Global Atomic Layer Deposition Equipment (ALD) Supply, Demand and Key Producers, 2026-2032
Description
The global Atomic Layer Deposition Equipment (ALD) market size is expected to reach $ 10320 million by 2032, rising at a market growth of 11.6% CAGR during the forecast period (2026-2032).
In 2024, global Atomic Layer Deposition Equipment production capacity is 2,800 units, with production reached approximately 2,122 units, with an average global market price of around US$ 2 million per unit. The market gross margin is mainly 35%-45%.
Atomic Layer Deposition Equipment (ALD) is a versatile research deposition tool for thermal or energy enhanced ALD. Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors (also called "reactants"). These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. A thin film is slowly deposited through repeated exposure to separate precursors. ALD is a key process in fabricating semiconductor devices, and part of the set of tools for synthesising nanomaterials.
The Atomic Layer Deposition (ALD) equipment industry chain exhibits a four-segment structure: precursor chemicals, core components, system manufacturers, and downstream applications. The upstream segment primarily includes the metal-organic precursors required for ALD (TMA, TDMAT, HCDS, Ru/CO/W-based precursors, etc.), rare gases and high-purity carrier gases, as well as core equipment components, including high-precision mass flow controllers (MFC), vacuum pumps, ALD-specific valve groups, plasma sources, evaporators, heating platforms, temperature control systems, quartz/SiC reaction chambers, and high-purity piping. Suppliers include Entegris, CKD, VAT, Edwards, Pfeiffer, MKS, and Horiba.
The midstream segment comprises ALD system manufacturers, representing the technological core of the industry chain. This segment is responsible for process integration, including chamber design, precursor pulse sequence control, gas path isolation, thermal field uniformity, plasma coupling, and thin film uniformity algorithms. Leading companies include ASM, Tokyo Electron, Lam Research, Applied Materials, Jusung Engineering, NAURA, Mattson, Oxford Instruments, and Beneq. Different equipment targets different processes: Thermal ALD/PEALD is mainly used for advanced logic and memory; Batch ALD is used for high-volume DRAM/NAND and photovoltaics; and Spatial ALD is used for OLED and Micro-LED packaging.
Downstream applications are wide-ranging, including front-end (FEOL) high-k gate dielectrics and interface layers, back-end (BEOL) barrier/liner and Cu/Co/Ru metal filling, 3D NAND high aspect ratio structures, DRAM capacitor dielectric layers, and display (OLED/Micro-LED) barrier layers, photovoltaic Al₂O₃ passivation layers, battery separator coatings, and MEMS devices. With the increasing penetration of advanced processes, 3D structures, and flexible electronics, ALD has become one of the fastest-growing and most technologically advanced key equipment in the semiconductor equipment industry chain.
The Atomic Layer Deposition Equipment (ALD) market holds substantial potential across diverse applications, driven by the escalating demand for precise, ultra - thin, and high - quality thin - film coatings. In the semiconductor industry, ALD equipment is indispensable for fabricating advanced integrated circuits. As chip manufacturers strive to achieve smaller transistor sizes and higher device densities, ALD enables the deposition of extremely uniform and conformal thin films with atomic - level precision. This is crucial for gate dielectric formation, metal electrode deposition, and other critical processes in semiconductor manufacturing, ensuring enhanced device performance, reliability, and power efficiency. With the continuous evolution towards 5nm, 3nm, and even smaller technology nodes, the need for ALD equipment in semiconductor fabrication will only intensify.
In the display industry, ALD plays a vital role in improving the performance of display panels. It is used to deposit thin films for organic light - emitting diodes (OLEDs) and liquid - crystal displays (LCDs), enhancing their brightness, contrast, and lifespan. For OLEDs, ALD can precisely deposit hole - injection and electron - transport layers, optimizing the light - emitting efficiency. In LCDs, it helps in creating high - quality thin - film transistors (TFTs), enabling faster response times and better image quality. As the market for high - resolution, large - screen displays continues to grow, the demand for ALD equipment in display manufacturing will surge.
The energy sector also offers significant opportunities for the ALD equipment market. In the production of solar cells, ALD can deposit anti - reflective coatings and passivation layers, increasing the efficiency of sunlight absorption and reducing carrier recombination. This leads to higher power conversion efficiencies and lower production costs for solar panels. Additionally, in the development of advanced batteries, ALD is used to coat electrode materials, improving their electrochemical performance, stability, and cycle life. As the world transitions towards renewable energy sources and the demand for energy storage solutions rises, the application of ALD equipment in the energy industry will expand rapidly.
