Global Chip On Flex (COF) Supply, Demand and Key Producers, 2026-2032
Description
The global Chip On Flex (COF) market size is expected to reach $ 2819 million by 2032, rising at a market growth of 4.4% CAGR during the forecast period (2026-2032).
Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn"t have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths.
This industry is centralized. Top 3 companies in the market occupies about 51% of the Revenue market shares. The major manufacturers of Chip on Flex (COF) are LGIT, Stemco, Flexceed, Chipbond Technology, CWE, Danbond Technology, AKM Industrial, Compass Technology Company, Compunetics and STARS Microelectronics.
This report studies the global Chip On Flex (COF) production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Chip On Flex (COF) and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Chip On Flex (COF) that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Chip On Flex (COF) total production and demand, 2021-2032, (K Units)
Global Chip On Flex (COF) total production value, 2021-2032, (USD Million)
Global Chip On Flex (COF) production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (K Units), (based on production site)
Global Chip On Flex (COF) consumption by region & country, CAGR, 2021-2032 & (K Units)
U.S. VS China: Chip On Flex (COF) domestic production, consumption, key domestic manufacturers and share
Global Chip On Flex (COF) production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (K Units)
Global Chip On Flex (COF) production by Type, production, value, CAGR, 2021-2032, (USD Million) & (K Units)
Global Chip On Flex (COF) production by Application, production, value, CAGR, 2021-2032, (USD Million) & (K Units)
This report profiles key players in the global Chip On Flex (COF) market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include LGIT, Stemco, Flexceed, Chipbond Technology, CWE, Danbond Technology, AKM Industrial, Compass Technology Company, Compunetics, STARS Microelectronics, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Chip On Flex (COF) market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Units) and average price (USD/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Chip On Flex (COF) Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Chip On Flex (COF) Market, Segmentation by Type:
Single Sided COF
Others
Global Chip On Flex (COF) Market, Segmentation by Application:
Military
Medical
Aerospace
Electronics
Others
Companies Profiled:
LGIT
Stemco
Flexceed
Chipbond Technology
CWE
Danbond Technology
AKM Industrial
Compass Technology Company
Compunetics
STARS Microelectronics
Key Questions Answered:
1. How big is the global Chip On Flex (COF) market?
2. What is the demand of the global Chip On Flex (COF) market?
3. What is the year over year growth of the global Chip On Flex (COF) market?
4. What is the production and production value of the global Chip On Flex (COF) market?
5. Who are the key producers in the global Chip On Flex (COF) market?
6. What are the growth factors driving the market demand?
Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn"t have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths.
This industry is centralized. Top 3 companies in the market occupies about 51% of the Revenue market shares. The major manufacturers of Chip on Flex (COF) are LGIT, Stemco, Flexceed, Chipbond Technology, CWE, Danbond Technology, AKM Industrial, Compass Technology Company, Compunetics and STARS Microelectronics.
This report studies the global Chip On Flex (COF) production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Chip On Flex (COF) and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Chip On Flex (COF) that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Chip On Flex (COF) total production and demand, 2021-2032, (K Units)
Global Chip On Flex (COF) total production value, 2021-2032, (USD Million)
Global Chip On Flex (COF) production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (K Units), (based on production site)
Global Chip On Flex (COF) consumption by region & country, CAGR, 2021-2032 & (K Units)
U.S. VS China: Chip On Flex (COF) domestic production, consumption, key domestic manufacturers and share
Global Chip On Flex (COF) production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (K Units)
Global Chip On Flex (COF) production by Type, production, value, CAGR, 2021-2032, (USD Million) & (K Units)
Global Chip On Flex (COF) production by Application, production, value, CAGR, 2021-2032, (USD Million) & (K Units)
This report profiles key players in the global Chip On Flex (COF) market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include LGIT, Stemco, Flexceed, Chipbond Technology, CWE, Danbond Technology, AKM Industrial, Compass Technology Company, Compunetics, STARS Microelectronics, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Chip On Flex (COF) market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Units) and average price (USD/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Chip On Flex (COF) Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Chip On Flex (COF) Market, Segmentation by Type:
Single Sided COF
Others
Global Chip On Flex (COF) Market, Segmentation by Application:
Military
Medical
Aerospace
Electronics
Others
Companies Profiled:
LGIT
Stemco
Flexceed
Chipbond Technology
CWE
Danbond Technology
AKM Industrial
Compass Technology Company
Compunetics
STARS Microelectronics
Key Questions Answered:
1. How big is the global Chip On Flex (COF) market?
2. What is the demand of the global Chip On Flex (COF) market?
3. What is the year over year growth of the global Chip On Flex (COF) market?
4. What is the production and production value of the global Chip On Flex (COF) market?
5. Who are the key producers in the global Chip On Flex (COF) market?
6. What are the growth factors driving the market demand?
Table of Contents
98 Pages
- 1 Supply Summary
- 2 Demand Summary
- 3 World Manufacturers Competitive Analysis
- 4 United States VS China VS Rest of the World
- 5 Market Analysis by Type
- 6 Market Analysis by Application
- 7 Company Profiles
- 8 Industry Chain Analysis
- 9 Research Findings and Conclusion
- 10 Appendix
Pricing
Currency Rates
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