Global Dicing Blade Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Dicing Blade market size was valued at US$ 1478 million in 2024 and is forecast to a readjusted size of USD 2017 million by 2031 with a CAGR of 4.2% during review period.
A Dicing Blade is a tool used for precision cutting of thin materials such as semiconductor wafers, optical glass, LEDs, and integrated circuits. It is typically made from diamond particles, superhard metals, or ceramics, which provide high hardness and wear resistance. Dicing blades are essential for industries such as semiconductor, optics, and electronics.
The main types of dicing blades are:
Diamond Dicing Blade: Used for cutting hard materials like silicon wafers, gallium arsenide, sapphire, etc. The diamond particles provide precise cutting force, minimizing thermal impact during the cutting process and preventing damage to the material.
Ceramic Dicing Blade: Suitable for cutting softer materials, such as electronic packaging materials and optical components.
Resin Bonded Dicing Blade: Typically used for medium-hardness materials, it offers higher cutting efficiency and cost-effectiveness, commonly found in mass production environments.
Key characteristics of dicing blades include high precision, minimal heat impact, and stable cutting performance, making them ideal for high-precision cutting tasks.
Market Opportunities and Key Drivers:
Growth of the Semiconductor Industry: With the widespread adoption of 5G, AI, IoT, and other technologies, the demand for semiconductor products continues to increase, driving the need for dicing blades in wafer cutting.
Optics and LED Markets: As optical glass and LED display technologies evolve, the demand for precision cutting tools grows, particularly in high-precision processing.
Electric Vehicles and New Energy: The growing need for precise cutting in the production of batteries and electronic components further stimulates demand for dicing blades.
Market Risks:
Technological Barriers and Production Costs: The manufacturing process for materials like diamond requires high-level technology and expensive raw materials, which pose challenges to manufacturers' technical capabilities and financial resources.
Intense Competition: Although large manufacturers dominate the market, increasing demand has led to heightened price competition, potentially decreasing profit margins.
Raw Material Shortages: Fluctuations in the supply chain for high-performance materials like diamond may introduce uncertainty into production.
Market Concentration: The dicing blade market is relatively concentrated, with major companies like DISCO and Mitsubishi Heavy Industries leading the industry. These firms have advantages in technology development, product quality, and market share. However, as the market expands, smaller companies are also entering the market, intensifying competition.
Downstream Demand Trends:
Semiconductor Industry: With the miniaturization and performance enhancement of chips, there is a rising demand for dicing blades, particularly in integrated circuits, MEMS, and optical chips.
Optics and LED Industries: As demand for precise optical components increases in smartphones, automotive, and television devices, the demand for dicing blades will continue to grow.
Latest Technologies:
Laser-Assisted Cutting Technology: The application of laser technology helps reduce thermal effects during cutting, improving both precision and efficiency.
Diamond Coated Blades: The addition of a diamond coating to blades enhances durability and extends their service life.
Composite Material Blades: Using composite materials to combine the benefits of different materials, these blades improve cutting efficiency and quality.
This report is a detailed and comprehensive analysis for global Dicing Blade market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Dicing Blade market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2020-2031
Global Dicing Blade market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2020-2031
Global Dicing Blade market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2020-2031
Global Dicing Blade market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Dicing Blade
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Dicing Blade market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO Corporation, Asahi Diamond Industrial, Kulicke & Soffa Industries, UKAM, Ceiba, Shanghai Sinyang, ITI, Kinik, Saint-Gobain, Tokyo Seimitsu, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Dicing Blade market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Hub Dicing Blades
Hubless Dicing Blades
Market segment by Application
Semiconductor
Optical Glass
Microelectronics
Others
Major players covered
DISCO Corporation
Asahi Diamond Industrial
Kulicke & Soffa Industries
UKAM
Ceiba
Shanghai Sinyang
ITI
Kinik
Saint-Gobain
Tokyo Seimitsu
3M
Lam Research Corporation
Xiamen Tungsten
Sungold Abrasives
Lande Precision Tools
Hongye Cutting Tools
Bosch Abrasives
Suzhou Sail Science & Technology Co., Ltd.
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Dicing Blade product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Dicing Blade, with price, sales quantity, revenue, and global market share of Dicing Blade from 2020 to 2025.
Chapter 3, the Dicing Blade competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Dicing Blade breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Dicing Blade market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Dicing Blade.