In the field of nanotechnology and research, ALD equipment is a key tool for fabricating nanostructured materials with precise control over their composition and structure. Scientists use ALD to create novel materials for various applications, such as catalysis, sensors, and drug delivery systems. By enabling the deposition of thin films layer - by - layer, ALD allows researchers to tailor the properties of materials at the nanoscale, opening up new possibilities for scientific discovery and technological innovation.
Furthermore, in the microelectromechanical systems (MEMS) industry, ALD is used to deposit protective and functional thin films on MEMS devices. This improves their reliability, performance, and functionality, making them suitable for applications in automotive sensors, consumer electronics, and medical devices. As the MEMS market continues to grow, driven by the increasing demand for miniaturized and intelligent devices, the adoption of ALD equipment will also increase. Overall, with its wide - ranging applications across multiple high - tech industries and the continuous pursuit of technological advancements, the Atomic Layer Deposition Equipment market is poised for remarkable growth, offering abundant opportunities for innovation and market expansion.
This report studies the global Atomic Layer Deposition Equipment (ALD) production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Atomic Layer Deposition Equipment (ALD) and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Atomic Layer Deposition Equipment (ALD) that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Atomic Layer Deposition Equipment (ALD) total production and demand, 2021-2032, (Units)
Global Atomic Layer Deposition Equipment (ALD) total production value, 2021-2032, (USD Million)
Global Atomic Layer Deposition Equipment (ALD) production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)
Global Atomic Layer Deposition Equipment (ALD) consumption by region & country, CAGR, 2021-2032 & (Units)
U.S. VS China: Atomic Layer Deposition Equipment (ALD) domestic production, consumption, key domestic manufacturers and share
Global Atomic Layer Deposition Equipment (ALD) production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)
Global Atomic Layer Deposition Equipment (ALD) production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)
Global Atomic Layer Deposition Equipment (ALD) production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)
This report profiles key players in the global Atomic Layer Deposition Equipment (ALD) market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASM International, Tokyo Electron, Lam Research, Applied Materials, Eugenus, Veeco, Picosun, Qingdao Sifang SRI Intellectual Technology Co., Leadmicro, Ideal Deposition, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Atomic Layer Deposition Equipment (ALD) market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Atomic Layer Deposition Equipment (ALD) Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Atomic Layer Deposition Equipment (ALD) Market, Segmentation by Type:
Thermal ALD
PE-ALD
Spatial ALD
Others
Global Atomic Layer Deposition Equipment (ALD) Market, Segmentation by Process Flow:
R&D Machine
Mass Production Machine
Global Atomic Layer Deposition Equipment (ALD) Market, Segmentation by Chamber:
Single-chamber ALD
Multi-chamber ALD
Global Atomic Layer Deposition Equipment (ALD) Market, Segmentation by Application:
Scientific Research
Power/Compound Semiconductors
Integrated Circuits
Display Industry
Photovoltaics
Others
Companies Profiled:
ASM International
Tokyo Electron
Lam Research
Applied Materials
Eugenus
Veeco
Picosun
Qingdao Sifang SRI Intellectual Technology Co.
Leadmicro
Ideal Deposition
NAURA
Oxford Instruments
Songyu Technology
Forge Nano
Solaytec
NCD
CN1
Wonik IPS
Jusung
Samco
ULVAC
Arradiance
SENTECH Instruments
SVT Associates
Piotech
ANAME
Superald, LLC
Nexusbe
Swiss Cluster
MNT Technology
Shenyang Piotech
Shenzhen Nashe Intelligent Equipment Co., Ltd.
Key Questions Answered:
1. How big is the global Atomic Layer Deposition Equipment (ALD) market?
2. What is the demand of the global Atomic Layer Deposition Equipment (ALD) market?
3. What is the year over year growth of the global Atomic Layer Deposition Equipment (ALD) market?
4. What is the production and production value of the global Atomic Layer Deposition Equipment (ALD) market?
5. Who are the key producers in the global Atomic Layer Deposition Equipment (ALD) market?
6. What are the growth factors driving the market demand?
In 2024, global Atomic Layer Deposition Equipment production capacity is 2,800 units, with production reached approximately 2,122 units, with an average global market price of around US$ 2 million per unit. The market gross margin is mainly 35%-45%.
