3D TSV and 2.5D

Global 3D TSV and 2.5D Market to Reach US$188.9 Billion by 2030

The global market for 3D TSV and 2.5D estimated at US$44.7 Billion in the year 2024, is expected to reach US$188.9 Billion by 2030, growing at a CAGR of 27.2% over the analysis period 2024-2030. 3D Stacked Memory Packaging, one of the segments analyzed in the report, is expected to record a 28.2% CAGR and reach US$78.0 Billion by the end of the analysis period. Growth in the 5D Interposer Packaging segment is estimated at 23.3% CAGR over the analysis period.

The U.S. Market is Estimated at US$12.2 Billion While China is Forecast to Grow at 35.8% CAGR

The 3D TSV and 2.5D market in the U.S. is estimated at US$12.2 Billion in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$47.0 Billion by the year 2030 trailing a CAGR of 35.8% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 21.8% and 24.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 22.9% CAGR.

Global 3D TSV and 2.5D Market – Key Trends & Drivers Summarized

How Are 3D TSV and 2.5D Packaging Redefining Semiconductor Integration?

The emergence of 3D Through-Silicon Via (TSV) and 2.5D integration technologies is reshaping the semiconductor landscape by offering innovative pathways to enhance performance, reduce power consumption, and minimize form factor in advanced chip designs. Unlike traditional packaging methods, 3D TSV enables vertical stacking of multiple dies using high-aspect-ratio vias etched through silicon wafers, significantly shortening interconnect lengths and allowing faster signal transmission. This vertical integration results in higher bandwidth, improved latency, and better power efficiency, all of which are critical for applications such as high-performance computing, artificial intelligence, and data center operations. On the other hand, 2.5D packaging provides an intermediate approach, where multiple dies are placed side-by-side on an interposer, offering improved performance over 2D packaging while addressing the thermal and yield challenges associated with full 3D stacking. These innovations support heterogeneous integration, allowing logic, memory, analog, and even photonic components to coexist in a compact, high-functionality module. Industries ranging from consumer electronics to aerospace are increasingly adopting these packaging architectures to meet the demand for miniaturization without compromising power or performance. The integration of High Bandwidth Memory (HBM) with logic chips using TSVs is a prime example, enabling data-intensive tasks such as neural network training and 3D rendering. As system-on-chip (SoC) complexity grows, the limitations of monolithic scaling have pushed the industry toward advanced packaging as a viable alternative to Moore’s Law. TSV and 2.5D solutions address signal integrity issues and support higher I/O density, thereby playing a central role in the continued evolution of semiconductors toward more intelligent, compact, and power-efficient architectures.

Why Are Tech Giants and Foundries Heavily Investing in 3D TSV and 2.5D Technologies?

The aggressive investments by semiconductor foundries, integrated device manufacturers, and tech giants in 3D TSV and 2.5D packaging technologies are rooted in the escalating need for faster, smaller, and more energy-efficient devices in a data-driven economy. These advanced packaging techniques offer clear performance advantages in terms of bandwidth scalability, power integrity, and form factor reduction, making them indispensable in next-generation chipsets for artificial intelligence, machine learning, graphics processing, and 5G infrastructure. Major players such as TSMC, Intel, Samsung, and ASE are allocating significant capital towards building and expanding facilities equipped to handle TSV etching, wafer bonding, and interposer fabrication, all of which require highly specialized and precise processes. These investments are also strategic responses to the growing demand for heterogeneous integration, where different functional units fabricated on separate process nodes are assembled into a single package for optimal performance and cost-efficiency. Cloud computing and edge devices are pushing for ever-smaller latencies and greater parallelism, both of which are enabled by the high-density interconnects made possible through TSVs and interposers. These technologies also offer significant cost advantages when used to combine smaller, function-specific chips rather than scaling up a single, monolithic die. The adoption of chiplet-based design methodologies, supported by TSV and 2.5D architectures, is further expanding the commercial feasibility of modular, high-performance computing platforms. Governments and defense agencies are also incentivizing domestic capabilities in advanced packaging, recognizing the strategic importance of securing next-generation semiconductor supply chains. Industry partnerships, joint ventures, and R&D collaborations are accelerating technical innovation and enabling production readiness at scale. As the ecosystem for materials, equipment, and skilled labor matures, the focus of investment is shifting from experimentation to full-fledged deployment, driven by both the technical superiority and the commercial viability of these packaging formats.

What Applications and Markets Are Accelerating Adoption of 3D TSV and 2.5D?

