Electronic Board Level Underfill and Encapsulation

Global Electronic Board Level Underfill and Encapsulation Market to Reach US$404.3 Million by 2030

The global market for Electronic Board Level Underfill and Encapsulation estimated at US$333.0 Million in the year 2024, is expected to reach US$404.3 Million by 2030, growing at a CAGR of 3.3% over the analysis period 2024-2030. Underfills Type, one of the segments analyzed in the report, is expected to record a 2.7% CAGR and reach US$258.1 Million by the end of the analysis period. Growth in the Gob Top Encapsulations Type segment is estimated at 4.5% CAGR over the analysis period.

The U.S. Market is Estimated at US$90.7 Million While China is Forecast to Grow at 6.0% CAGR

The Electronic Board Level Underfill and Encapsulation market in the U.S. is estimated at US$90.7 Million in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$79.5 Million by the year 2030 trailing a CAGR of 6.0% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 1.3% and 2.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 1.9% CAGR.

Global Electronic Board Level Underfill and Encapsulation Market – Key Trends & Drivers Summarized

Why Are Underfill and Encapsulation Solutions Crucial in PCB and Microelectronics Assembly?

Electronic board-level underfill and encapsulation materials are critical to ensuring the mechanical integrity, thermal stability, and long-term reliability of semiconductor packages and printed circuit boards (PCBs). As electronic devices become more compact and powerful, the stresses exerted on solder joints, interconnects, and die surfaces intensify, particularly in ball grid arrays (BGAs), chip-scale packages (CSPs), and flip-chip configurations.

Underfill materials are typically epoxy-based formulations applied between the chip and substrate to reinforce solder joints, mitigate coefficient of thermal expansion (CTE) mismatch, and absorb mechanical shock. Encapsulation compounds—used for overmolding or potting—offer protection from moisture, chemicals, and particulate contamination. These materials extend the operational life of electronics exposed to automotive, aerospace, industrial, or consumer-grade environments.

In devices subject to thermal cycling, vibration, or drop impact—such as smartphones, automotive ECUs, and wearable electronics—underfill and encapsulants serve as a physical buffer and a thermal path. In advanced packaging architectures like 2.5D/3D ICs and system-in-package (SiP), underfill solutions help manage internal stress loads across multiple dies and interposer layers, making them indispensable in semiconductor packaging.

What Material Innovations and Application Techniques Are Reshaping the Segment?

Material innovations in underfill and encapsulation are focused on improving thermal conductivity, lowering curing temperatures, enhancing flow characteristics, and enabling faster dispense cycles. Conventional capillary underfill systems have evolved into no-flow underfills, pre-applied underfills (PAUF), and reworkable variants to suit diverse process flows and assembly line constraints.

Thermally conductive underfills with filler materials like alumina, boron nitride, and silver flakes are increasingly used in high-power devices and RF modules. These formulations combine low viscosity with high heat dissipation, allowing for rapid curing and minimal void formation. UV-curable and snap-cure systems are being adopted for high-throughput manufacturing environments where cycle time is a key performance metric.

Encapsulation materials are transitioning toward hybrid resin systems combining epoxy, silicone, and polyurethane characteristics for better flexibility and adhesion on challenging substrates. For MEMS devices and optical sensors, low-stress, optically clear encapsulants with low outgassing profiles are becoming mainstream. Jet-dispensing and stencil printing techniques are now common for volume production in mobile and consumer electronics.

Which End-Use Segments and Packaging Trends Are Driving Demand?

The semiconductor industry remains the largest consumer of underfill and encapsulation solutions. Foundries and OSATs (Outsourced Semiconductor Assembly and Test providers) use these materials in flip-chip packaging, wafer-level CSPs, and emerging 3D-stacked architectures. Leading players like TSMC, ASE, and Amkor are specifying custom underfills for AI chips, RF front-end modules, and logic-memory integration.

Consumer electronics is the second-largest end-use segment, encompassing smartphones, wearables, tablets, and gaming devices. As devices become thinner and more densely packed, thermal and mechanical reliability become central to user experience and warranty cycles. Advanced encapsulants are used to safeguard against water ingress and thermal degradation—especially in IP-rated devices.

Automotive electronics is a rapidly growing segment, driven by the increasing number of ECUs, sensors, and power modules. Underfill materials are essential for ensuring vibration resistance and thermal cycling endurance in harsh automotive environments. Key applications include ADAS processors, infotainment systems, and battery control units in EVs. Industrial automation, medical electronics, and aerospace applications further diversify demand.

