Global CMP Slurries for Advanced Packaging Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global CMP Slurries for Advanced Packaging market size was valued at US$ 70.6 million in 2024 and is forecast to a readjusted size of USD 114 million by 2031 with a CAGR of 7.2% during review period.
Chemical mechanical polishing/planarization (CMP) slurries are abrasive materials, also called non-crystalline inorganic oxides, which are dispersed in water blended with other chemicals and used in CMP processes for semiconductors. CMP process is employed in semiconductor manufacturing, where surfaces of wafers are smoothed and leveled with the help of abrasive slurries. This process is critical for precise lithography patterning, and is utilized after every deposition-etch step.
This report studies the CMP Slurries for semiconductor Advanced Packaging, used in TSV, and Hybrid Bonding, etc.
According to our research, the global semiconductor packaging and testing market size in 2023 was approximately US$ 82.6 billion, of which advanced packaging accounts for 48% and traditional packaging accounts for 52%. There are three types of advanced packaging companies, namely OSAT, IDM and Foundry. OSAT is in a dominant position, accounting for about 65% of advanced packaging, IDM accounts for about 22% of advanced packaging, and foundry companies' advanced packaging business accounts for the remaining 13%. It is expected that the proportion of OSAT and foundry companies' advanced packaging business will further increase in the next few years.
This report is a detailed and comprehensive analysis for global CMP Slurries for Advanced Packaging market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global CMP Slurries for Advanced Packaging market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global CMP Slurries for Advanced Packaging market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global CMP Slurries for Advanced Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global CMP Slurries for Advanced Packaging market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Kg), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for CMP Slurries for Advanced Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global CMP Slurries for Advanced Packaging market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DuPont, Fujifilm, Fujimi Incorporated, Resonac, Anjimirco Shanghai, Soulbrain, SKC, AGC, Merck (Versum Materials), Saint-Gobain, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
CMP Slurries for Advanced Packaging market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Cu Barrier & TSV Slurry
Si and Back Side of TSV Substrate
Others
Market segment by Application
3D TSV
Hybrid Bonding
Major players covered
DuPont
Fujifilm
Fujimi Incorporated
Resonac
Anjimirco Shanghai
Soulbrain
SKC
AGC
Merck (Versum Materials)
Saint-Gobain
Dongjin Semichem
SKC (SK Enpulse)
TOPPAN INFOMEDIA
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe CMP Slurries for Advanced Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of CMP Slurries for Advanced Packaging, with price, sales quantity, revenue, and global market share of CMP Slurries for Advanced Packaging from 2020 to 2025.
Chapter 3, the CMP Slurries for Advanced Packaging competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the CMP Slurries for Advanced Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and CMP Slurries for Advanced Packaging market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of CMP Slurries for Advanced Packaging.
Chapter 14 and 15, to describe CMP Slurries for Advanced Packaging sales channel, distributors, customers, research findings and conclusion.
Chemical mechanical polishing/planarization (CMP) slurries are abrasive materials, also called non-crystalline inorganic oxides, which are dispersed in water blended with other chemicals and used in CMP processes for semiconductors. CMP process is employed in semiconductor manufacturing, where surfaces of wafers are smoothed and leveled with the help of abrasive slurries. This process is critical for precise lithography patterning, and is utilized after every deposition-etch step.
This report studies the CMP Slurries for semiconductor Advanced Packaging, used in TSV, and Hybrid Bonding, etc.
According to our research, the global semiconductor packaging and testing market size in 2023 was approximately US$ 82.6 billion, of which advanced packaging accounts for 48% and traditional packaging accounts for 52%. There are three types of advanced packaging companies, namely OSAT, IDM and Foundry. OSAT is in a dominant position, accounting for about 65% of advanced packaging, IDM accounts for about 22% of advanced packaging, and foundry companies' advanced packaging business accounts for the remaining 13%. It is expected that the proportion of OSAT and foundry companies' advanced packaging business will further increase in the next few years.
This report is a detailed and comprehensive analysis for global CMP Slurries for Advanced Packaging market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global CMP Slurries for Advanced Packaging market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global CMP Slurries for Advanced Packaging market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global CMP Slurries for Advanced Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global CMP Slurries for Advanced Packaging market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Kg), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for CMP Slurries for Advanced Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global CMP Slurries for Advanced Packaging market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DuPont, Fujifilm, Fujimi Incorporated, Resonac, Anjimirco Shanghai, Soulbrain, SKC, AGC, Merck (Versum Materials), Saint-Gobain, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
CMP Slurries for Advanced Packaging market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Cu Barrier & TSV Slurry
Si and Back Side of TSV Substrate
Others
Market segment by Application
3D TSV
Hybrid Bonding
Major players covered
DuPont
Fujifilm
Fujimi Incorporated
Resonac
Anjimirco Shanghai
Soulbrain
SKC
AGC
Merck (Versum Materials)
Saint-Gobain
Dongjin Semichem
SKC (SK Enpulse)
TOPPAN INFOMEDIA
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe CMP Slurries for Advanced Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of CMP Slurries for Advanced Packaging, with price, sales quantity, revenue, and global market share of CMP Slurries for Advanced Packaging from 2020 to 2025.
Chapter 3, the CMP Slurries for Advanced Packaging competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the CMP Slurries for Advanced Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and CMP Slurries for Advanced Packaging market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of CMP Slurries for Advanced Packaging.
Chapter 14 and 15, to describe CMP Slurries for Advanced Packaging sales channel, distributors, customers, research findings and conclusion.
Table of Contents
107 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: CMP Slurries for Advanced Packaging by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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