5G Printed Circuit Boards

Global 5G Printed Circuit Boards Market to Reach US$40.5 Billion by 2030

The global market for 5G Printed Circuit Boards estimated at US$17.9 Billion in the year 2024, is expected to reach US$40.5 Billion by 2030, growing at a CAGR of 14.6% over the analysis period 2024-2030. Single-Sided, one of the segments analyzed in the report, is expected to record a 13.4% CAGR and reach US$12.7 Billion by the end of the analysis period. Growth in the Double-Sided segment is estimated at 14.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$4.9 Billion While China is Forecast to Grow at 19.1% CAGR

The 5G Printed Circuit Boards market in the U.S. is estimated at US$4.9 Billion in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$8.6 Billion by the year 2030 trailing a CAGR of 19.1% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 10.8% and 13.0% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 11.5% CAGR.

Global 5G Printed Circuit Boards Market – Key Trends & Drivers Summarized

 Why Are 5G PCBs Becoming Critical Components in High-Frequency, High-Density Electronics Infrastructure?

Printed circuit boards (PCBs) designed for 5G applications are fundamental to the performance and reliability of next-generation wireless systems. These advanced PCBs support the high-frequency signal transmission, thermal management, and compact integration needed for 5G base stations, user equipment, network hardware, and IoT devices. As 5G rollouts scale globally, PCBs must meet increasingly stringent electrical, mechanical, and environmental performance requirements.

Compared to conventional PCBs, 5G variants demand high-speed laminates, low-loss materials, and precise signal integrity for frequencies ranging from sub-6 GHz to mmWave bands. They must also handle dense interconnects and multi-layer stack-ups while ensuring minimal signal degradation. As a result, PCB manufacturers are reengineering board architecture and material systems to support the demands of ultra-reliable, low-latency communication.

How Are Material Innovation and Fabrication Techniques Advancing 5G PCB Performance?

The performance of 5G PCBs hinges on dielectric materials with low loss tangents, high thermal stability, and consistent impedance control. High-frequency laminates such as PTFE, LCP, and ceramic-filled composites are being adopted to reduce transmission losses and enable signal clarity in mmWave applications. Multilayer HDI (High-Density Interconnect) technologies, advanced via structures (microvias, stacked vias), and hybrid PCB designs are enabling high routing density and thermal management in compact footprints.

On the manufacturing side, precision etching, laser drilling, and advanced plating techniques are improving dimensional accuracy and reducing signal distortion. Embedded components, conformal shielding, and integrated thermal vias are being incorporated to meet EMI/EMC standards and manage heat in densely packed 5G hardware. These advancements are making PCBs more capable of supporting the electrical demands of 5G transceivers, RF modules, and antenna arrays.

 

Which Applications and Markets Are Leading Demand for 5G PCBs?

5G PCBs are being deployed across a wide range of applications including macro and small cell base stations, network interface devices, mobile handsets, RF front ends, CPE units, and connected industrial systems. Telecom equipment manufacturers are the primary consumers, closely followed by OEMs in smartphones, wearables, autonomous vehicles, and smart factory automation platforms.

Asia-Pacific, home to leading PCB fabricators and 5G infrastructure vendors, remains the dominant production and consumption region. China, South Korea, Taiwan, and Japan are major hubs for high-frequency PCB manufacturing and are ramping capacity to meet domestic and export demand. North America and Europe follow, with emphasis on high-end PCBs for defense, aerospace, and telecom applications. Emerging economies in Southeast Asia, India, and the Middle East are gradually increasing 5G infrastructure investment, driving new opportunities for PCB suppliers.

How Are Supply Chain Pressures, Standardization, and Technological Convergence Shaping Market Dynamics?

The 5G PCB supply chain is highly materials-dependent, and disruptions in the availability of high-performance substrates, copper foils, and specialty resins can impact lead times and pricing. To mitigate this, manufacturers are diversifying sourcing strategies, investing in domestic fabrication lines, and pursuing vertical integration to control quality and supply continuity.

Standardization efforts through industry bodies such as IPC and IEEE are promoting design consistency and compatibility across OEM platforms, improving efficiency in design-to-production workflows. Meanwhile, the convergence of 5G with AI, IoT, and edge computing is driving demand for PCBs that can support multifunctional, high-density integration. This is encouraging closer collaboration between designers, material scientists, and fabricators to push the boundaries of signal performance and system reliability.

What Are the Factors Driving Growth in the 5G Printed Circuit Boards Market?

The 5G PCB market is expanding rapidly as global connectivity infrastructure shifts toward high-frequency, data-intensive applications. Key growth drivers include rising investments in 5G base stations, expanding deployment of mmWave user devices, and demand for precision RF hardware across sectors. Material innovation, high-speed board architecture, and advanced fabrication methods are enabling PCBs to meet the unique challenges of 5G-era communication systems.

Looking ahead, market success will depend on how effectively PCB suppliers align material science, miniaturization, and cost-efficiency with the evolving demands of telecom, consumer, and industrial device manufacturers. As electronics become increasingly frequency-driven and functionally converged, could 5G PCBs emerge as the strategic core of tomorrow’s connected technology ecosystem?

SCOPE OF STUDY:

The report analyzes the 5G Printed Circuit Boards market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Type (Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect, Other Types); End-Use (Automotive, Telecommunication, Consumer Electronics, Industrial, Other End-Uses)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 42 Featured) -

• Advanced Circuits, Inc.
• Amphenol Printed Circuits
• AT&S Austria Technologie & Systemtechnik AG
• Chin-Poon Industrial Co., Ltd.
• Compeq Manufacturing Co., Ltd.
• Daeduck Electronics Co., Ltd.
• Dynamic Electronics Co., Ltd.
• Ellington Electronics Technology Co., Ltd.
• Flex Ltd.
• Fujikura Ltd.
• HannStar Board Corporation
• Ibiden Co., Ltd.
• Isola Group
• Jabil Inc.
• Kinsus Interconnect Technology Corp.
• Kyocera Corporation
• Lianchuang Electronic Technology Co., Ltd.
• Murata Manufacturing Co., Ltd.
• Nippon Mektron, Ltd.
• Panasonic Industry Co., Ltd.

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