Atomic Layer Deposition Equipment (ALD) is a versatile research deposition tool for thermal or energy enhanced ALD. Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors (also called "reactants"). These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. A thin film is slowly deposited through repeated exposure to separate precursors. ALD is a key process in fabricating semiconductor devices, and part of the set of tools for synthesising nanomaterials.
The Atomic Layer Deposition (ALD) equipment industry chain exhibits a four-segment structure: precursor chemicals, core components, system manufacturers, and downstream applications. The upstream segment primarily includes the metal-organic precursors required for ALD (TMA, TDMAT, HCDS, Ru/CO/W-based precursors, etc.), rare gases and high-purity carrier gases, as well as core equipment components, including high-precision mass flow controllers (MFC), vacuum pumps, ALD-specific valve groups, plasma sources, evaporators, heating platforms, temperature control systems, quartz/SiC reaction chambers, and high-purity piping. Suppliers include Entegris, CKD, VAT, Edwards, Pfeiffer, MKS, and Horiba.
The midstream segment comprises ALD system manufacturers, representing the technological core of the industry chain. This segment is responsible for process integration, including chamber design, precursor pulse sequence control, gas path isolation, thermal field uniformity, plasma coupling, and thin film uniformity algorithms. Leading companies include ASM, Tokyo Electron, Lam Research, Applied Materials, Jusung Engineering, NAURA, Mattson, Oxford Instruments, and Beneq. Different equipment targets different processes: Thermal ALD/PEALD is mainly used for advanced logic and memory; Batch ALD is used for high-volume DRAM/NAND and photovoltaics; and Spatial ALD is used for OLED and Micro-LED packaging.
Downstream applications are wide-ranging, including front-end (FEOL) high-k gate dielectrics and interface layers, back-end (BEOL) barrier/liner and Cu/Co/Ru metal filling, 3D NAND high aspect ratio structures, DRAM capacitor dielectric layers, and display (OLED/Micro-LED) barrier layers, photovoltaic Al₂O₃ passivation layers, battery separator coatings, and MEMS devices. With the increasing penetration of advanced processes, 3D structures, and flexible electronics, ALD has become one of the fastest-growing and most technologically advanced key equipment in the semiconductor equipment industry chain.
The Atomic Layer Deposition Equipment (ALD) market holds substantial potential across diverse applications, driven by the escalating demand for precise, ultra - thin, and high - quality thin - film coatings. In the semiconductor industry, ALD equipment is indispensable for fabricating advanced integrated circuits. As chip manufacturers strive to achieve smaller transistor sizes and higher device densities, ALD enables the deposition of extremely uniform and conformal thin films with atomic - level precision. This is crucial for gate dielectric formation, metal electrode deposition, and other critical processes in semiconductor manufacturing, ensuring enhanced device performance, reliability, and power efficiency. With the continuous evolution towards 5nm, 3nm, and even smaller technology nodes, the need for ALD equipment in semiconductor fabrication will only intensify.
In the display industry, ALD plays a vital role in improving the performance of display panels. It is used to deposit thin films for organic light - emitting diodes (OLEDs) and liquid - crystal displays (LCDs), enhancing their brightness, contrast, and lifespan. For OLEDs, ALD can precisely deposit hole - injection and electron - transport layers, optimizing the light - emitting efficiency. In LCDs, it helps in creating high - quality thin - film transistors (TFTs), enabling faster response times and better image quality. As the market for high - resolution, large - screen displays continues to grow, the demand for ALD equipment in display manufacturing will surge.
The energy sector also offers significant opportunities for the ALD equipment market. In the production of solar cells, ALD can deposit anti - reflective coatings and passivation layers, increasing the efficiency of sunlight absorption and reducing carrier recombination. This leads to higher power conversion efficiencies and lower production costs for solar panels. Additionally, in the development of advanced batteries, ALD is used to coat electrode materials, improving their electrochemical performance, stability, and cycle life. As the world transitions towards renewable energy sources and the demand for energy storage solutions rises, the application of ALD equipment in the energy industry will expand rapidly.
