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Semiconductor Lead Frame Market Size, Share, Growth and Global Industry Analysis By Type & Application, Regional Insights and Forecast to 2024-2032

Publisher Fortune Business Insights Pvt. Ltd.
Published Nov 01, 2024
Length 256 Pages
SKU # FOB19326507

Description

Semiconductor Lead Frame Market Size, Share, Growth and Global Industry Analysis By Type & Application, Regional Insights and Forecast to 2024-2032



Growth Factors of Semiconductor Lead Frame Market

The semiconductor lead frame market size was valued at USD 3.18 billion in 2021, and the market is now projected to grow from USD 3.33 billion in 2022 to USD 5.32 billion by 2029, exhibiting a CAGR of 6.9% during the forecast period of 2022-2029.

The disrupted supply chain and obstacles in the manufacturing process had hampered the semiconductor lead frame market growth. The increased raw material costs have created restrictions in the construction line due to transportation limitations. Product scarcity increased and the supply-demand gaps broadened and obstructed fabrication in COVID-19 pandemic. The imposition of a lockdown by the government has affected the manufacturing activities. It has disturbed the production processes.

The rising requirement of hardware has augmented semiconductor lead frame market share worldwide. The faster internet accessibility is highly attracting the end-users which are increasing demand for the electronic products consequently are boosting the market growth. The rising market penetration of consumer electronics due to digitization is propelling the market expansion.

The trend is growing demand for advanced packaging in small electronic solutions is boosting market growth. The evolution of 5G and advancement in network infrastructure is a requirement for the modern work culture. The rising adoption of equipment in electric vehicles due to advantages of integrating them with battery insulation and advanced cooling are boosting market growth.

Comprehensive Analysis of Semiconductor Lead Frame Market

The semiconductor lead frame market and semiconductor & electronics industry is rising at an exponential rate due to its market segmentation. This market expansion effectively presents a detailed regional assessment considering the dominant supply and demand forces that impact the semiconductor & electronics industry. These segmentations are methodically segregated by packaging type, application, and industry vertical. The packaging types include dual inline pin package, small out-line package, small outline transistor, quad flat pack, dual flat no-leads, quad flat no-leads, flip chip, and others. The applications are integrated circuit, discrete devices, and others. The industry verticals include consumer electronics, industrial and consumer electronics, industrial and commercial electronics, automotive, and others.

The Asia Pacific region is conducive to the global semiconductor lead frame market, leading to a recall of USD 1.52 billion owing to a strong supply chain of electronic devices and the rising circuits, discrete devices, and logic circuits across the region have given a push to the sales of electronic devices.

The top players in the market play a vital role in the semiconductor & electronics industry assuring industrial prospectus growth and setting market standards. These players include Haesungds (Korea), Mitsui High-tec, Inc. (Japan), Shinko Electric Industries Co., Ltd. (Japan), Chang Wah Technology Co., Ltd (China), ASMPT (Singapore), Ningbo Hualong Electronics Co., Ltd (China), Wuxi Huajing Leadframe Co., Ltd (China), QPL Limited (Hong Kong), SDI Group, Inc. (Taiwan), and Dynacraft Industries Sdn Bhd (Malaysia), these market players provide a level-playing competitive landscape.

In November 2021, Haesung Industrial Co., Ltd made a spending of worth USD 293 million in partnership with LT Precision Co., Ltd. Through this investment, they will add 370 new jobs in Changwon, Gyeongnam.

Segmentation Table

Global Semiconductor Lead Frame Market Scope

ATTRIBUTE

DETAILS

Study Period

2018-2029

Base Year

2021

Forecast Period

2022-2029

Historical Period

2018-2020

Unit

Value (USD Billion) and Volume (Million Units)

Segmentation

By Packaging Type, Application, Industry Vertical, and Region

By Packaging Type

DIP (Dual Inline Pin Package)

SOP (Small Out-Line Package)

SOT (Small Outline Transistor)

QFP (Quad Flat Pack)

DFN (Dual Flat No-Leads)

QFN (Quad Flat No-Leads)

FCF (Flip Chip)

Others

By Application

Integrated Circuit

Discrete Device

Others

By Industry Vertical

Consumer Electronics

Industrial and Commercial Electronics

Automotive

Others (Network and Communication)

By Region

North America (By Packaging Type, By Application, By Industry Vertical, By Country)

U.S. (By Industry Vertical)

Canada (By Industry Vertical)

Europe (By Packaging Type, By Application, By Industry Vertical, By Country)

Germany (By Industry Vertical)