Chapter 14 and 15, to describe Dicing Blade sales channel, distributors, customers, research findings and conclusion.
A Dicing Blade is a tool used for precision cutting of thin materials such as semiconductor wafers, optical glass, LEDs, and integrated circuits. It is typically made from diamond particles, superhard metals, or ceramics, which provide high hardness and wear resistance. Dicing blades are essential for industries such as semiconductor, optics, and electronics.
The main types of dicing blades are:
Diamond Dicing Blade: Used for cutting hard materials like silicon wafers, gallium arsenide, sapphire, etc. The diamond particles provide precise cutting force, minimizing thermal impact during the cutting process and preventing damage to the material.
Ceramic Dicing Blade: Suitable for cutting softer materials, such as electronic packaging materials and optical components.
Resin Bonded Dicing Blade: Typically used for medium-hardness materials, it offers higher cutting efficiency and cost-effectiveness, commonly found in mass production environments.
Key characteristics of dicing blades include high precision, minimal heat impact, and stable cutting performance, making them ideal for high-precision cutting tasks.
Market Opportunities and Key Drivers:
Growth of the Semiconductor Industry: With the widespread adoption of 5G, AI, IoT, and other technologies, the demand for semiconductor products continues to increase, driving the need for dicing blades in wafer cutting.
Optics and LED Markets: As optical glass and LED display technologies evolve, the demand for precision cutting tools grows, particularly in high-precision processing.
Electric Vehicles and New Energy: The growing need for precise cutting in the production of batteries and electronic components further stimulates demand for dicing blades.
Market Risks:
Technological Barriers and Production Costs: The manufacturing process for materials like diamond requires high-level technology and expensive raw materials, which pose challenges to manufacturers' technical capabilities and financial resources.
Intense Competition: Although large manufacturers dominate the market, increasing demand has led to heightened price competition, potentially decreasing profit margins.
Raw Material Shortages: Fluctuations in the supply chain for high-performance materials like diamond may introduce uncertainty into production.
Market Concentration: The dicing blade market is relatively concentrated, with major companies like DISCO and Mitsubishi Heavy Industries leading the industry. These firms have advantages in technology development, product quality, and market share. However, as the market expands, smaller companies are also entering the market, intensifying competition.
Downstream Demand Trends:
Semiconductor Industry: With the miniaturization and performance enhancement of chips, there is a rising demand for dicing blades, particularly in integrated circuits, MEMS, and optical chips.
Optics and LED Industries: As demand for precise optical components increases in smartphones, automotive, and television devices, the demand for dicing blades will continue to grow.
Latest Technologies:
Laser-Assisted Cutting Technology: The application of laser technology helps reduce thermal effects during cutting, improving both precision and efficiency.
Diamond Coated Blades: The addition of a diamond coating to blades enhances durability and extends their service life.
Composite Material Blades: Using composite materials to combine the benefits of different materials, these blades improve cutting efficiency and quality.
This report is a detailed and comprehensive analysis for global Dicing Blade market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Dicing Blade market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2020-2031
Global Dicing Blade market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2020-2031
Global Dicing Blade market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2020-2031
Global Dicing Blade market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Dicing Blade
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Dicing Blade market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO Corporation, Asahi Diamond Industrial, Kulicke & Soffa Industries, UKAM, Ceiba, Shanghai Sinyang, ITI, Kinik, Saint-Gobain, Tokyo Seimitsu, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Dicing Blade market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Hub Dicing Blades
Hubless Dicing Blades
Market segment by Application
Semiconductor
Optical Glass
Microelectronics
Others
Major players covered
DISCO Corporation
Asahi Diamond Industrial
Kulicke & Soffa Industries
UKAM
Ceiba
Shanghai Sinyang
ITI
Kinik
Saint-Gobain
Tokyo Seimitsu
3M
Lam Research Corporation
Xiamen Tungsten
Sungold Abrasives
Lande Precision Tools
Hongye Cutting Tools
Bosch Abrasives
Suzhou Sail Science & Technology Co., Ltd.
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Dicing Blade product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Dicing Blade, with price, sales quantity, revenue, and global market share of Dicing Blade from 2020 to 2025.
Chapter 3, the Dicing Blade competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Dicing Blade breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Dicing Blade market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Dicing Blade.
Chapter 14 and 15, to describe Dicing Blade sales channel, distributors, customers, research findings and conclusion.
Table of Contents
139 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Dicing Blade by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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