What Factors Are Accelerating Growth in the Underfill and Encapsulation Market?

The growth in the electronic board level underfill and encapsulation market is driven by several factors including miniaturization of electronics, increasing power density in semiconductors, reliability requirements in harsh environments, and the rise of heterogeneous integration in packaging technologies.

First, the push toward smaller, lighter, and multifunctional electronic devices necessitates more robust protective materials. As solder joint pitch narrows and component stacking increases, mechanical reinforcement via underfill becomes critical to avoid premature failures, especially during drop tests and thermal cycles.

Second, power semiconductors and RF components used in 5G, automotive, and high-performance computing generate substantial heat. Underfill and encapsulants with enhanced thermal conductivity help dissipate this heat efficiently, preventing hot-spot failures and ensuring long-term reliability—especially in confined PCB layouts.

Third, the automotive and aerospace sectors are increasing reliability thresholds. Devices in these environments must endure wide temperature swings, vibrations, and exposure to corrosive agents. High-temperature stable, chemically inert encapsulants and reworkable underfills are being demanded to meet industry-specific standards such as AEC-Q100 and MIL-STD-883.

Lastly, the emergence of fan-out wafer-level packaging (FOWLP), system-in-package (SiP), and chiplet architectures is pushing material engineers to develop highly customizable, low-CTE, and void-free underfills. These architectures, which blend logic, memory, and analog blocks on a single module, rely heavily on precision material deposition to ensure signal fidelity and physical integrity.

SCOPE OF STUDY:

