Global Bonder Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Bonder market size was valued at US$ 2627 million in 2024 and is forecast to a readjusted size of USD 3637 million by 2031 with a CAGR of 4.6% during review period.
Wire Bonder, Die Bonder, and FC Bonder are specialized types of bonding machines used in the semiconductor industry for the assembly of integrated circuits (ICs) and other electronic components. Each serves a specific purpose in the manufacturing process:
Wire Bonder:
A wire bonder is a machine used to create wire bonds, which are electrical connections between the leads of a semiconductor device and the conductive pads on the die. This process is critical in packaging semiconductor devices. The wire bonder uses a fine wire (often gold or aluminum) to form a connection by creating a ball or wedge at the end of the wire, which is then pressed onto the pad on the die. There are two primary types of wire bonding:
Ball Bonder: This machine forms a ball at the end of the wire and uses it to make the first bond (the ball bond) on the die pad. The wire is then stretched to the lead and another bond (the stitch bond) is formed.
Wedge Bonder: This machine uses a wedge-shaped tool to bond the wire to the die pad and the lead.
Die Bonder:
A die bonder is a machine that attaches semiconductor dice (the individual chips or integrated circuits) to their packages. This is typically done using an adhesive, solder, or eutectic bonding. The die bonder positions the die with precision and applies the necessary force and heat to create a secure bond between the die and the package substrate. This process is essential for ensuring the mechanical and electrical integrity of the final semiconductor device.
FC Bonder (Flip Chip Bonder):
FC bonding, also known as flip chip bonding, is a technique where the die is mounted face-down onto a substrate, with the bond pads on the die's active surface directly connecting to the pads on the substrate. An FC bonder is designed to perform this process. The bonder can use various methods to attach the die, including soldering, conductive adhesive, or ultrasonic bonding. Flip chip technology is often used in high-performance applications due to its smaller footprint and better heat dissipation.
All these bonding machines are precision instruments that must maintain tight tolerances to ensure the reliability and performance of the electronic components they are used to assemble. They are equipped with advanced vision systems and control software to achieve the high accuracy required for these delicate operations.
Market DriversSemiconductor
Industry Growth: Rapid development in areas such as 5G, AI, IoT, automotive electronics, etc. is driving the demand for advanced packaging technologies, which in turn is increasing the demand for bonding machines.
Advanced Packaging Technologies: Popularity of technologies such as wafer level packaging (WLP), 3D packaging, and heterogeneous integration is driving the demand for high-precision bonding machines.
MEMS and Sensor Applications: Widespread use of MEMS and sensors in consumer electronics, automotive, medical, and other fields has increased the demand for bonding machines.
Miniaturisation and high performance trends: electronic devices are developing towards smaller, lighter and higher performance, requiring more precise bonding technology.
Emerging application fields: the development of emerging fields such as flexible electronics, wearable devices, AR/VR, etc. provides new growth points for the bonding machine market.
Market ChallengesHigh
Technical Threshold: The development and production of high-precision bonding machines requires a high level of technical accumulation, which restricts new entrants.
Cost pressure: High-end bonding machines are expensive, and small and medium-sized enterprises may face procurement pressure.
Supply Chain Risk: Uncertainty in the global supply chain may affect the production and delivery of bonding machines.
Market Trends
High Precision and Multifunctionality: As packaging technology becomes more complex, the market demand for high-precision and multifunctional bonding machines increases.
Automation and Intelligence: The application of automated bonding machines and intelligent production lines is gradually gaining popularity, improving production efficiency and consistency.
New bonding technologies: The development of new technologies such as laser bonding and low-temperature bonding has brought new opportunities to the bonding machine market.
Environmental protection and energy saving: the demand for environmentally friendly bonding machines and energy saving technologies is gradually increasing.
Regionalised production: In order to reduce supply chain risks, the production of bonding machines is gradually developing in the direction of regionalisation and localisation.
Regional Market Analysis
Asia-Pacific: The global centre of semiconductor and electronics manufacturing, especially China, South Korea, Japan and Taiwan, has the highest market demand.
North America: technological innovation and high-end manufacturing to drive market demand.
Europe: Strong demand in automotive and industrial electronics.
Other regions: the market is in the development stage with high potential.
Future OutlookWith
the continued development of semiconductor, MEMS, sensors and other fields, the bonding machine market will maintain rapid growth. High precision, automation, intelligence and the application of new bonding technology will become the main direction of future development.
Bonding machine market prospects, technological progress and industry demand is the main driving force. In the future, high precision, automation, intelligence and new bonding technology will become the mainstream of the market.
This report is a detailed and comprehensive analysis for global Bonder market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Bonder market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Bonder market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Bonder market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Bonder market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Bonder
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Bonder market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Besi, ASMPT Ltd, Kulicke & Soffa, Shibaura, Shinkawa Ltd., Fasford Technology, SUSS MicroTec, Hanmi, Palomar Technologies, Panasonic, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Bonder market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Wire Bonder
Die Bonder
FC Bonder
Market segment by Application
Integrated device manufacturer (IDMs)
Outsourced semiconductor assembly and test (OSATs)
Major players covered
Besi
ASMPT Ltd
Kulicke & Soffa
Shibaura
Shinkawa Ltd.
Fasford Technology
SUSS MicroTec
Hanmi
Palomar Technologies
Panasonic
Toray Engineering
Ultrasonic Engineering
Hesse GmbH
SET
F&K Delvotec
WestBond, Inc.
Hybond
DIAS Automation
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Bonder product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Bonder, with price, sales quantity, revenue, and global market share of Bonder from 2020 to 2025.
Chapter 3, the Bonder competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Bonder breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Bonder market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Bonder.