In the field of nanotechnology and research, ALD equipment is a key tool for fabricating nanostructured materials with precise control over their composition and structure. Scientists use ALD to create novel materials for various applications, such as catalysis, sensors, and drug delivery systems. By enabling the deposition of thin films layer - by - layer, ALD allows researchers to tailor the properties of materials at the nanoscale, opening up new possibilities for scientific discovery and technological innovation.
Furthermore, in the microelectromechanical systems (MEMS) industry, ALD is used to deposit protective and functional thin films on MEMS devices. This improves their reliability, performance, and functionality, making them suitable for applications in automotive sensors, consumer electronics, and medical devices. As the MEMS market continues to grow, driven by the increasing demand for miniaturized and intelligent devices, the adoption of ALD equipment will also increase. Overall, with its wide - ranging applications across multiple high - tech industries and the continuous pursuit of technological advancements, the Atomic Layer Deposition Equipment market is poised for remarkable growth, offering abundant opportunities for innovation and market expansion.
This report studies the global Atomic Layer Deposition Equipment (ALD) production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Atomic Layer Deposition Equipment (ALD) and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Atomic Layer Deposition Equipment (ALD) that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Atomic Layer Deposition Equipment (ALD) total production and demand, 2021-2032, (Units)
Global Atomic Layer Deposition Equipment (ALD) total production value, 2021-2032, (USD Million)
Global Atomic Layer Deposition Equipment (ALD) production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)
Global Atomic Layer Deposition Equipment (ALD) consumption by region & country, CAGR, 2021-2032 & (Units)
U.S. VS China: Atomic Layer Deposition Equipment (ALD) domestic production, consumption, key domestic manufacturers and share
Global Atomic Layer Deposition Equipment (ALD) production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)
Global Atomic Layer Deposition Equipment (ALD) production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)
Global Atomic Layer Deposition Equipment (ALD) production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)
This report profiles key players in the global Atomic Layer Deposition Equipment (ALD) market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASM International, Tokyo Electron, Lam Research, Applied Materials, Eugenus, Veeco, Picosun, Qingdao Sifang SRI Intellectual Technology Co., Leadmicro, Ideal Deposition, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Atomic Layer Deposition Equipment (ALD) market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (K US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.
Global Atomic Layer Deposition Equipment (ALD) Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Atomic Layer Deposition Equipment (ALD) Market, Segmentation by Type:
Thermal ALD
PE-ALD
Spatial ALD
Others
Global Atomic Layer Deposition Equipment (ALD) Market, Segmentation by Process Flow:
R&D Machine
Mass Production Machine
Global Atomic Layer Deposition Equipment (ALD) Market, Segmentation by Chamber:
Single-chamber ALD
Multi-chamber ALD
Global Atomic Layer Deposition Equipment (ALD) Market, Segmentation by Application:
Scientific Research
Power/Compound Semiconductors
Integrated Circuits
Display Industry
Photovoltaics
Others
Companies Profiled:
ASM International
Tokyo Electron
Lam Research
Applied Materials
Eugenus
Veeco
Picosun
Qingdao Sifang SRI Intellectual Technology Co.
Leadmicro
Ideal Deposition
NAURA
Oxford Instruments
Songyu Technology
Forge Nano
Solaytec
NCD
CN1
Wonik IPS
Jusung
Samco
ULVAC
Arradiance
SENTECH Instruments
SVT Associates
Piotech
ANAME
Superald, LLC
Nexusbe
Swiss Cluster
MNT Technology
Shenyang Piotech
Shenzhen Nashe Intelligent Equipment Co., Ltd.
Key Questions Answered:
1. How big is the global Atomic Layer Deposition Equipment (ALD) market?
2. What is the demand of the global Atomic Layer Deposition Equipment (ALD) market?
3. What is the year over year growth of the global Atomic Layer Deposition Equipment (ALD) market?
4. What is the production and production value of the global Atomic Layer Deposition Equipment (ALD) market?
5. Who are the key producers in the global Atomic Layer Deposition Equipment (ALD) market?
6. What are the growth factors driving the market demand?
Table of Contents
204 Pages
- 1 Supply Summary
- 2 Demand Summary
- 3 World Manufacturers Competitive Analysis
- 4 United States VS China VS Rest of the World
- 5 Market Analysis by Type
- 6 Market Analysis by Application
- 7 Company Profiles
- 8 Industry Chain Analysis
- 9 Research Findings and Conclusion
- 10 Appendix
Pricing
Currency Rates
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