The report analyzes the Electronic Board Level Underfill and Encapsulation market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Product Type (Underfills Type, Gob Top Encapsulations Type); Material (Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material, Other Materials); Board Type (Chip Scale Package Board, Ball Grid array Board, Flip Chips Board)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 41 Featured) -
  • Ablestik Laboratories
  • AI Technology Inc.
  • Advanced Technology & Materials Co., Ltd.
  • Dow Inc.
  • Dupont Electronics & Imaging
  • Henkel AG & Co. KGaA
  • Hitachi Chemical Co., Ltd.
  • JSR Corporation
  • Kyocera Corporation
  • LORD Corporation
  • Nagase ChemteX Corporation
  • Namics Corporation
  • NuSil Technology LLC
  • Panacol-Elosol GmbH
  • Sika AG
  • Shin-Etsu Chemical Co., Ltd.
  • Sumitomo Bakelite Company, Limited
  • Techsil Ltd
  • Trelleborg AB
  • UMC Electronics Co., Ltd.
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I. METHODOLOGY
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
Influencer Market Insights
World Market Trajectories
Tariff Impact on Global Supply Chain Patterns
Electronic Board Level Underfill and Encapsulation – Global Key Competitors Percentage Market Share in 2025 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
Rise in High-Density Chip Packaging Drives Demand for Underfill and Encapsulation Materials
Growth in Mobile and Wearable Electronics Throws Spotlight on Board-Level Mechanical Protection
Increased Use of Flip-Chip and BGA Components Strengthens Business Case for Capillary Underfill
Expansion of 5G and High-Frequency Applications Spurs Innovation in Low-Dielectric Encapsulants
OEM Focus on Product Miniaturization Encourages Development of Thin and Conformal Coatings
Increased Use of High-Performance Processors in Consumer Electronics Drives Thermal Cycling Protection
Integration With SMT and Wafer-Level Packaging Technologies Expands Adoption in Advanced PCBs
Use in Harsh Environment Applications Spurs Demand for Moisture and Chemical Resistant Formulations
Growing EV and Power Electronics Segments Fuel Demand for High-Voltage Underfill Materials
Development of Reworkable and UV-Curable Underfill Systems Supports Cost-Effective Manufacturing
Increased Importance of Reliability in Medical and Aerospace Electronics Boosts Encapsulation Standards
Emergence of AI and Edge Computing Devices Strengthens Need for Stress-Absorbing Materials
OEM and OSAT Partnerships Accelerate Commercialization of Custom Underfill Chemistries
Surge in Chiplet and 3D IC Architectures Expands Scope of Multi-Component Encapsulation
Stringent Thermal Shock and Drop Test Requirements Propel Focus on Mechanical Shock Absorption
Regulatory Push for Lead-Free and Halogen-Free Materials Encourages Eco-Friendly Encapsulant Development
Expansion of Smart Cards and RFID Devices Fuels Use in Secure Microelectronic Modules
Material Innovation in Epoxy Resins and Silicones Enhances Long-Term Reliability
Shift Toward Automation in Assembly Processes Drives Demand for Dispense-Friendly Formulations
Increasing PCB Complexity in Automotive Electronics Promotes Advanced Encapsulation Strategies
4. GLOBAL MARKET PERSPECTIVE
TABLE 1: World Electronic Board Level Underfill and Encapsulation Market Analysis of Annual Sales in US$ Thousand for Years 2014 through 2030
TABLE 2: World Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 3: World Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 4: World 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2014, 2025 & 2030
TABLE 5: World Recent Past, Current & Future Analysis for Underfills Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 6: World Historic Review for Underfills Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 7: World 16-Year Perspective for Underfills Type by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
TABLE 8: World Recent Past, Current & Future Analysis for Gob Top Encapsulations Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 9: World Historic Review for Gob Top Encapsulations Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 10: World 16-Year Perspective for Gob Top Encapsulations Type by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
TABLE 11: World Recent Past, Current & Future Analysis for Ball Grid array Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 12: World Historic Review for Ball Grid array Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 13: World 16-Year Perspective for Ball Grid array Board by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
TABLE 14: World Recent Past, Current & Future Analysis for Flip Chips Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 15: World Historic Review for Flip Chips Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 16: World 16-Year Perspective for Flip Chips Board by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
TABLE 17: World Recent Past, Current & Future Analysis for Chip Scale Package Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 18: World Historic Review for Chip Scale Package Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 19: World 16-Year Perspective for Chip Scale Package Board by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
TABLE 20: World Recent Past, Current & Future Analysis for Quartz / Silicone Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 21: World Historic Review for Quartz / Silicone Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 22: World 16-Year Perspective for Quartz / Silicone Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
TABLE 23: World Recent Past, Current & Future Analysis for Alumina Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 24: World Historic Review for Alumina Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 25: World 16-Year Perspective for Alumina Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
TABLE 26: World Recent Past, Current & Future Analysis for Epoxy Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 27: World Historic Review for Epoxy Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 28: World 16-Year Perspective for Epoxy Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
TABLE 29: World Recent Past, Current & Future Analysis for Urethane Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 30: World Historic Review for Urethane Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 31: World 16-Year Perspective for Urethane Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
TABLE 32: World Recent Past, Current & Future Analysis for Acrylic Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 33: World Historic Review for Acrylic Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 34: World 16-Year Perspective for Acrylic Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
TABLE 35: World Recent Past, Current & Future Analysis for Other Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 36: World Historic Review for Other Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 37: World 16-Year Perspective for Other Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
III. MARKET ANALYSIS
UNITED STATES
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
TABLE 38: USA Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 39: USA Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 40: USA 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 41: USA Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 42: USA Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 43: USA 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 44: USA Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 45: USA Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 46: USA 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
CANADA
TABLE 47: Canada Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 48: Canada Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 49: Canada 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 50: Canada Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 51: Canada Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 52: Canada 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 53: Canada Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 54: Canada Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 55: Canada 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
JAPAN
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
TABLE 56: Japan Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 57: Japan Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 58: Japan 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 59: Japan Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 60: Japan Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 61: Japan 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 62: Japan Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 63: Japan Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 64: Japan 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
CHINA
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
TABLE 65: China Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 66: China Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 67: China 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 68: China Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 69: China Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 70: China 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 71: China Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 72: China Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 73: China 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
EUROPE
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
TABLE 74: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 75: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 76: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2014, 2025 & 2030
TABLE 77: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 78: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 79: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 80: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 81: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 82: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 83: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 84: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 85: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
FRANCE
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
TABLE 86: France Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 87: France Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 88: France 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 89: France Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 90: France Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 91: France 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 92: France Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 93: France Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 94: France 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
GERMANY
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
TABLE 95: Germany Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 96: Germany Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 97: Germany 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 98: Germany Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 99: Germany Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 100: Germany 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 101: Germany Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 102: Germany Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 103: Germany 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
ITALY
TABLE 104: Italy Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 105: Italy Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 106: Italy 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 107: Italy Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 108: Italy Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 109: Italy 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 110: Italy Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 111: Italy Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 112: Italy 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
UNITED KINGDOM
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
TABLE 113: UK Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 114: UK Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 115: UK 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 116: UK Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 117: UK Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 118: UK 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 119: UK Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 120: UK Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 121: UK 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
SPAIN
