Report cover image

Global Copper Conductive Paste Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

Publisher GlobalInfoResearch
Published Jul 16, 2025
Length 100 Pages
SKU # GFSH20197637

Description

According to our (Global Info Research) latest study, the global Copper Conductive Paste market size was valued at US$ 225 million in 2024 and is forecast to a readjusted size of USD 279 million by 2031 with a CAGR of 3.1% during review period.

Copper Conductive Paste is a specialized material used for creating electrical connections in electronic devices, printed circuit boards (PCBs), and various electronic components. It is composed of copper particles suspended in a binder material, often a polymer resin or solvent, which allows for the paste to be applied and cured onto substrates to form conductive pathways.

This report is a detailed and comprehensive analysis for global Copper Conductive Paste market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Copper Conductive Paste market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031

Global Copper Conductive Paste market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031

Global Copper Conductive Paste market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031

Global Copper Conductive Paste market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Copper Conductive Paste

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Copper Conductive Paste market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Ampletec, Chang Sung Corporation, Fenghua Advanced Technology, Heraeus, Material Concept, Mitsuboshi Belting, Shoei Chemical, Sinocera, Sumitomo Metal Mining, Tatsuta, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Copper Conductive Paste market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Low Temperature Sintered
Medium Temperature Sintered
High Temperature Sintered

Market segment by Application
PCB
MLCC
Others

Major players covered
Ampletec
Chang Sung Corporation
Fenghua Advanced Technology
Heraeus
Material Concept
Mitsuboshi Belting
Shoei Chemical
Sinocera
Sumitomo Metal Mining
Tatsuta

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Copper Conductive Paste product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Copper Conductive Paste, with price, sales quantity, revenue, and global market share of Copper Conductive Paste from 2020 to 2025.

Chapter 3, the Copper Conductive Paste competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Copper Conductive Paste breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Copper Conductive Paste market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Copper Conductive Paste.

Chapter 14 and 15, to describe Copper Conductive Paste sales channel, distributors, customers, research findings and conclusion.

Table of Contents

100 Pages
1 Market Overview
2 Manufacturers Profiles
3 Competitive Environment: Copper Conductive Paste by Manufacturer
4 Consumption Analysis by Region
5 Market Segment by Type
6 Market Segment by Application
7 North America
8 Europe
9 Asia-Pacific
How Do Licenses Work?
Head shot

Questions or Comments?

Our team has the ability to search within reports to verify it suits your needs. We can also help maximize your budget by finding sections of reports you can purchase.