U.K. (By Industry Vertical)

France (By Industry Vertical)

Italy (By Industry Vertical)

Russia (By Industry Vertical)

Rest of Europe

Asia Pacific (By Packaging Type, By Application, By Industry Vertical, By Country)

China (By Industry Vertical)

India (By Industry Vertical)

Japan (By Industry Vertical)

South Korea (By Industry Vertical)

Taiwan (By Industry Vertical)

Southeast Asia (By Industry Vertical)

Australia (By Industry Vertical)

Rest of Asia Pacific

Middle East & Africa (By Packaging Type, By Application, By Industry Vertical, By Country)

Turkey (By Industry Vertical)

Israel (By Industry Vertical)

GCC (By Industry Vertical)

North Africa (By Industry Vertical)

South Africa (By Industry Vertical)

Rest of Middle East & Africa

Latin America (By Packaging Type, By Application, By Industry Vertical, By Country)

Brazil (By Industry Vertical)

Mexico (By Industry Vertical)

Rest of Latin AmericaPlease Note: It will take 5-6 business days to complete the report upon order confirmation.

Table of Contents

256 Pages
1. Introduction
1.1. Definition, By Segment
1.2. Research Methodology/Approach
1.3. Data Sources
2. Executive Summary
3. Market Dynamics
3.1. Macro and Micro Economic Indicators
3.2. Drivers, Restraints, Opportunities and Trends
3.3. Impact of COVID-19
3.4. Supply Chain Analysis Semiconductor Lead Frame Market
3.5. Major Suppliers of Sourced Down Lead Frames
4. Competition Landscape
4.1. Business Strategies Adopted by Key Players
4.2. Consolidated SWOT Analysis of Key Players
4.3. Global Semiconductor Lead frame Key Players Market Share/Ranking, 2022
5. Global Semiconductor Lead Frame Key Market Indicators
5.1. Lead Frames for Source Down Packaging Technology
5.2. Technology of 100X300mm Size, with Etching Technology or Press Technology
5.3. Adhesion Improvement Technology between Mold Compound
6. Global Semiconductor Lead frame Market Size Estimates and Forecasts, By Segments, 2018-2029
6.1. Key Findings
6.2. By Packaging Type (USD Mn & Million Units)
6.2.1. DIP (Dual Inline Pin Package)
6.2.2. SOP (Small Out-Line Package)
6.2.3. SOT (Small Outline Transistor)
6.2.4. QFP (Quad Flat Pack)
6.2.5. DFN (Dual Flat No-Leads)
6.2.6. QFN (Quad Flat No-Leads)
6.2.7. FCF (Flip Chip)
6.2.8. Others
6.3. By Application (USD Mn & Million Units)
6.3.1. Integrated Circuit
6.3.2. Discrete Device
6.3.3. Others
6.4. By Industry Vertical (USD Mn & Million Units)
6.4.1. Consumer Electronics
6.4.2. Industrial and Commercial Electronics
6.4.3. Automotive
6.4.4. Others (Network and Communication)
6.5. By Country (USD Mn & Million Units)
6.5.1. North America
6.5.2. Europe
6.5.3. Asia Pacific
6.5.4. The Middle East & Africa
6.5.5. Latin America
7. North America Semiconductor Lead frame Market Size Estimates and Forecasts, By Segments, 2018-2029
7.1. Key Findings
7.2. By Packaging Type (USD Mn & Million Units)
7.2.1. DIP (Dual Inline Pin Package)
7.2.2. SOP (Small Out-Line Package)
7.2.3. SOT (Small Outline Transistor)
7.2.4. QFP (Quad Flat Pack)
7.2.5. DFN (Dual Flat No-Leads)
7.2.6. QFN (Quad Flat No-Leads)
7.2.7. FCF (Flip Chip)
7.2.8. Others
7.3. By Application (USD Mn & Million Units)
7.3.1. Integrated Circuit
7.3.2. Discrete Device
7.3.3. Others
7.4. By Industry Vertical (USD Mn & Million Units)
7.4.1. Consumer Electronics
7.4.2. Industrial and Commercial Electronics
7.4.3. Automotive
7.4.4. Others (Network and Communication)
7.5. By Country (USD Mn & Million Units)
7.5.1. United States
7.5.2. Canada
8. Europe Semiconductor Lead frame Market Size Estimates and Forecasts, By Segments, 2018-2029
8.1. Key Findings