TABLE 122: Spain Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 123: Spain Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 124: Spain 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 125: Spain Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 126: Spain Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 127: Spain 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 128: Spain Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 129: Spain Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 130: Spain 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
RUSSIA
TABLE 131: Russia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 132: Russia Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 133: Russia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 134: Russia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 135: Russia Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 136: Russia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 137: Russia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 138: Russia Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 139: Russia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
REST OF EUROPE
TABLE 140: Rest of Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 141: Rest of Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 142: Rest of Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 143: Rest of Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 144: Rest of Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 145: Rest of Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 146: Rest of Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 147: Rest of Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 148: Rest of Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
ASIA-PACIFIC
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
TABLE 149: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 150: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 151: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2014, 2025 & 2030
TABLE 152: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 153: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 154: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 155: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 156: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 157: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 158: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 159: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 160: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
AUSTRALIA
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
TABLE 161: Australia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 162: Australia Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 163: Australia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 164: Australia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 165: Australia Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 166: Australia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 167: Australia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 168: Australia Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 169: Australia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
INDIA
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
TABLE 170: India Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 171: India Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 172: India 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 173: India Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 174: India Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 175: India 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 176: India Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 177: India Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 178: India 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
SOUTH KOREA
TABLE 179: South Korea Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 180: South Korea Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 181: South Korea 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 182: South Korea Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 183: South Korea Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 184: South Korea 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 185: South Korea Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 186: South Korea Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 187: South Korea 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
REST OF ASIA-PACIFIC
TABLE 188: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 189: Rest of Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 190: Rest of Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 191: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 192: Rest of Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 193: Rest of Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 194: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 195: Rest of Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 196: Rest of Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
LATIN AMERICA
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
TABLE 197: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 198: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 199: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2014, 2025 & 2030
TABLE 200: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 201: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 202: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 203: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 204: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 205: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 206: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 207: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 208: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
ARGENTINA
TABLE 209: Argentina Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 210: Argentina Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 211: Argentina 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 212: Argentina Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 213: Argentina Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 214: Argentina 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 215: Argentina Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 216: Argentina Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 217: Argentina 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
BRAZIL
TABLE 218: Brazil Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 219: Brazil Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 220: Brazil 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 221: Brazil Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 222: Brazil Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 223: Brazil 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 224: Brazil Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 225: Brazil Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 226: Brazil 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
MEXICO
TABLE 227: Mexico Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 228: Mexico Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 229: Mexico 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 230: Mexico Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 231: Mexico Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 232: Mexico 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 233: Mexico Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 234: Mexico Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 235: Mexico 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
REST OF LATIN AMERICA
TABLE 236: Rest of Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 237: Rest of Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 238: Rest of Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 239: Rest of Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 240: Rest of Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 241: Rest of Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 242: Rest of Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 243: Rest of Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 244: Rest of Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
MIDDLE EAST
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
TABLE 245: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
TABLE 246: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 247: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2014, 2025 & 2030
TABLE 248: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 249: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 250: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 251: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 252: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 253: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 254: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 255: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 256: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
IRAN
TABLE 257: Iran Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 258: Iran Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 259: Iran 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 260: Iran Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 261: Iran Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 262: Iran 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 263: Iran Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 264: Iran Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 265: Iran 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
ISRAEL
TABLE 266: Israel Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 267: Israel Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 268: Israel 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 269: Israel Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 270: Israel Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 271: Israel 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 272: Israel Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 273: Israel Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 274: Israel 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
SAUDI ARABIA
TABLE 275: Saudi Arabia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 276: Saudi Arabia Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 277: Saudi Arabia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 278: Saudi Arabia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 279: Saudi Arabia Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 280: Saudi Arabia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 281: Saudi Arabia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 282: Saudi Arabia Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 283: Saudi Arabia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
UNITED ARAB EMIRATES
TABLE 284: UAE Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 285: UAE Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 286: UAE 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 287: UAE Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 288: UAE Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 289: UAE 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 290: UAE Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 291: UAE Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 292: UAE 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
REST OF MIDDLE EAST
TABLE 293: Rest of Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 294: Rest of Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 295: Rest of Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 296: Rest of Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 297: Rest of Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 298: Rest of Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 299: Rest of Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 300: Rest of Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 301: Rest of Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
AFRICA
Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
TABLE 302: Africa Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 303: Africa Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 304: Africa 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
TABLE 305: Africa Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 306: Africa Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 307: Africa 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
TABLE 308: Africa Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
TABLE 309: Africa Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
TABLE 310: Africa 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
IV. COMPETITION

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