Semiconductor Dry Strip Equipment

Global Semiconductor Dry Strip Equipment Market to Reach US$438.9 Million by 2030

The global market for Semiconductor Dry Strip Equipment estimated at US$349.9 Million in the year 2024, is expected to reach US$438.9 Million by 2030, growing at a CAGR of 3.9% over the analysis period 2024-2030. Element Semiconductor, one of the segments analyzed in the report, is expected to record a 3.1% CAGR and reach US$257.5 Million by the end of the analysis period. Growth in the Compound Semiconductor segment is estimated at 5.0% CAGR over the analysis period.

The U.S. Market is Estimated at US$95.3 Million While China is Forecast to Grow at 7.0% CAGR

The Semiconductor Dry Strip Equipment market in the U.S. is estimated at US$95.3 Million in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$88.0 Million by the year 2030 trailing a CAGR of 7.0% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 1.6% and 2.9% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 2.2% CAGR.

Global "Semiconductor Dry Strip Equipment" Market – Key Trends & Drivers Summarized

Why Is Dry Strip Technology Essential in Modern Fab Processing?
Dry strip equipment has become a critical component of semiconductor fabrication, providing essential post-lithography cleaning by removing photoresist and polymer residues from wafers. Unlike wet stripping, dry strip systems use plasma or downstream gas-phase reactions to gently eliminate residues without damaging delicate features. As device geometries shrink and wafer complexity increases, dry strip offers superior control over surface integrity, minimizing pattern distortion and contamination. In FinFET, GAAFET, and 3D NAND processes, traditional wet chemistries often fall short due to high aspect ratios and sensitivity to moisture or chemicals. Dry strip methods provide uniformity across large wafers and are more environmentally sustainable. With the growing push for precision and yield in each fab cycle, dry strip equipment plays a crucial role in maintaining cleanliness between steps without inducing wafer stress or material degradation.

Are Equipment Innovations Driving the Shift to Ultra-Low Damage Strip Methods?
As process nodes dive below 5nm, dry strip tools are evolving to meet stringent demands for ultra-low plasma damage, residue-free results, and compatibility with a wider range of advanced materials. Next-generation equipment now offers downstream plasma sources, controlled ion energy systems, and multi-step process chambers that support advanced resist materials like EUV resists and hardmask films. To minimize plasma-induced charging and etch bias, manufacturers are embedding AI-controlled recipe tuning, in situ endpoint detection, and chamber pressure modulation. Remote plasma configurations are also gaining popularity for their ability to strip without ion bombardment, preserving device structures. Furthermore, modern systems are designed for high-throughput processing while maintaining thermal and chemical uniformity—an essential factor for high-volume fabs. Dry strip is transitioning from a niche step to a performance-critical operation in advanced logic and memory production lines.

How Are Sustainability and Yield Optimization Shaping Equipment Design?
In today’s environmentally conscious semiconductor landscape, sustainability and operational efficiency are driving significant changes in dry strip equipment. Newer systems prioritize lower power consumption, reduced use of perfluorinated gases, and minimized process gas waste. Additionally, inline process diagnostics and real-time analytics reduce rework rates and improve wafer yield per lot. Advanced cooling techniques and process chamber materials extend tool life and lower downtime. Equipment OEMs are also offering modular upgrades and retrofittable plasma sources to extend the life cycle of installed base units, allowing fabs to remain competitive without full system overhauls. This combination of eco-efficiency and yield enhancement is making dry strip equipment a strategic investment, particularly for fabs focused on reducing operational costs while advancing to smaller process geometries.

What’s Accelerating Global Demand for Dry Strip Equipment in Fabs?
The growth in the global semiconductor dry strip equipment market is driven by several factors including increasing device complexity, EUV lithography adoption, and demand for yield optimization. The rise of high-aspect-ratio 3D structures in logic and NAND chips requires damage-free stripping solutions to maintain structural fidelity. EUV lithography, now entering high-volume production, necessitates advanced strip techniques for novel resist chemistries. Furthermore, fabs are under pressure to improve wafer yield and reduce defect rates, prompting a move to plasma-based strip methods with precise process control. Sustainability goals are pushing adoption of equipment with lower gas emissions and power usage. As new fabs are constructed globally under public-private semiconductor expansion initiatives, the demand for cleanroom-compatible, high-throughput dry strip tools is surging. Vendors offering customizable chambers, AI integration, and reduced cost-per-wafer solutions are leading the charge.

SCOPE OF STUDY:

The report analyzes the Semiconductor Dry Strip Equipment market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Type (Element Semiconductor, Compound Semiconductor); Application (Consumer Electronics, Automotive, Industrial, Other Applications)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 36 Featured) -

• ACM Research, Inc.
• Advanced Micro-Fabrication Equipment Inc. (AMEC)
• Applied Materials, Inc.
• Axcelis Technologies, Inc.
• Beijing E-Town Semiconductor Technology Co., Ltd.
• C&D Semiconductor Services Inc.
• Grand Process Technology Co., Ltd.
• Hitachi High-Tech Corporation
• Kokusai Electric Corporation
• Lam Research Corporation
• Mattson Technology, Inc.
• MKS Instruments, Inc.
• NAURA Technology Group Co., Ltd.
• Novellus Systems, Inc.
• Panasonic Corporation
• Plasma-Therm LLC
• PSK Inc.
• Samco Inc.
• SCREEN Holdings Co., Ltd.
• Tokyo Electron Limited
• ULVAC Inc.

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