectations of global chipmakers and systems integrators. As advanced packaging technologies—such as 2.5D/3D ICs, chiplets, and fan-out wafer-level packaging—gain traction, OSATs are increasingly demanding flexible, high-performance die sorting platforms. Looking ahead, the global die sorting equipment market is expected to remain on a growth trajectory, supported by expanding semiconductor demand, the proliferation of AI and 5G applications, and the shift toward more complex chip architectures that require precision back-end manufacturing solutions.
This report studies the global Die Sorting Equipment production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Die Sorting Equipment and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Die Sorting Equipment that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Die Sorting Equipment total production and demand, 2021-2032, (Units)
Global Die Sorting Equipment total production value, 2021-2032, (USD Million)
Global Die Sorting Equipment production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)
Global Die Sorting Equipment consumption by region & country, CAGR, 2021-2032 & (Units)
U.S. VS China: Die Sorting Equipment domestic production, consumption, key domestic manufacturers and share
Global Die Sorting Equipment production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)
Global Die Sorting Equipment production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)
Global Die Sorting Equipment production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)
This report profiles key players in the global Die Sorting Equipment market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include KLA-Tencor, YAC Garter, Ueno Seiki, MPI Corporation, Semiconductor Technologies & Instruments Pte Ltd, Air-Vac Automation, Suzhou MTS Automation Equipment, Mühlbauer, Canon Machinery, Cohu, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Die Sorting Equipment market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Die Sorting Equipment Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Die Sorting Equipment Market, Segmentation by Type:
High Speed Die Sorting
Standard Speed Die Sorting
Global Die Sorting Equipment Market, Segmentation by Application:
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
Companies Profiled:
KLA-Tencor
YAC Garter
Ueno Seiki
MPI Corporation
Semiconductor Technologies & Instruments Pte Ltd
Air-Vac Automation
Suzhou MTS Automation Equipment
Mühlbauer
Canon Machinery
Cohu
Hangzhou Changchuan Technology
Royce Instruments
Syagrus Systems
Key Questions Answered:
1. How big is the global Die Sorting Equipment market?
2. What is the demand of the global Die Sorting Equipment market?
3. What is the year over year growth of the global Die Sorting Equipment market?
4. What is the production and production value of the global Die Sorting Equipment market?
5. Who are the key producers in the global Die Sorting Equipment market?
6. What are the growth factors driving the market demand?
Table of Contents
126 Pages
- 1 Supply Summary
- 2 Demand Summary
- 3 World Manufacturers Competitive Analysis
- 4 United States VS China VS Rest of the World
- 5 Market Analysis by Type
- 6 Market Analysis by Application
- 7 Company Profiles
- 8 Industry Chain Analysis
- 9 Research Findings and Conclusion
- 10 Appendix
Pricing
Currency Rates
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