Semiconductor Metrology Equipment

Global Semiconductor Metrology Equipment Market to Reach US$13.1 Billion by 2030

The global market for Semiconductor Metrology Equipment estimated at US$7.9 Billion in the year 2024, is expected to reach US$13.1 Billion by 2030, growing at a CAGR of 8.9% over the analysis period 2024-2030. OCD Metrology Equipment, one of the segments analyzed in the report, is expected to record a 10.6% CAGR and reach US$5.8 Billion by the end of the analysis period. Growth in the Film Metrology Equipment segment is estimated at 6.0% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.1 Billion While China is Forecast to Grow at 8.6% CAGR

The Semiconductor Metrology Equipment market in the U.S. is estimated at US$2.1 Billion in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$2.1 Billion by the year 2030 trailing a CAGR of 8.6% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 8.4% and 7.4% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 7.0% CAGR.

Global "Semiconductor Metrology Equipment" Market – Key Trends & Drivers Summarized

Why Is Metrology Now a Cornerstone of Semiconductor Process Control?
Metrology equipment has become one of the most critical enablers in semiconductor manufacturing, underpinning quality control, process stability, and yield optimization in every node transition. As devices scale down to 5nm, 3nm, and beyond, the need for ultra-precise, real-time measurement of critical dimensions (CD), film thickness, line edge roughness, overlay accuracy, and material composition has grown exponentially. Metrology is no longer a post-process checkpoint; it is now deeply integrated throughout the fabrication workflow—from lithography and etching to deposition and packaging. With the emergence of 3D architectures like FinFETs and gate-all-around (GAA) transistors, non-destructive, high-resolution inspection techniques have become essential. Advanced metrology tools, including scatterometry, ellipsometry, critical dimension SEM (CD-SEM), atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS), are being deployed to ensure tight process control. Inline and real-time monitoring capabilities are in high demand, particularly for high-volume fabs that require faster time-to-yield. Beyond front-end-of-line (FEOL) applications, metrology is playing a pivotal role in backend processes like TSV (through-silicon via) formation and chiplet integration. As fabrication tolerances reach atomic scales, the importance of highly accurate, high-throughput metrology systems has never been greater.

What Technological Innovations Are Reshaping the Metrology Ecosystem?
The semiconductor metrology equipment market is undergoing a major transformation driven by the convergence of optics, AI, and automation. New generations of metrology systems feature multi-modal platforms capable of capturing surface, subsurface, and material data in a single pass. Hybrid metrology—combining techniques such as AFM with optical scatterometry—is enabling deeper analysis of 3D structures while reducing measurement uncertainty. AI and machine learning algorithms are being used to predict defects, calibrate tools, and automate anomaly detection, allowing fabs to optimize processes in real time. Integrated metrology, wherein tools are embedded directly in process chambers or adjacent modules, is gaining traction for advanced process control (APC). Equipment makers are also developing fully automated metrology solutions that require minimal operator intervention and can operate continuously in cleanroom environments. Innovations in sensor technology and interferometry are improving depth profiling and reducing drift, enhancing reliability for both R&D and high-volume manufacturing. Meanwhile, next-gen nodes are pushing demand for atomic-level metrology tools that can monitor film uniformity, defectivity, and electrical properties at sub-nanometer resolutions. These cutting-edge capabilities are crucial for validating EUV lithography, new materials (e.g., high-k dielectrics), and complex stack configurations.

How Are End-Use Shifts and Global Investment Strategies Driving Demand?
The demand for metrology equipment is rising in tandem with global investment in semiconductor fabrication capacity. With national initiatives like the CHIPS Act in the U.S., China’s “Made in China 2025” program, and the EU Chips Act, tens of billions are being poured into fab expansion, all of which necessitate robust metrology ecosystems. Foundries, IDMs, and OSATs (outsourced semiconductor assembly and test providers) are increasing investments in metrology to manage multi-patterning, smaller pitch features, and new materials in logic, memory, and analog devices. Demand is also surging in advanced packaging segments, where wafer-level and panel-level metrology systems are used to control bumps, vias, and redistribution layers (RDL). Automotive and aerospace semiconductor sectors—where reliability and defect control are mission-critical—are mandating higher inspection standards, fueling adoption of metrology tools with traceable and auditable measurement records. Additionally, the shift toward heterogeneous integration and chiplet architectures requires precise alignment and bonding accuracy, expanding the role of metrology beyond traditional wafer-scale inspection. Regional semiconductor hubs in Taiwan, South Korea, Japan, and the U.S. are also prioritizing domestic tool supply chains, opening opportunities for both established players and regional metrology equipment manufacturers. These macro trends are solidifying metrology’s position at the core of strategic semiconductor planning.

The Growth In The Semiconductor Metrology Equipment Market Is Driven By Several Factors...
The growth in the semiconductor metrology equipment market is driven by several factors including continued node miniaturization, expansion of 3D and heterogeneous device architectures, increased fab capacity investment, and demand for inline, high-resolution process monitoring. Technological advancements such as hybrid metrology, atomic-scale resolution, and AI-assisted analytics are enabling fabs to manage unprecedented complexity in device manufacturing. End-use diversification is also driving market growth—AI chips, high-bandwidth memory (HBM), RF devices, and automotive semiconductors each require customized metrology regimes. The rise of advanced packaging techniques like 2.5D and 3D ICs necessitates high-accuracy overlay and bump height measurement tools, while EUV lithography adoption is creating demand for in-situ overlay and defect metrology. Growing regulatory oversight and quality assurance mandates in sectors like medical electronics and aerospace are further propelling equipment deployment. Meanwhile, fabless semiconductor companies are placing pressure on foundries to meet tighter tolerances, indirectly increasing metrology investments. The push toward smart manufacturing, real-time defect prevention, and digital twin modeling is integrating metrology deeper into the semiconductor value chain. These interconnected factors are catalyzing rapid and sustained expansion of the global semiconductor metrology equipment market.

SCOPE OF STUDY:

The report analyzes the Semiconductor Metrology Equipment market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Type (OCD Metrology Equipment, Film Metrology Equipment, Overlay & CD Metrology Equipment, E-beam Metrology Equipment, Other Metrology Equipment Types); Application (Power Devices Application, MEMS Application, Memory Devices Application, Logic Devices Application, LEDs Application, Other Applications); End-Use (Foundry End-Use, OEM End-Use, IDM End-Use, OSAT End-Use)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 44 Featured) -

• Applied Materials Inc.
• ASML Holding N.V.
• Camtek Ltd.
• Carl Zeiss SMT GmbH
• FormFactor, Inc.
• Hitachi High-Tech Corporation
• JEOL Ltd.
• KLA Corporation
• Lam Research Corporation
• Lasertec Corporation
• Nearfield Instruments
• Nikon Metrology NV
• Nova Measuring Instruments Ltd.
• Onto Innovation Inc.
• Plasma-Therm LLC
• SCREEN Semiconductor Solutions Co.
• SEMES Co., Ltd.
• Thermo Fisher Scientific Inc.
• Tokyo Electron Limited
• TSI Incorporated

AI INTEGRATIONS
We`re transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR
Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

Please note: Reports are sold as single-site single-user licenses. Electronic versions require 24-48 hours as each copy is customized to the client with digital controls and custom watermarks. The Publisher uses digital controls protecting against copying and printing is restricted to one full copy to be used at the same location.

The latest version of Adobe Acrobat Reader is required to view the report. Upon ordering an electronic version, the Publisher will provide a link to download the purchased report.

Prior to fulfillment of an order, the client will be required to sign a document detailing the purchase terms for a publication from this publisher.