8.2. By Packaging Type (USD Mn & Million Units)
8.2.1. DIP (Dual Inline Pin Package)
8.2.2. SOP (Small Out-Line Package)
8.2.3. SOT (Small Outline Transistor)
8.2.4. QFP (Quad Flat Pack)
8.2.5. DFN (Dual Flat No-Leads)
8.2.6. QFN (Quad Flat No-Leads)
8.2.7. FCF (Flip Chip)
8.2.8. Others
8.3. By Application (USD Mn & Million Units)
8.3.1. Integrated Circuit
8.3.2. Discrete Device
8.3.3. Others
8.4. By Industry Vertical (USD Mn & Million Units)
8.4.1. Consumer Electronics
8.4.2. Industrial and Commercial Electronics
8.4.3. Automotive
8.4.4. Others (Network and Communication)
8.5. By Country (USD Mn & Million Units)
8.5.1. Germany
8.5.2. United Kingdom
8.5.3. France
8.5.4. Italy
8.5.5. Russia
8.5.6. Rest of Europe
9. Asia Pacific Semiconductor Lead frame Market Size Estimates and Forecasts, By Segments, 2018-2029
9.1. Key Findings
9.2. By Packaging Type (USD Mn & Million Units)
9.2.1. DIP (Dual Inline Pin Package)
9.2.2. SOP (Small Out-Line Package)
9.2.3. SOT (Small Outline Transistor)
9.2.4. QFP (Quad Flat Pack)
9.2.5. DFN (Dual Flat No-Leads)
9.2.6. QFN (Quad Flat No-Leads)
9.2.7. FCF (Flip Chip)
9.2.8. Others
9.3. By Application (USD Mn & Million Units)
9.3.1. Integrated Circuit
9.3.2. Discrete Device
9.3.3. Others
9.4. By Industry Vertical (USD Mn & Million Units)
9.4.1. Consumer Electronics
9.4.2. Industrial and Commercial Electronics
9.4.3. Automotive
9.4.4. Others (Network and Communication)
9.5. By Country (USD Mn & Million Units)
9.5.1. China
9.5.2. India
9.5.3. Japan
9.5.4. South Korea
9.5.5. Taiwan
9.5.6. Southeast Asia
9.5.7. Australia
9.5.8. Rest of Asia Pacific
10. Middle East & Africa Semiconductor Lead frame Market Size Estimates and Forecasts, By Segments, 2018-2029
10.1. Key Findings
10.2. By Packaging Type (USD Mn & Million Units)
10.2.1. DIP (Dual Inline Pin Package)
10.2.2. SOP (Small Out-Line Package)
10.2.3. SOT (Small Outline Transistor)
10.2.4. QFP (Quad Flat Pack)
10.2.5. DFN (Dual Flat No-Leads)
10.2.6. QFN (Quad Flat No-Leads)
10.2.7. FCF (Flip Chip)
10.2.8. Others
10.3. By Application (USD Mn & Million Units)
10.3.1. Integrated Circuit
10.3.2. Discrete Device
10.3.3. Others
10.4. By Industry Vertical (USD Mn & Million Units)
10.4.1. Consumer Electronics
10.4.2. Industrial and Commercial Electronics
10.4.3. Automotive
10.4.4. Others (Network and Communication)
10.5. By Country (USD Mn & Million Units)
10.5.1. Turkey
10.5.2. Israel
10.5.3. GCC
10.5.4. North Africa
10.5.5. South Africa
10.5.6. Rest of MEA
11. Latin America Semiconductor Lead frame Market Size Estimates and Forecasts, By Segments, 2018-2029
11.1. Key Findings
11.2. By Packaging Type (USD Mn & Million Units)
11.2.1. DIP (Dual Inline Pin Package)
11.2.2. SOP (Small Out-Line Package)
11.2.3. SOT (Small Outline Transistor)
11.2.4. QFP (Quad Flat Pack)
11.2.5. DFN (Dual Flat No-Leads)
11.2.6. QFN (Quad Flat No-Leads)
11.2.7. FCF (Flip Chip)
11.2.8. Others
11.3. By Application (USD Mn & Million Units)
11.3.1. Integrated Circuit
11.3.2. Discrete Device
11.3.3. Others
11.4. By Industry Vertical (USD Mn & Million Units)
11.4.1. Consumer Electronics
11.4.2. Industrial and Commercial Electronics
11.4.3. Automotive
11.4.4. Others (Network and Communication)
11.5. By Country (USD Mn & Million Units)
11.5.1. Brazil
11.5.2. Mexico
11.5.3. Rest of Latin America
12. Company Profiles for Top 10 Players (Based on data availability in public domain and/or on paid databases)
12.1. Mitsui High-tec, Inc.
12.1.1. Overview
12.1.1.1. Key Management
12.1.1.2. Headquarters
12.1.1.3. Offerings/Business Segments
12.1.2. Key Details (Key details are consolidated data and not product/service specific)
