Global ACF Bonders Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global ACF Bonders market size was valued at US$ 410 million in 2024 and is forecast to a readjusted size of USD 659 million by 2031 with a CAGR of 6.8% during review period.
An Anisotropic Conductive Film (ACF) Bonder is a specialized machine used to bond electronic components, such as flexible circuits (FPC), chips, and display panels, using anisotropic conductive film (ACF) as an adhesive and conductive interconnect. ACF Bonders apply heat, pressure, and time to create strong, electrically conductive, and mechanically secure connections.
The increasing miniaturization of electronics is driving the demand for precise and high-performance bonding.
ACF bonders are essential for the bonding of flex circuits to substrates, especially in touchscreens and display panels. This is particularly true in smartphones, tablets, and wearables where compactness and flexibility are critical.
As OLED and MicroLED displays gain popularity, especially in high-end consumer electronics, there is a growing need for flexible, fine-pitch interconnects.
ACF bonders play a crucial role in COF (Chip-on-Film) and FOG (Flex-on-Glass) bonding processes. As manufacturers aim to improve display resolution and flexibility, ACF bonders are vital to achieving high-density bonding in thin, flexible displays.
Modern vehicles incorporate advanced display panels, infotainment systems, and driver-assistance systems (ADAS), all of which require flexible and robust electronic bonding.
The automotive industry's need for reliable, high-performance connections is driving the demand for ACF bonders, particularly for bonding flexible circuits to display panels and sensors that must endure harsh conditions (vibrations, temperature extremes).
This report is a detailed and comprehensive analysis for global ACF Bonders market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global ACF Bonders market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global ACF Bonders market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global ACF Bonders market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global ACF Bonders market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for ACF Bonders
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global ACF Bonders market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Ohashi Engineering, Amada Weld Tech, Ito-Group, Shenzhen Olian Automatic, Advanced Integrated Technologies, Bondtronics Technology, C-Tech Systems, Finetech, Shenzhen Xinsanli Automation Equipment, Easy Field Corporation, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
ACF Bonders market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Semi-Automatic
Fully Automatic
Market segment by Application
LCD
OLED
Other
Major players covered
Ohashi Engineering
Amada Weld Tech
Ito-Group
Shenzhen Olian Automatic
Advanced Integrated Technologies
Bondtronics Technology
C-Tech Systems
Finetech
Shenzhen Xinsanli Automation Equipment
Easy Field Corporation
Ings Shinano
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe ACF Bonders product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of ACF Bonders, with price, sales quantity, revenue, and global market share of ACF Bonders from 2020 to 2025.
Chapter 3, the ACF Bonders competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the ACF Bonders breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and ACF Bonders market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of ACF Bonders.
Chapter 14 and 15, to describe ACF Bonders sales channel, distributors, customers, research findings and conclusion.
An Anisotropic Conductive Film (ACF) Bonder is a specialized machine used to bond electronic components, such as flexible circuits (FPC), chips, and display panels, using anisotropic conductive film (ACF) as an adhesive and conductive interconnect. ACF Bonders apply heat, pressure, and time to create strong, electrically conductive, and mechanically secure connections.
The increasing miniaturization of electronics is driving the demand for precise and high-performance bonding.
ACF bonders are essential for the bonding of flex circuits to substrates, especially in touchscreens and display panels. This is particularly true in smartphones, tablets, and wearables where compactness and flexibility are critical.
As OLED and MicroLED displays gain popularity, especially in high-end consumer electronics, there is a growing need for flexible, fine-pitch interconnects.
ACF bonders play a crucial role in COF (Chip-on-Film) and FOG (Flex-on-Glass) bonding processes. As manufacturers aim to improve display resolution and flexibility, ACF bonders are vital to achieving high-density bonding in thin, flexible displays.
Modern vehicles incorporate advanced display panels, infotainment systems, and driver-assistance systems (ADAS), all of which require flexible and robust electronic bonding.
The automotive industry's need for reliable, high-performance connections is driving the demand for ACF bonders, particularly for bonding flexible circuits to display panels and sensors that must endure harsh conditions (vibrations, temperature extremes).
This report is a detailed and comprehensive analysis for global ACF Bonders market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global ACF Bonders market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global ACF Bonders market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global ACF Bonders market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global ACF Bonders market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for ACF Bonders
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global ACF Bonders market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Ohashi Engineering, Amada Weld Tech, Ito-Group, Shenzhen Olian Automatic, Advanced Integrated Technologies, Bondtronics Technology, C-Tech Systems, Finetech, Shenzhen Xinsanli Automation Equipment, Easy Field Corporation, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
ACF Bonders market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Semi-Automatic
Fully Automatic
Market segment by Application
LCD
OLED
Other
Major players covered
Ohashi Engineering
Amada Weld Tech
Ito-Group
Shenzhen Olian Automatic
Advanced Integrated Technologies
Bondtronics Technology
C-Tech Systems
Finetech
Shenzhen Xinsanli Automation Equipment
Easy Field Corporation
Ings Shinano
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe ACF Bonders product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of ACF Bonders, with price, sales quantity, revenue, and global market share of ACF Bonders from 2020 to 2025.
Chapter 3, the ACF Bonders competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the ACF Bonders breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and ACF Bonders market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of ACF Bonders.
Chapter 14 and 15, to describe ACF Bonders sales channel, distributors, customers, research findings and conclusion.
Table of Contents
106 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: ACF Bonders by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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