The accelerating adoption of 3D TSV and 2.5D technologies is closely tied to the explosive growth of high-performance applications that demand increased data throughput, lower latency, and tighter power envelopes. In data centers and cloud infrastructure, these technologies are used to create powerful processors and memory modules that support high-volume workloads such as AI training, real-time analytics, and virtualization. Graphics processing units (GPUs) and tensor processing units (TPUs) deployed in AI and gaming applications also benefit greatly from the high memory bandwidth and close coupling made possible by TSV-integrated HBM. In mobile and consumer electronics, TSV and 2.5D are enabling thinner, lighter, and more energy-efficient devices without sacrificing computing capability. The automotive industry is beginning to adopt these technologies to support the increasing electronic content in electric and autonomous vehicles, particularly in advanced driver assistance systems (ADAS) and infotainment units. Aerospace and defense are leveraging the reliability and compactness of 2.5D and 3D packaging for mission-critical applications where space, weight, and performance are tightly constrained. Medical devices and wearables are another emerging application area, with TSVs enabling the integration of powerful chips into small form factors for diagnostic, monitoring, and therapeutic functions. Additionally, the growing demand for edge computing devices, which require robust performance in decentralized and often constrained environments, is boosting interest in compact and efficient packaging solutions. Machine vision systems, IoT sensors, and industrial robotics are finding in TSV and 2.5D the ideal balance between processing power and spatial efficiency. The trend toward chiplet-based architectures, supported by these technologies, is also unlocking design flexibility, allowing manufacturers to rapidly prototype and customize solutions for niche markets. As these diverse sectors continue to converge on more data-intensive and AI-enabled functionalities, the adoption curve for 3D TSV and 2.5D packaging is expected to steepen, reinforcing their role as key enablers of future innovation across industries.

What Are the Key Drivers Fueling Growth in the 3D TSV and 2.5D Market?

The growth in the 3D TSV and 2.5D market is driven by several factors directly tied to evolving semiconductor design needs, changing consumer technology demands, and advancements in manufacturing capabilities. One major driver is the urgent need to overcome the limitations of traditional planar scaling as transistor miniaturization approaches physical and economic limits. 3D TSV and 2.5D integration provide alternative pathways to performance enhancement without the need for smaller nodes, offering higher I/O density, improved signal transmission, and reduced power loss. Another key factor is the rise of AI and high-performance computing workloads, which necessitate extremely high memory bandwidth and low latency, achievable through HBM integration via TSVs. The increasing reliance on heterogeneous computing, where multiple specialized cores or chiplets are integrated within a single package, is also accelerating the shift toward these advanced packaging formats. Furthermore, the proliferation of mobile devices, AR/VR headsets, and smart wearables is driving the demand for compact and energy-efficient chips that 3D TSV and 2.5D can deliver. The automotive sector’s push toward electrification and autonomy is creating demand for compact, high-reliability, thermally efficient chips suitable for in-vehicle computation. Advancements in fabrication processes, such as fine-pitch TSV etching, wafer thinning, and thermal interface materials, are making high-volume manufacturing of these packages more feasible and cost-effective. Industry standards and design tools have also matured, reducing integration complexity and enabling faster development cycles. Additionally, geopolitical efforts to localize semiconductor supply chains are fueling investments in advanced packaging facilities as part of national strategic initiatives. Collaborative efforts between chip designers, OSATs (Outsourced Semiconductor Assembly and Test), and EDA (Electronic Design Automation) tool providers are streamlining the path from concept to commercial deployment. Finally, the convergence of 5G, edge computing, and AI at scale is creating a sustained demand for more intelligent and integrated hardware solutions, solidifying 3D TSV and 2.5D technologies as foundational components in the next wave of semiconductor innovation.

SCOPE OF STUDY:

The report analyzes the 3D TSV and 2.5D market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Packaging Type (3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging, Other Packaging Types); End-User (Consumer Electronics End-User , Automotive End-User, High Performance Computing & Networking End-User, Other End-Users)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 42 Featured) -

• Advanced Semiconductor Engineering (ASE)
• Amkor Technology
• Applied Materials
• Brewer Science
• Chipbond Technology Corp.
• Deca Technologies
• EV Group (EVG)
• Fraunhofer IZM
• GLOBALFOUNDRIES
• Huawei HiSilicon
• Intel Corporation
• Lam Research
• Samsung Electronics
• SK hynix
• SÜSS MicroTec
• Taiwan Semiconductor Manufacturing Company (TSMC)
• Teledyne DALSA
• Texas Instruments
• Tokyo Electron Limited
• Xperi Inc. (includes Invensas)

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