12.1.2.1. Employee Size
12.1.2.2. Past and Current Revenue
12.1.2.3. Geographical Share
12.1.2.4. Business Segment Share
12.1.2.5. Recent Developments
12.2. Shinko electric industries co., Ltd.
12.2.1. Overview
12.2.1.1. Key Management
12.2.1.2. Headquarters
12.2.1.3. Offerings/Business Segments
12.2.2. Key Details (Key details are consolidated data and not product/service specific)
12.2.2.1. Employee Size
12.2.2.2. Past and Current Revenue
12.2.2.3. Geographical Share
12.2.2.4. Business Segment Share
12.2.2.5. Recent Developments
12.3. Chang Wah Technology Co., Ltd.
12.3.1. Overview
12.3.1.1. Key Management
12.3.1.2. Headquarters
12.3.1.3. Offerings/Business Segments
12.3.2. Key Details (Key details are consolidated data and not product/service specific)
12.3.2.1. Employee Size
12.3.2.2. Past and Current Revenue
12.3.2.3. Geographical Share
12.3.2.4. Business Segment Share
12.3.2.5. Recent Developments
12.4. Haesungds
12.4.1. Overview
12.4.1.1. Key Management
12.4.1.2. Headquarters
12.4.1.3. Offerings/Business Segments
12.4.2. Key Details (Key details are consolidated data and not product/service specific)
12.4.2.1. Employee Size
12.4.2.2. Past and Current Revenue
12.4.2.3. Geographical Share
12.4.2.4. Business Segment Share
12.4.2.5. Recent Developments
12.5. ASMPT
12.5.1. Overview
12.5.1.1. Key Management
12.5.1.2. Headquarters
12.5.1.3. Offerings/Business Segments
12.5.2. Key Details (Key details are consolidated data and not product/service specific)
12.5.2.1. Employee Size
12.5.2.2. Past and Current Revenue
12.5.2.3. Geographical Share
12.5.2.4. Business Segment Share
12.5.2.5. Recent Developments
12.6. Ningbo Hualong Electronics Co.,Ltd.
12.6.1. Overview
12.6.1.1. Key Management
12.6.1.2. Headquarters
12.6.1.3. Offerings/Business Segments
12.6.2. Key Details (Key details are consolidated data and not product/service specific)
12.6.2.1. Employee Size
12.6.2.2. Past and Current Revenue
12.6.2.3. Geographical Share
12.6.2.4. Business Segment Share
12.6.2.5. Recent Developments
12.7. QPL Limited
12.7.1. Overview
12.7.1.1. Key Management
12.7.1.2. Headquarters
12.7.1.3. Offerings/Business Segments
12.7.2. Key Details (Key details are consolidated data and not product/service specific)
12.7.2.1. Employee Size
12.7.2.2. Past and Current Revenue
12.7.2.3. Geographical Share
12.7.2.4. Business Segment Share
12.7.2.5. Recent Developments
12.8. Wuxi Huajing Leadframe Co.,Ltd.
12.8.1. Overview
12.8.1.1. Key Management
12.8.1.2. Headquarters
12.8.1.3. Offerings/Business Segments
12.8.2. Key Details (Key details are consolidated data and not product/service specific)
12.8.2.1. Employee Size
12.8.2.2. Past and Current Revenue
12.8.2.3. Geographical Share
12.8.2.4. Business Segment Share
12.8.2.5. Recent Developments
12.9. SDI Group, Inc.
12.9.1. Overview
12.9.1.1. Key Management
12.9.1.2. Headquarters
12.9.1.3. Offerings/Business Segments
12.9.2. Key Details (Key details are consolidated data and not product/service specific)
12.9.2.1. Employee Size
12.9.2.2. Past and Current Revenue
12.9.2.3. Geographical Share
12.9.2.4. Business Segment Share
12.9.2.5. Recent Developments
12.10. Dynacraft Industries Sdn Bhd
12.10.1. Overview
12.10.1.1. Key Management
12.10.1.2. Headquarters
12.10.1.3. Offerings/Business Segments
12.10.2. Key Details (Key details are consolidated data and not product/service specific)
12.10.2.1. Employee Size
12.10.2.2. Past and Current Revenue
12.10.2.3. Geographical Share
12.10.2.4. Business Segment Share
12.10.2.5. Recent Developments

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