Global Copper Strip for Semiconductor Packages Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Copper Strip for Semiconductor Packages market size was valued at US$ 1752 million in 2024 and is forecast to a readjusted size of USD 2638 million by 2031 with a CAGR of 6.2% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
This report studies the copper strips for semiconductor packages, include the copper strips used in Leadframe, IC Heat Spreaders, Heat Sinks and Ceramic substrates.
Lead Frame Copper Strips are critical in semiconductor packaging, serving as structural and conductive backbones for IC chips. Materials like C19400 and C70250 (Cu-Fe-P alloys) dominate due to their balance of high electrical conductivity (≥58 MS/m) and mechanical strength. These strips enable precise electrical interconnections while enduring thermal cycling (-55°C to 125°C) and mechanical stress during molding. Recent advancements focus on microalloying (e.g., adding 0.1-0.3% Ni) to enhance tensile strength (up to 600 MPa) without sacrificing conductivity, addressing the demand for miniaturized 5G and AI chips.
Heat Spreader Copper Strips address thermal management in high-power devices. Employing Cu-Mo-Cu composites or Cu-Ni-P alloys, these strips offer tailored thermal expansion coefficients (CTE) to match silicon (3 ppm/°C) and ceramic substrates. For example, copper-molybdenum-copper (CMC) sandwiches with 60% Cu layers provide CTE adjustability (5–8 ppm/°C) and thermal conductivity >240 W/m·K, critical for LED and RF modules . Surface treatments like nickel electroplating (5–10 μm) improve adhesion to substrates and resist oxidation, ensuring reliability in automotive and aerospace applications.
Heat Sink Copper Strips prioritize maximizing heat dissipation. Pure copper (≥99.95% purity) dominates due to its 400 W/m·K thermal conductivity, but hybrid designs like copper-graphite composites (thermal conductivity >600 W/m·K) are emerging for AI accelerators. Precision milling enables fin structures <50 μm thick, boosting surface area by 300%, while microchannel cooling (channel width <200 μm) integrates directly into strips for liquid cooling in data centers . Challenges include minimizing warpage during thinning (<0.1 mm) and ensuring compatibility with solder pastes (e.g., SAC305) for die attach.
Ceramic Substrate Copper Strips are pivotal in power electronics. DBC (Direct Bonded Copper) and AMB (Active Metal Brazing) technologies bond 100–300 μm Cu layers to AlN or Si3N4 ceramics, achieving CTE matching (CTE mismatch <1 ppm/°C) and thermal conductivity >180 W/m·K. For EV inverters, laser-drilled vias (Φ<50 μm) in Cu strips enable 3D interconnects, reducing parasitic inductance by 40%. Future trends include Cu-SiC hybrid strips for SiC MOSFET modules, combining Cu’s ductility with SiC’s thermal robustness to handle 300°C junction temperatures.
This report is a detailed and comprehensive analysis for global Copper Strip for Semiconductor Packages market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Copper Strip for Semiconductor Packages market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/ton), 2020-2031
Global Copper Strip for Semiconductor Packages market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/ton), 2020-2031
Global Copper Strip for Semiconductor Packages market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/ton), 2020-2031
Global Copper Strip for Semiconductor Packages market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Copper Strip for Semiconductor Packages
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Copper Strip for Semiconductor Packages market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsubishi Materials, Proterial Metals, Furukawa Electric, Kobe Steel, JX Advanced Metals Corporation, KME, Wieland, Aurubis, Sundwiger Messingwerk, Honeywell, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Copper Strip for Semiconductor Packages market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
C194 and KFC
C7025
C1020
Others
Market segment by Application
Copper Strips for Leadframe
Copper Strips for Heat Spreader
Copper Strips for Heat Sinks
Copper Strips for Ceramic Substrates
Others
Major players covered
Mitsubishi Materials
Proterial Metals
Furukawa Electric
Kobe Steel
JX Advanced Metals Corporation
KME
Wieland
Aurubis
Sundwiger Messingwerk
Honeywell
Poongsan
Korea Trading & Industries Corporation
EUNSUNG CO.,LTD
Haegang AP Co., Ltd
DOWA METALTECH
Sumitomo Metal Mining Co., Ltd.
YAMAKIN (JAPAN) CO.,LTD.
Harada Metal Industry
Ningbo Jintian Copper
Ningbo Boway Alloy Material
Jinchuan Group
GUOXI ULTRAPURE
GRIKIN Advanced Material
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Copper Strip for Semiconductor Packages product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Copper Strip for Semiconductor Packages, with price, sales quantity, revenue, and global market share of Copper Strip for Semiconductor Packages from 2020 to 2025.
Chapter 3, the Copper Strip for Semiconductor Packages competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Copper Strip for Semiconductor Packages breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Copper Strip for Semiconductor Packages market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Copper Strip for Semiconductor Packages.