Chapter 14 and 15, to describe Bonder sales channel, distributors, customers, research findings and conclusion.
Wire Bonder, Die Bonder, and FC Bonder are specialized types of bonding machines used in the semiconductor industry for the assembly of integrated circuits (ICs) and other electronic components. Each serves a specific purpose in the manufacturing process:
Wire Bonder:
A wire bonder is a machine used to create wire bonds, which are electrical connections between the leads of a semiconductor device and the conductive pads on the die. This process is critical in packaging semiconductor devices. The wire bonder uses a fine wire (often gold or aluminum) to form a connection by creating a ball or wedge at the end of the wire, which is then pressed onto the pad on the die. There are two primary types of wire bonding:
Ball Bonder: This machine forms a ball at the end of the wire and uses it to make the first bond (the ball bond) on the die pad. The wire is then stretched to the lead and another bond (the stitch bond) is formed.
Wedge Bonder: This machine uses a wedge-shaped tool to bond the wire to the die pad and the lead.
Die Bonder:
A die bonder is a machine that attaches semiconductor dice (the individual chips or integrated circuits) to their packages. This is typically done using an adhesive, solder, or eutectic bonding. The die bonder positions the die with precision and applies the necessary force and heat to create a secure bond between the die and the package substrate. This process is essential for ensuring the mechanical and electrical integrity of the final semiconductor device.
FC Bonder (Flip Chip Bonder):
FC bonding, also known as flip chip bonding, is a technique where the die is mounted face-down onto a substrate, with the bond pads on the die's active surface directly connecting to the pads on the substrate. An FC bonder is designed to perform this process. The bonder can use various methods to attach the die, including soldering, conductive adhesive, or ultrasonic bonding. Flip chip technology is often used in high-performance applications due to its smaller footprint and better heat dissipation.
All these bonding machines are precision instruments that must maintain tight tolerances to ensure the reliability and performance of the electronic components they are used to assemble. They are equipped with advanced vision systems and control software to achieve the high accuracy required for these delicate operations.
Market DriversSemiconductor
Industry Growth: Rapid development in areas such as 5G, AI, IoT, automotive electronics, etc. is driving the demand for advanced packaging technologies, which in turn is increasing the demand for bonding machines.
Advanced Packaging Technologies: Popularity of technologies such as wafer level packaging (WLP), 3D packaging, and heterogeneous integration is driving the demand for high-precision bonding machines.
MEMS and Sensor Applications: Widespread use of MEMS and sensors in consumer electronics, automotive, medical, and other fields has increased the demand for bonding machines.
Miniaturisation and high performance trends: electronic devices are developing towards smaller, lighter and higher performance, requiring more precise bonding technology.
Emerging application fields: the development of emerging fields such as flexible electronics, wearable devices, AR/VR, etc. provides new growth points for the bonding machine market.
Market ChallengesHigh
Technical Threshold: The development and production of high-precision bonding machines requires a high level of technical accumulation, which restricts new entrants.
Cost pressure: High-end bonding machines are expensive, and small and medium-sized enterprises may face procurement pressure.
Supply Chain Risk: Uncertainty in the global supply chain may affect the production and delivery of bonding machines.
Market Trends
High Precision and Multifunctionality: As packaging technology becomes more complex, the market demand for high-precision and multifunctional bonding machines increases.
Automation and Intelligence: The application of automated bonding machines and intelligent production lines is gradually gaining popularity, improving production efficiency and consistency.
New bonding technologies: The development of new technologies such as laser bonding and low-temperature bonding has brought new opportunities to the bonding machine market.
Environmental protection and energy saving: the demand for environmentally friendly bonding machines and energy saving technologies is gradually increasing.
Regionalised production: In order to reduce supply chain risks, the production of bonding machines is gradually developing in the direction of regionalisation and localisation.
Regional Market Analysis
Asia-Pacific: The global centre of semiconductor and electronics manufacturing, especially China, South Korea, Japan and Taiwan, has the highest market demand.
North America: technological innovation and high-end manufacturing to drive market demand.
Europe: Strong demand in automotive and industrial electronics.
Other regions: the market is in the development stage with high potential.
Future OutlookWith
the continued development of semiconductor, MEMS, sensors and other fields, the bonding machine market will maintain rapid growth. High precision, automation, intelligence and the application of new bonding technology will become the main direction of future development.
Bonding machine market prospects, technological progress and industry demand is the main driving force. In the future, high precision, automation, intelligence and new bonding technology will become the mainstream of the market.
This report is a detailed and comprehensive analysis for global Bonder market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Bonder market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Bonder market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Bonder market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031
Global Bonder market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Bonder
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Bonder market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Besi, ASMPT Ltd, Kulicke & Soffa, Shibaura, Shinkawa Ltd., Fasford Technology, SUSS MicroTec, Hanmi, Palomar Technologies, Panasonic, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Bonder market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Wire Bonder
Die Bonder
FC Bonder
Market segment by Application
Integrated device manufacturer (IDMs)
Outsourced semiconductor assembly and test (OSATs)
Major players covered
Besi
ASMPT Ltd
Kulicke & Soffa
Shibaura
Shinkawa Ltd.
Fasford Technology
SUSS MicroTec
Hanmi
Palomar Technologies
Panasonic
Toray Engineering
Ultrasonic Engineering
Hesse GmbH
SET
F&K Delvotec
WestBond, Inc.
Hybond
DIAS Automation
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Bonder product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Bonder, with price, sales quantity, revenue, and global market share of Bonder from 2020 to 2025.
Chapter 3, the Bonder competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Bonder breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Bonder market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Bonder.
Chapter 14 and 15, to describe Bonder sales channel, distributors, customers, research findings and conclusion.
Table of Contents
137 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Bonder by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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