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Global BGA Heat Sinks Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

Publisher GlobalInfoResearch
Published Jul 28, 2025
Length 118 Pages
SKU # GFSH20220908

Description

According to our (Global Info Research) latest study, the global BGA Heat Sinks market size was valued at US$ 375 million in 2024 and is forecast to a readjusted size of USD 627 million by 2031 with a CAGR of 7.7% during review period.

BGA heat sinks are named as such because they are mounted to BGA devices, but are actually just simple extrusions. BGA heat sinks are usually crosscut to convert the extruded fins into pins which allow them to be used in more diverse applications.

This report is a detailed and comprehensive analysis for global BGA Heat Sinks market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global BGA Heat Sinks market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global BGA Heat Sinks market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global BGA Heat Sinks market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global BGA Heat Sinks market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for BGA Heat Sinks

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global BGA Heat Sinks market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Boyd, Wakefield Thermal, Advanced Thermal Solutions, Ohmite, Trenz Electronic, CTS Corporation, CUI Devices, TE Connectivity, Cooliance, Magntek Electronic, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

BGA Heat Sinks market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Aluminum
Copper
Others

Market segment by Application
Motherboards
Video Cards
Others

Major players covered
Boyd
Wakefield Thermal
Advanced Thermal Solutions
Ohmite
Trenz Electronic
CTS Corporation
CUI Devices
TE Connectivity
Cooliance
Magntek Electronic
COFAN USA
Broadlake
Suzhou Xunchuan Electronics
Shenzhen Lori Technology

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe BGA Heat Sinks product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of BGA Heat Sinks, with price, sales quantity, revenue, and global market share of BGA Heat Sinks from 2020 to 2025.

Chapter 3, the BGA Heat Sinks competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the BGA Heat Sinks breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and BGA Heat Sinks market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of BGA Heat Sinks.

Chapter 14 and 15, to describe BGA Heat Sinks sales channel, distributors, customers, research findings and conclusion.

Table of Contents

118 Pages
1 Market Overview
2 Manufacturers Profiles
3 Competitive Environment: BGA Heat Sinks by Manufacturer
4 Consumption Analysis by Region
5 Market Segment by Type
6 Market Segment by Application
7 North America
8 Europe
9 Asia-Pacific
10 South America
11 Middle East & Africa
12 Market Dynamics
13 Raw Material and Industry Chain
14 Shipments by Distribution Channel
15 Research Findings and Conclusion
16 Appendix
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