Global AuSn Solder Material Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global AuSn Solder Material market size was valued at US$ 216 million in 2024 and is forecast to a readjusted size of USD 303 million by 2031 with a CAGR of 5.0% during review period.
AuSn Solder Material is generally used in applications that require a high melting temperature (over 150°C), good thermal fatigue properties, and high-temperature strength. It is also used in applications that require a high tensile strength and high corrosive resistance, or in step soldering applications where the paste will not melt during a subsequent low-temperature reflow process.
AuSn solder material, also known as gold-tin solder, is a welding material composed of two metals: gold (Au) and tin (Sn). Due to its excellent conductivity, corrosion resistance, and reliable soldering performance, AuSn solder material has found wide applications in microelectronics, optoelectronics, aerospace, and other industries. It is commonly used for connecting delicate electronic devices, optical fiber components, and applications requiring high-reliability joints. However, with increasing environmental awareness and stricter regulations on hazardous substances, certain solder materials containing harmful components have faced restrictions in the market. AuSn solder material, containing precious metals, tends to have a higher cost, which could pose challenges in cost-sensitive applications. Therefore, in recent years, researchers have been working on maintaining the advantages of AuSn solder material while also exploring the development of more environmentally friendly and cost-effective alternatives to address these concerns.
This report is a detailed and comprehensive analysis for global AuSn Solder Material market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global AuSn Solder Material market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global AuSn Solder Material market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global AuSn Solder Material market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global AuSn Solder Material market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for AuSn Solder Material
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global AuSn Solder Material market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsubishi Materials, Indium Corporation, AIM Solder, Chengdu Apex New Materials, Guangzhou Xianyi Electronic Technology, FiTech, Sumitomo Metal Mining, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
AuSn Solder Material market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Au80/Sn20
Au78/Sn22
Other
Market segment by Application
Radio Frequency Devices
Opto-electronic Devices
SAW Filter
Quartz Oscillator
Other
Major players covered
Mitsubishi Materials
Indium Corporation
AIM Solder
Chengdu Apex New Materials
Guangzhou Xianyi Electronic Technology
FiTech
Sumitomo Metal Mining
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe AuSn Solder Material product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of AuSn Solder Material, with price, sales quantity, revenue, and global market share of AuSn Solder Material from 2020 to 2025.
Chapter 3, the AuSn Solder Material competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the AuSn Solder Material breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and AuSn Solder Material market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of AuSn Solder Material.
Chapter 14 and 15, to describe AuSn Solder Material sales channel, distributors, customers, research findings and conclusion.
AuSn Solder Material is generally used in applications that require a high melting temperature (over 150°C), good thermal fatigue properties, and high-temperature strength. It is also used in applications that require a high tensile strength and high corrosive resistance, or in step soldering applications where the paste will not melt during a subsequent low-temperature reflow process.
AuSn solder material, also known as gold-tin solder, is a welding material composed of two metals: gold (Au) and tin (Sn). Due to its excellent conductivity, corrosion resistance, and reliable soldering performance, AuSn solder material has found wide applications in microelectronics, optoelectronics, aerospace, and other industries. It is commonly used for connecting delicate electronic devices, optical fiber components, and applications requiring high-reliability joints. However, with increasing environmental awareness and stricter regulations on hazardous substances, certain solder materials containing harmful components have faced restrictions in the market. AuSn solder material, containing precious metals, tends to have a higher cost, which could pose challenges in cost-sensitive applications. Therefore, in recent years, researchers have been working on maintaining the advantages of AuSn solder material while also exploring the development of more environmentally friendly and cost-effective alternatives to address these concerns.
This report is a detailed and comprehensive analysis for global AuSn Solder Material market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global AuSn Solder Material market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global AuSn Solder Material market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global AuSn Solder Material market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global AuSn Solder Material market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for AuSn Solder Material
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global AuSn Solder Material market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsubishi Materials, Indium Corporation, AIM Solder, Chengdu Apex New Materials, Guangzhou Xianyi Electronic Technology, FiTech, Sumitomo Metal Mining, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
AuSn Solder Material market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Au80/Sn20
Au78/Sn22
Other
Market segment by Application
Radio Frequency Devices
Opto-electronic Devices
SAW Filter
Quartz Oscillator
Other
Major players covered
Mitsubishi Materials
Indium Corporation
AIM Solder
Chengdu Apex New Materials
Guangzhou Xianyi Electronic Technology
FiTech
Sumitomo Metal Mining
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe AuSn Solder Material product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of AuSn Solder Material, with price, sales quantity, revenue, and global market share of AuSn Solder Material from 2020 to 2025.
Chapter 3, the AuSn Solder Material competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the AuSn Solder Material breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and AuSn Solder Material market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of AuSn Solder Material.
Chapter 14 and 15, to describe AuSn Solder Material sales channel, distributors, customers, research findings and conclusion.
Table of Contents
98 Pages
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