Chapter 14 and 15, to describe Copper Strip for Semiconductor Packages sales channel, distributors, customers, research findings and conclusion.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
This report studies the copper strips for semiconductor packages, include the copper strips used in Leadframe, IC Heat Spreaders, Heat Sinks and Ceramic substrates.
Lead Frame Copper Strips are critical in semiconductor packaging, serving as structural and conductive backbones for IC chips. Materials like C19400 and C70250 (Cu-Fe-P alloys) dominate due to their balance of high electrical conductivity (≥58 MS/m) and mechanical strength. These strips enable precise electrical interconnections while enduring thermal cycling (-55°C to 125°C) and mechanical stress during molding. Recent advancements focus on microalloying (e.g., adding 0.1-0.3% Ni) to enhance tensile strength (up to 600 MPa) without sacrificing conductivity, addressing the demand for miniaturized 5G and AI chips.
Heat Spreader Copper Strips address thermal management in high-power devices. Employing Cu-Mo-Cu composites or Cu-Ni-P alloys, these strips offer tailored thermal expansion coefficients (CTE) to match silicon (3 ppm/°C) and ceramic substrates. For example, copper-molybdenum-copper (CMC) sandwiches with 60% Cu layers provide CTE adjustability (5–8 ppm/°C) and thermal conductivity >240 W/m·K, critical for LED and RF modules . Surface treatments like nickel electroplating (5–10 μm) improve adhesion to substrates and resist oxidation, ensuring reliability in automotive and aerospace applications.
Heat Sink Copper Strips prioritize maximizing heat dissipation. Pure copper (≥99.95% purity) dominates due to its 400 W/m·K thermal conductivity, but hybrid designs like copper-graphite composites (thermal conductivity >600 W/m·K) are emerging for AI accelerators. Precision milling enables fin structures <50 μm thick, boosting surface area by 300%, while microchannel cooling (channel width <200 μm) integrates directly into strips for liquid cooling in data centers . Challenges include minimizing warpage during thinning (<0.1 mm) and ensuring compatibility with solder pastes (e.g., SAC305) for die attach.
Ceramic Substrate Copper Strips are pivotal in power electronics. DBC (Direct Bonded Copper) and AMB (Active Metal Brazing) technologies bond 100–300 μm Cu layers to AlN or Si3N4 ceramics, achieving CTE matching (CTE mismatch <1 ppm/°C) and thermal conductivity >180 W/m·K. For EV inverters, laser-drilled vias (Φ<50 μm) in Cu strips enable 3D interconnects, reducing parasitic inductance by 40%. Future trends include Cu-SiC hybrid strips for SiC MOSFET modules, combining Cu’s ductility with SiC’s thermal robustness to handle 300°C junction temperatures.
This report is a detailed and comprehensive analysis for global Copper Strip for Semiconductor Packages market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Copper Strip for Semiconductor Packages market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/ton), 2020-2031
Global Copper Strip for Semiconductor Packages market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/ton), 2020-2031
Global Copper Strip for Semiconductor Packages market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/ton), 2020-2031
Global Copper Strip for Semiconductor Packages market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Copper Strip for Semiconductor Packages
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Copper Strip for Semiconductor Packages market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsubishi Materials, Proterial Metals, Furukawa Electric, Kobe Steel, JX Advanced Metals Corporation, KME, Wieland, Aurubis, Sundwiger Messingwerk, Honeywell, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Copper Strip for Semiconductor Packages market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
C194 and KFC
C7025
C1020
Others
Market segment by Application
Copper Strips for Leadframe
Copper Strips for Heat Spreader
Copper Strips for Heat Sinks
Copper Strips for Ceramic Substrates
Others
Major players covered
Mitsubishi Materials
Proterial Metals
Furukawa Electric
Kobe Steel
JX Advanced Metals Corporation
KME
Wieland
Aurubis
Sundwiger Messingwerk
Honeywell
Poongsan
Korea Trading & Industries Corporation
EUNSUNG CO.,LTD
Haegang AP Co., Ltd
DOWA METALTECH
Sumitomo Metal Mining Co., Ltd.
YAMAKIN (JAPAN) CO.,LTD.
Harada Metal Industry
Ningbo Jintian Copper
Ningbo Boway Alloy Material
Jinchuan Group
GUOXI ULTRAPURE
GRIKIN Advanced Material
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Copper Strip for Semiconductor Packages product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Copper Strip for Semiconductor Packages, with price, sales quantity, revenue, and global market share of Copper Strip for Semiconductor Packages from 2020 to 2025.
Chapter 3, the Copper Strip for Semiconductor Packages competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Copper Strip for Semiconductor Packages breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Copper Strip for Semiconductor Packages market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Copper Strip for Semiconductor Packages.
Chapter 14 and 15, to describe Copper Strip for Semiconductor Packages sales channel, distributors, customers, research findings and conclusion.
Table of Contents
146 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Copper Strip for Semiconductor Packages by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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